Mechanical Drawings; Atx/Μatx Motherboard Keep-Out Footprint Definition And Height Restrictions; Atx/Μatx Motherboard Keep-Out Footprint Definition And Height Restrictions For Enabling Components, Sheet 2; 2U Motherboard Component Keep-In Definition, Primary Side - Intel Celeron D Thermal Design Manual

775-land lga package for embedded applications
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Mechanical Drawings

Appendix F Mechanical Drawings
The following table lists the mechanical drawings included in this appendix. These drawings refer
to the reference thermal mechanical enabling components for the Intel Celeron D Processor in the
775-Land LGA Package.
Note: Intel reserves the right to make changes and modifications to the design as necessary.
Table 10. Mechanical Drawings
ATX/µATX Motherboard Keep-Out Footprint Definition and Height
Restrictions for Enabling Components, Sheet 1
ATX/µATX Motherboard Keep-Out Footprint Definition and Height
Restrictions for Enabling Components, Sheet 2
ATX/µATX Motherboard Keep-Out Footprint Definition and Height
Restrictions for Enabling Components, Sheet 3
1U/2U Motherboard Component Keep-In Definition, Primary Side
1U/2U Motherboard Component Keep-In Definition, Secondary Side
Intel
58
Drawing Description
®
®
Celeron
D Processor in the 775-Land LGA Package Thermal Design Guide
Page
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Order #303730

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