Intel Celeron D Thermal Design Manual page 51

775-land lga package for embedded applications
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D.15
Thermocouple Attach Procedure
D.15.1
Thermocouple Conditioning and Preparation
1. Use a calibrated thermocouple as specified in
2. Measure the thermocouple resistance by holding both wires on one probe and the tip of the
thermocouple to the other probe of the DMM. The measurement should be about~75 ohms for
40-gauge type T thermocouple.
3. Straighten the wire for about 38 mm [1½ inch] from the bead to place it inside the channel.
4. Bend the tip of the thermocouple at approximately 45 degree angle by about 0.8 mm [.030
inch] from the tip
Figure 22. Bending the Tip of the Thermocouple
D.15.2
Thermocouple Attachment to the IHS
5. Clean groove with IPA and a lint free cloth removing all residues prior to thermocouple
attachment.
6. Place the thermocouple wire inside the groove; letting the exposed wire and bead extend about
3.2 mm [.125 inch] past the end of groove. Secure it with Kapton* tape
Figure 23. Securing Thermocouple Wires with Kapton* Tape Prior to Attach
®
®
Intel
Celeron
D Processor in the 775-Land LGA Package Thermal Design Guide51
303730
Order #
Case Temperature Reference Methodology
(Figure
22).
Section D.12
and
Section
D.13.
(Figure
23).

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