Intel Celeron D Thermal Design Manual page 54

Case Temperature Reference Methodology
Figure 28. Using 3D Micromanipulator to Secure Bead Location
11. Measure resistance from thermocouple end wires (hold both wires to a DMM probe) to the
IHS surface. This should be the same value as measured during the thermocouple conditioning
step (Figure
Figure 29. Measuring Resistance between Thermocouple and IHS
12. Place a small amount of Loctite* 498 adhesive in the groove where the bead is installed. Using
a fine point device, spread the adhesive in the groove around the needle, the thermocouple
bead and the thermocouple wires already installed in the groove during Step 5 above. Be
careful not to move the thermocouple bead during this step
Intel
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29).
® ®
Celeron D Processor in the 775-Land LGA Package Thermal Design Guide
(Figure 30).
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