Table of Contents
Advertisement
•
Ensuring system electrical, thermal, and structural integrity under shock and vibration events.
The mechanical requirements of the heatsink attach mechanism depend on the weight of the
heatsink and the level of shock and vibration that the system must support. The overall
structural design of the motherboard and the system have to be considered when designing the
heatsink attach mechanism. Their design should provide a means for protecting LGA775
socket solder joints.
Note: Package pull-out during mechanical shock and vibration is constrained by the LGA775 socket load
plate (refer to the LGA775 Socket Mechanical Design Guide for further information).
2.1.2.2
Heatsink Clip Load Requirement
The attach mechanism for the heatsink developed to support the Celeron D processor in the
775-land LGA package should create a static load on the package between 18 lbf and 70 lbf
throughout the life of the product.
This load is required to ensure protect against fatigue failure of socket solder joint for a platform
seven year life.
2.1.2.3
Additional Guidelines
In addition to the general guidelines given above, the heatsink attach mechanism for the Celeron D
processor in the 775-land LGA package should be designed to the following guidelines:
•
Holds the heatsink in place under mechanical shock and vibration events and applies force to
the heatsink base to maintain desired pressure on the thermal interface material. Note that the
load applied by the heatsink attach mechanism must comply with the package specifications
described in the processor datasheet. One of the key design parameters is the height of the top
surface of the processor IHS above the motherboard. The IHS height from the top of board is
expected to vary from 7.517 mm to 8.167 mm. This data is provided for information only, and
should be derived from:
— The height of the socket seating plane above the motherboard after reflow, given in the
LGA775 Socket Mechanical Design Guide with its tolerances.
— The height of the package, from the package seating plane to the top of the IHS, and
accounting for its nominal variation and tolerances that are given in the corresponding
processor datasheet.
•
Engages easily, and if possible, without the use of special tools. In general, the heatsink is
assumed to be installed after the motherboard has been installed into the chassis.
•
Minimizes contact with the motherboard surface during installation and actuation to avoid
scratching the motherboard.
2.2
Thermal Requirements
Refer to the processor datasheet for the processor thermal specifications. The majority of processor
power is dissipated through the IHS. There are no additional components (e.g., BSRAMs) that
generate heat in this package. The amount of power that can be dissipated as heat through the
processor package substrate and into the socket is usually minimal.
®
®
Intel
Celeron
D Processor in the 775-Land LGA Package Thermal Design Guide11
303730
Order #
Processor Thermal/Mechanical Information
Advertisement
Table of Contents
