Intel Celeron D Thermal Design Manual page 53

775-land lga package for embedded applications
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Figure 26. Position Bead on Groove Step
Kapton* tape
Figure 27. Detailed Thermocouple Bead Placement
10. Using the micromanipulator, install the needle near to the end of groove on top of
thermocouple. Using the X, Y & Z axes on the arm place the tip of needle on top of the
thermocouple bead. Press down until the bead is seated at the end of groove on top of the step
(see
Figure 27
®
®
Intel
Celeron
D Processor in the 775-Land LGA Package Thermal Design Guide53
303730
Order #
and
Figure
28).
Case Temperature Reference Methodology
Wire section into
the groove to
prepare for final
bead placement

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