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Ultra-low-power 32-bit MCU ARM-based Cortex
128KB Flash, 16KB SRAM, 4KB EEPROM, LCD, USB, ADC, DAC
Features
• Ultra-low-power platform
– 1.65 V to 3.6 V power supply
– -40°C to 85°C/105°C temperature range
– 0.3 µA Standby mode (3 wakeup pins)
– 0.9 µA Standby mode + RTC
– 0.57 µA Stop mode (16 wakeup lines)
– 1.2 µA Stop mode + RTC
– 9 µA Low-power Run mode
– 214 µA/MHz Run mode
– 10 nA ultra-low I/O leakage
– < 8 µs wakeup time
®
• Core: ARM
Cortex
– From 32 kHz up to 32 MHz max
– 1.25 DMIPS/MHz (Dhrystone 2.1)
– Memory protection unit
• Reset and supply management
– Ultra-safe, low-power BOR (brownout reset)
with 5 selectable thresholds
– Ultra-low-power POR/PDR
– Programmable voltage detector (PVD)
• Clock sources
– 1 to 24 MHz crystal oscillator
– 32 kHz oscillator for RTC with calibration
– High Speed Internal 16 MHz factory-trimmed
RC (+/- 1%)
– Internal Low Power 37 kHz RC
– Internal multispeed low-power 65 kHz to
4.2 MHz
– PLL for CPU clock and USB (48 MHz)
• Pre-programmed bootloader
– USART supported
• Development support
– Serial wire debug supported
– JTAG and trace supported
• Up to 83 fast I/Os (73 I/Os 5V tolerant), all
mappable on 16 external interrupt vectors
• Memories
– Up to 128 KB Flash with ECC
– Up to 16 KB RAM
– Up to 4 KB of true EEPROM with ECC
July 2014
This is information on a product in full production.
®
-M3 32-bit CPU
DocID17659 Rev 10
STM32L15xx6/8/B
BGA100 7 × 7 mm
LQFP100 14 × 14 mm
BGA64 5 × 5 mm
m
LQFP64 10 × 10
m
LQFP48 7 × 7 mm
– 80 Byte Backup Register
• LCD Driver for up to 8x40 segments
– Support contrast adjustment
– Support blinking mode
– Step-up converter on board
• Rich analog peripherals (down to 1.8 V)
– 12-bit ADC 1 Msps up to 24 channels
– 12-bit DAC 2 channels with output buffers
– 2x Ultra-low-power-comparators
(window mode and wake up capability)
• DMA controller 7x channels
• 8x peripherals communication interface
– 1x USB 2.0 (internal 48 MHz PLL)
– 3x USART (ISO 7816, IrDA)
– 2x SPI 16 Mbits/s
– 2x I2C (SMBus/PMBus)
• 10x timers: 6x 16-bit with up to 4 IC/OC/PWM
channels, 2x 16-bit basic timer, 2x watchdog
timers (independent and window)
• Up to 20 capacitive sensing channels
supporting touchkey, linear and rotary touch
sensors
• CRC calculation unit, 96-bit unique ID
Table 1. Device summary
Reference
STM32L151CB, STM32L151C8,
STM32L151C6, STM32L151RB,
STM32L151x6/8/B
STM32L151R8, STM32L151R6,
STM32L151VB, STM32L151V8
STM32L152CB, STM32L152C8,
STM32L152C6, STM32L152RB,
STM32L152x6/.8/B
STM32L152R8, STM32L152R6,
STM32L152VB, STM32L152V8
®
-M3,
-
Datasheet
production data
UFQFPN48
7 × 7 mm
Part number
www.st.com
1/129
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Related Manuals for STMicroelectronics STM32L151CB
Summary of Contents for STMicroelectronics STM32L151CB
-
Page 1: Table 1. Device Summary
• Pre-programmed bootloader Table 1. Device summary – USART supported Reference Part number • Development support STM32L151CB, STM32L151C8, – Serial wire debug supported STM32L151C6, STM32L151RB, – JTAG and trace supported STM32L151x6/8/B STM32L151R8, STM32L151R6, • Up to 83 fast I/Os (73 I/Os 5V tolerant), all... -
Page 2: Table Of Contents
Contents STM32L151x6/8/B, STM32L152x6/8/B Contents Introduction ..........8 Description . - Page 3 STM32L151x6/8/B, STM32L152x6/8/B Contents 3.15.1 General-purpose timers (TIM2, TIM3, TIM4, TIM9, TIM10 and TIM11) . 27 3.15.2 Basic timers (TIM6 and TIM7) ....... . 27 3.15.3 SysTick timer .
