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Case Temperature Reference Methodology
7. Lift the wire at the middle of groove with tweezers and bend the front of wire to place the
thermocouple in the channel ensuring the tip is in contact with the end of the channel grooved
in the IHS
Figure 24. Thermocouple Bead Placement (View 1)
Figure 25. Thermocouple Bead Placement (View 2)
8. Place the TTV under the microscope unit (similar to the one used in
with process. It is also recommended to use a fixture (like processor tray or a plate) to help
holding the unit in place for the rest of the attach process.
9. Press the wire down about 6mm [0.125"] from the thermocouple bead using the tweezers.
Look in the microscope to perform this task. Place a piece of Kapton* tape to hold the wire
inside the groove
Intel
52
(Figure 24
and
Figure
(Figure
26). Refer to
®
®
Celeron
D Processor in the 775-Land LGA Package Thermal Design Guide
25).
Figure 27
for detailed bead placement.
Figure
29) to continue
Order #303730
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