Case Temperature Reference Methodology; Definitions; Supporting Test Equipment - Intel Celeron D Thermal Design Manual

775-land lga package for embedded applications

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Table Of Contents

Table of Contents

Appendix D Case Temperature Reference

Methodology

D.10

Objective and Scope

This appendix defines a reference procedure for attaching a thermocouple to the IHS of an

FC-LGA4 processor package for T

features of the FC-LGA4 package and of the LGA775 socket for which it is intended.

It describes the recommended equipment for the reference thermocouple installation, including

tools and adhesive part numbers.

D.11

Definitions

Definitions of common acronyms used in this appendix are given in the table below:

Table 8.

Definitions

Term

TTV

IPA

DMM

IHS

D.12

Supporting Test Equipment

To apply the reference thermocouple attach procedure, it is recommended to use the equipment (or

equivalent) given in the table below.

Table 9.

Supporting Test Equipment (Sheet 1 of 2)

Item

Microscope

DMM

Micromanipulator

(See Note below)

Loctite* 498 Adhesive

Adhesive Accelerator

Kapton* Tape

Intel

Celeron

D Processor in the 775-Land LGA Package Thermal Design Guide47

303730

Order #

measurement. This procedure takes into account the specific

Definition

Thermal Test Vehicle

Isopropyl Alcohol

Digital Multi Meter

Integrated Heat Spreader

Measurement and Output

Olympus* Light microscope or equivalent

Digital Multi Meter for resistance measurement

Test Fixture(s

Micromanipulator set from YOU* Ltd. or equivalent.

Mechanical 3D arm with needle (not included) to maintain TC

bead location during the attach process.

Miscellaneous Hardware

Super glue w/thermal characteristics

Loctite* 7452 for fast glue curing

For holding thermocouple in place