Thermal Characteristics; Table 70. Thermal Characteristics; Figure 38. Thermal Resistance Suffix 6 - STMicroelectronics STM32L162RC Manual

Package information
7.4

Thermal characteristics

The maximum chip-junction temperature, T
using the following equation:
T max = T
J
Where:
• max is the maximum ambient temperature in ° C,
T
A
• Θ
JA
•
P max is the sum of P
D
•
P
INT
internal power.
P max represents the maximum power dissipation on output pins where:
I/O
P
I/O
taking into account the actual V
application.
Symbol
Θ
JA
114/123
max + (P max × Θ
A D
is the package junction-to-ambient thermal resistance, in ° C/W,
INT
max is the product of I
max = Σ (V ) + Σ((V
× I
OL OL

Table 70. Thermal characteristics

Thermal resistance junction-ambient
UFBGA100 - 7 x 7 mm
Thermal resistance junction-ambient
LQFP100 - 14 x 14 mm / 0.5 mm pitch
Thermal resistance junction-ambient
LQFP64 - 10 x 10 mm / 0.5 mm pitch

Figure 38. Thermal resistance suffix 6

DocID022881 Rev 10
max, in degrees Celsius, may be calculated
J
)
JA
max and P max (P
I/O D
and V , expressed in Watts. This is the maximum chip
DD DD
– V ) × I ),
DD OH OH
/ I and V / I
OL OL OH OH
Parameter
STM32L162VC, STM32L162RC
max = P max + P
INT
of the I/Os at low and high level in the
Value
59
43
46
max),
I/O
Unit
°C/W