Intel Celeron D Thermal Design Manual page 5

19 FC-LGA4 Package Reference Groove Drawing ......................................................................... 49
20 IHS Reference Groove on the FC-LGA4 Package ..................................................................... 50
21 IHS Groove Orientation Relative to the LGA775 Socket ............................................................ 50
22 Bending the Tip of the Thermocouple......................................................................................... 51
23 Securing Thermocouple Wires with Kapton* Tape Prior to Attach ............................................. 51
24 Thermocouple Bead Placement (View 1) ................................................................................... 52
25 Thermocouple Bead Placement (View 2) ................................................................................... 52
26 Position Bead on Groove Step ................................................................................................... 53
27 Detailed Thermocouple Bead Placement ................................................................................... 53
28 Using 3D Micromanipulator to Secure Bead Location ................................................................ 54
29 Measuring Resistance between Thermocouple and IHS............................................................ 54
30 Applying the Adhesive on the Thermocouple Bead.................................................................... 55
31 Thermocouple Wire Management in the Groove........................................................................ 55
32 Removing Excess Adhesive from IHS ........................................................................................ 56
33 Filling the Groove with Adhesive ................................................................................................ 56
34 ATX/µATX Motherboard Keep-Out Footprint Definition and Height Restrictions
for Enabling Components, Sheet 1............................................................................................. 59
35 ATX/µATX Motherboard Keep-Out Footprint Definition and Height Restrictions
for Enabling Components, Sheet 2............................................................................................. 60
36 ATX/µATX Motherboard Keep-Out Footprint Definition and Height Restrictions
for Enabling Components, Sheet 3............................................................................................. 61
37 1U/2U Motherboard Component Keep-In Definition, Primary Side ............................................ 62
38 1U/2U Motherboard Component Keep-In Definition, Secondary Side........................................ 63
Tables
1 Reference Documents .................................................................................................................. 7
2 Terms and Definitions................................................................................................................... 7
3 Thermal Diode Interface ............................................................................................................. 27
4 Thermal Characterization Parameter at Various TLA Levels ..................................................... 30
5 Enabled Thermal Solutions......................................................................................................... 31
6 Board Deflection Configuration Definitions ................................................................................. 38
7 Typical Test Equipment .............................................................................................................. 44
8 Definitions ................................................................................................................................... 47
9 Supporting Test Equipment ........................................................................................................ 47
10 Mechanical Drawings.................................................................................................................. 58
11 Intel Reference Component Thermal Solution Provider ............................................................. 64
Revision History
Date
July 2005
September 2004
® ®
Intel Celeron D Processor in the 775-Land LGA Package Thermal Design Guide
303730
Order #
Revision
002 Updated Table 1 and Table 4.
001 Changes to branding. First public release.
Contents
Description
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