Introduction; Document Goals And Scope; Importance Of Thermal Management; Document Goals - Intel Celeron D Thermal Design Manual

Introduction

1.0 Introduction
1.1

Document Goals and Scope

1.1.1

Importance of Thermal Management

The objective of thermal management is to ensure that the temperatures of all components in a
system are maintained within their functional temperature range. Within this temperature range, a
component is expected to meet its specified performance. Operation outside the functional
temperature range can degrade system performance, cause logic errors or cause component and/or
system damage. Temperatures exceeding the maximum operating limit of a component may result
in irreversible changes in the operating characteristics of this component.
In a system environment, the processor temperature is a function of both system and component
thermal characteristics. The system level thermal constraints consist of the local ambient air
temperature and airflow over the processor as well as the physical constraints at and above the
processor. The processor temperature depends in particular on the component power dissipation,
the processor package thermal characteristics, and the processor thermal solution.
All of these parameters are affected by the continued push of technology to increase processor
performance levels (higher operating speeds, GHz) and packaging density (more transistors). As
operating frequencies increase and packaging size decreases, the power density increases while the
thermal solution space and airflow typically become more constrained or remains the same within
the system. The result is an increased importance on system design to ensure that thermal design
requirements are met for each component, including the processor, in the system.
1.1.2

Document Goals

Depending on the type of system and chassis characteristics, new system and component designs
may be required to provide adequate cooling for the processor. The goal of this Thermal Design
Guide is to provide an understanding of these thermal characteristics and discuss guidelines for
meeting the thermal requirements imposed on single processor systems for the Intel
Processor in the 775-Land LGA Package for Embedded Applications. The specifications for this
processor (also referred to herein as the Intel Celeron D Processor in the 775-Land LGA Package)
are delineated in the Intel
1.1.3

Document Scope

This document discusses the thermal management techniques for the Intel Celeron D Processor in
the 775-Land Package.
The processor physical dimensions and thermal specifications used in this document are for
illustration only. Refer to the Intel Celeron D Processor in the 775-Land Package Datasheet for
product dimensions, thermal power dissipation and maximum case temperature. In case of conflict,
the datasheet supersedes this document.
Intel
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Celeron
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Celeron D Processor in the 775-Land LGA Package Thermal Design Guide
D Processor in the 775-Land LGA Package Datasheet.
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Celeron D
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