- Page 4 Contents STM32L151x6/8/B, STM32L152x6/8/B 6.3.9 Memory characteristics ........76 6.3.10 EMC characteristics .
- Page 5 STM32L151x6/8/B, STM32L152x6/8/B List of tables List of tables Table 1. Device summary ............1 Table 2.
- Page 6 List of tables STM32L151x6/8/B, STM32L152x6/8/B Table 49. SPI characteristics ............88 Table 50.
- Page 7 STM32L151x6/8/B, STM32L152x6/8/B List of figures List of figures Figure 1. Ultralow power STM32L15xx6/8/B block diagram ....... 12 Figure 2.
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Page 8: Introduction
This STM32L151x6/8/B and STM32L152x6/8/B datasheet should be read in conjunction with the STM32L1xxxx reference manual (RM0038). The document "Getting started with STM32L1xxx hardware development” AN3216 gives a hardware implementation overview. Both documents are available from the STMicroelectronics website www.st.com. ® ® For information on the Cortex... -
Page 9: Description
STM32L151x6/8/B, STM32L152x6/8/B Description Description The ultralow power STM32L15xx6/8/B incorporates the connectivity power of the universal ® ® serial bus (USB) with the high-performance ARM Cortex -M3 32-bit RISC core operating at 32 MHz frequency (33.3 DMIPS), a memory protection unit (MPU), high-speed embedded memories (Flash memory up to 128 Kbytes and RAM up to 16 Kbytes) and an extensive range of enhanced I/Os and peripherals connected to two APB buses. -
Page 10: Device Overview
Description STM32L151x6/8/B, STM32L152x6/8/B Device overview Table 2. Ultralow power STM32L15xx6/8/B device features and peripheral counts Peripheral STM32L15xCx STM32L15xRx STM32L15xVx Flash (Kbytes) Data EEPROM (Kbytes) RAM (Kbytes) General- purpose Timers Basic Communication interfaces USART GPIOs 12-bit synchronized ADC Number of channels 14 channels 20 channels 24 channels... -
Page 11: Ultralow Power Device Continuum
STMicroelectronics microcontrollers ultralow power strategy which also includes STM8L101xx and STM8L15xx devices. The STM8L and STM32L families allow a continuum of performance, peripherals, system architecture and features. They are all based on STMicroelectronics ultralow leakage process. Note: The ultralow power STM32L and general-purpose STM32Fxxxx families are pin-to-pin compatible. -
Page 12: Functional Overview
Functional overview STM32L151x6/8/B, STM32L152x6/8/B Functional overview Figure 1 shows the block diagrams. Figure 1. Ultralow power STM32L15xx6/8/B block diagram 1. AF = alternate function on I/O port pin. 12/129 DocID17659 Rev 10... -
Page 13: Low Power Modes
STM32L151x6/8/B, STM32L152x6/8/B Functional overview Low power modes The ultralow power STM32L15xx6/8/B supports dynamic voltage scaling to optimize its power consumption in run mode. The voltage from the internal low-drop regulator that supplies the logic can be adjusted according to the system’s maximum operating frequency and the external voltage supply: •... -
Page 14: Table 3. Functionalities Depending On The Operating Power Supply Range
Functional overview STM32L151x6/8/B, STM32L152x6/8/B HSE crystal oscillators are disabled. The voltage regulator is in the low power mode. The device can be woken up from Stop mode by any of the EXTI line, in 8 µs. The EXTI line source can be one of the 16 external lines. It can be the PVD output, the Comparator 1 event or Comparator 2 event (if internal reference voltage is on). -
Page 15: Table 4. Cpu Frequency Range Depending On Dynamic Voltage Scaling
STM32L151x6/8/B, STM32L152x6/8/B Functional overview Table 3. Functionalities depending on the operating power supply range (continued) Functionalities depending on the operating power supply range Operating power DAC and ADC Dynamic voltage supply range I/O operation operation scaling range Range 1, Conversion time = 2.0 to 2.4 V Functional Range 2 or... -
