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LGA775 Socket Heatsink Loading
This board deflection metric provides guidance for mechanical designs that differ from the
reference design for ATX/µATX form factor.
A.2.2
Board Deflection Metric Definition
Board deflection is measured along either diagonal (refer to
d = dmax – (d1 + d2)/2
d' = dmax – (d'1 + d'2)/2
Configurations in which the deflection is measured are defined in
To measure board deflection, follow industry-standard procedures such as IPC for board deflection
measurement. Height gauges and possibly dial gauges may also be used.
Table 6.
Board Deflection Configuration Definitions
Configuration
Parameter
d_ref
d_BOL
d_EOL
Figure 14. Board Deflection Definition
Intel
38
Processor + Socket
load plate
Yes
Yes
Yes
d1
d'2
®
®
Celeron
D Processor in the 775-Land LGA Package Thermal Design Guide
Figure
14):
Table
Heatsink
No
Beginning of Life (BOL) deflection, no preload
Yes
BOL deflection with preload
Yes
End of Life (EOL) deflection
d'1
d2
6.
Parameter Name
Order #303730
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