Intel Celeron D Thermal Design Manual page 8

Introduction
Table 2. Terms and Definitions (Sheet 2 of 2)
TIM
P
MAX
TDP
IHS
LGA775 Socket
ACPI
Bypass
FMB
Thermal Monitor
TCC
T
DIODE
FSC
T
CONTROL_BASE
T
CONTROL_OFFSET
T
CONTROL
PWM
Health Monitor
Component
U
Intel
8
Thermal Interface Material: The thermally conductive compound between the heatsink
and the processor case. This material fills the air gaps and voids, and enhances the
transfer of the heat from the processor case to the heatsink.
The maximum power dissipated by a semiconductor component.
Thermal Design Power: a power dissipation target based on worst-case applications.
Thermal solutions should be designed to dissipate the thermal design power.
Integrated Heat Spreader: a thermally conductive lid integrated into a processor
package to improve heat transfer to a thermal solution through heat spreading.
The surface mount socket designed to accept the Intel Celeron D Processor in the
775-Land LGA Package.
Advanced Configuration and Power Interface.
Bypass is the area between a passive heatsink and any object that can act to form a
duct. For this example, it can be expressed as a dimension away from the outside
dimension of the fins to the nearest surface.
Flexible Motherboard Guideline: an estimate of the maximum value of a processor
specification over certain time periods. System designers should meet the FMB values
to ensure their systems are compatible with future processor releases. FMB1 and FMB2
are sequential estimates of processor specifications over time.
A feature on the Intel Celeron D Processor in the 775-Land LGA Package that attempts
to keep the processor's die temperature within factory specifications.
Thermal Control Circuit: Thermal Monitor uses the TCC to reduce die temperature by
lowering effective processor frequency when the die temperature is very near its
operating limits.
Temperature reported from the on-die thermal diode.
Fan Speed Control: Thermal solution that includes a variable fan speed which is driven
by a PWM signal and uses the on-die thermal diode as a reference to change the duty
cycle of the PWM signal.
Constant from the processor EMTS that is added to the
T
in the value for
CONTROL
Value read by the BIOS from a processor MSR and added to the
results in the value for
T is the specification limit for use with the on-die thermal diode.
CONTROL
Pulse width modulation is a method of controlling a variable speed fan. The enabled 4
wire fans use the PWM duty cycle % from the fan speed controller to modulate the fan
speed.
Any standalone or integrated component that is capable of reading the processor
temperature and providing the PWM signal to the 4 pin fan header.
A unit of measure used to define server rack spacing height. 1U is equal to 1.75 inches,
2U equals 3.50 inches, etc.
® ®
Celeron D Processor in the 775-Land LGA Package Thermal Design Guide
T
CONTROL
T
that results
CONTROL_OFFSET
T
that
CONTROL_BASE
Order #303730