Reference Thermal Mechanical Solution; Height Restrictions - Intel Celeron D Thermal Design Manual

775-land lga package for embedded applications
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Figure 13. 2U Height Restrictions
5.5

Reference Thermal Mechanical Solution

For information regarding the Intel Thermal/Mechanical Reference Design thermal solution and
design criteria for the ATX form factor, refer to the Intel Pentium 4 Processor on 90nm Process in
the 775-Land LGA Package Thermal Design Guidelines.
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D Processor in the 775-Land LGA Package Thermal Design Guide35
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