Table Of Contents - Intel Celeron D Thermal Design Manual

Contents
1.0 Introduction.................................................................................................................................... 6
1.1 Document Goals and Scope ................................................................................................. 6
1.1.1 Importance of Thermal Management....................................................................... 6
1.1.2 Document Goals ...................................................................................................... 6
1.1.3 Document Scope ..................................................................................................... 6
1.2 References ........................................................................................................................... 7
1.3 Terms and Definitions........................................................................................................... 7
2.0 Processor Thermal/Mechanical Information ............................................................................... 9
2.1 Mechanical Requirements .................................................................................................... 9
2.1.1 Processor Package.................................................................................................. 9
2.1.2 Heatsink Attach...................................................................................................... 10
2.1.2.1
2.1.2.2
2.1.2.3
2.2 Thermal Requirements ....................................................................................................... 11
2.2.1 Processor Case Temperature and Power Dissipation ........................................... 12
2.2.2 Thermal Profile ...................................................................................................... 12
2.2.3 T
CONTROL
2.3 Heatsink Design Considerations......................................................................................... 14
2.3.1 Heatsink Size ......................................................................................................... 15
2.3.2 Heatsink Mass ....................................................................................................... 15
2.3.3 Package IHS Flatness ........................................................................................... 15
2.3.4 Thermal Interface Material ..................................................................................... 16
2.3.5 Summary ............................................................................................................... 16
2.4 System Thermal Solution Considerations........................................................................... 16
2.4.1 Improving Chassis Thermal Performance.............................................................. 16
3.0 Thermal Metrology ...................................................................................................................... 18
3.1 Characterizing Cooling Performance Requirements .......................................................... 18
3.1.1 Example ................................................................................................................. 19
3.2 Processor Thermal Solution Performance Assessment ..................................................... 20
3.3 Local Ambient Temperature Measurement Guidelines ...................................................... 20
3.3.1 Measuring Active Heatsinks .................................................................................. 20
3.3.2 Measuring Passive Heatsinks................................................................................ 21
3.4 Processor Case Temperature Measurement Guidelines....................................................22
4.0 Thermal Management Logic and Thermal Monitor .................................................................. 23
4.1 Processor Power Dissipation ..............................................................................................23
4.2 Thermal Monitor Implementation ........................................................................................ 23
4.2.1 PROCHOT# Signal ................................................................................................ 23
4.2.2 Thermal Control Circuit .......................................................................................... 24
4.2.3 Operation and Configuration.................................................................................. 25
4.2.4 On-Demand Mode ................................................................................................. 25
4.2.5 System Considerations .......................................................................................... 26
4.2.6 Operating System and Application Software Considerations ................................ 26
4.2.7 On-Die Thermal Diode ........................................................................................... 26
® ®
Intel Celeron D Processor in the 775-Land LGA Package Thermal Design Guide
303730
Order #
General Guidelines ................................................................................ 10
Heatsink Clip Load Requirement ........................................................... 11
Additional Guidelines ............................................................................. 11
............................................................................................................... 13
Contents
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