Page 16: Table 5. Working Mode-Dependent Functionalities (From Run/Active Down To Standby)
Functional overview STM32L151x6/8/B, STM32L152x6/8/B Table 5. Working mode-dependent functionalities from Run/active down to stand Stop Standby Low- Low- Run/Active Sleep power power Wakeup Wakeup Sleep capability capability Flash Backup Registers EEPROM Brown-out rest (BOR) Programmable Voltage Detector (PVD) Power On Reset (POR) Power Down Rest (PDR) - Page 17 STM32L151x6/8/B, STM32L152x6/8/B Functional overview Table 5. Working mode-dependent functionalities from Run/active down to stand by) (continued) Stop Standby Low- Low- Run/Active Sleep power power Wakeup Wakeup Sleep capability capability Temperature sensor Comparators 16-bit and 32-bit Timers IWDG WWDG Touch sensing Systick Timer GPIOs 3 Pins...
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Page 18: Reset And Supply Management
Functional overview STM32L151x6/8/B, STM32L152x6/8/B Nested vectored interrupt controller (NVIC) The ultralow power STM32L15xx6/8/B embeds a nested vectored interrupt controller able to ® handle up to 45 maskable interrupt channels (not including the 16 interrupt lines of Cortex M3) and 16 priority levels. •... -
Page 19: Voltage Regulator
STM32L151x6/8/B, STM32L152x6/8/B Functional overview Five BOR thresholds are available through option bytes, starting from 1.8 V to 3 V. To reduce the power consumption in Stop mode, it is possible to automatically switch off the internal reference voltage (V ) in Stop mode. The device remains in reset mode when REFINT is below a specified threshold, V or V... -
Page 20: Clock Management
Functional overview STM32L151x6/8/B, STM32L152x6/8/B Clock management The clock controller distributes the clocks coming from different oscillators to the core and the peripherals. It also manages clock gating for low power modes and ensures clock robustness. It features: • Clock prescaler: to get the best trade-off between speed and current consumption, the clock frequency to the CPU and peripherals can be adjusted by a programmable prescaler •... -
Page 21: Figure 2. Clock Tree
STM32L151x6/8/B, STM32L152x6/8/B Functional overview Figure 2. Clock tree 1. For the USB function to be available, both HSE and PLL must be enabled, with the CPU running at either 24 MHz or 32 MHz. DocID17659 Rev 10 21/129... -
Page 22: Low Power Real-Time Clock And Backup Registers
Functional overview STM32L151x6/8/B, STM32L152x6/8/B Low power real-time clock and backup registers The real-time clock (RTC) is an independent BCD timer/counter. Dedicated registers contain the second, minute, hour (12/24 hour), week day, date, month, year, in BCD (binary-coded decimal) format. Correction for 28, 29 (leap year), 30, and 31 day of the month are made automatically. -
Page 23: Memories
STM32L151x6/8/B, STM32L152x6/8/B Functional overview Memories The STM32L15xx6/8/B devices have the following features: • Up to 16 Kbyte of embedded RAM accessed (read/write) at CPU clock speed with 0 wait states. With the enhanced bus matrix, operating the RAM does not lead to any performance penalty during accesses to the system bus (AHB and APB buses). -
Page 24: Adc (Analog-To-Digital Converter)
Functional overview STM32L151x6/8/B, STM32L152x6/8/B 3.10 ADC (analog-to-digital converter) A 12-bit analog-to-digital converters is embedded into STM32L15xx6/8/B devices with up to 24 external channels, performing conversions in single-shot or scan mode. In scan mode, automatic conversion is performed on a selected group of analog inputs. The ADC can be served by the DMA controller. -
Page 25: Ultralow Power Comparators And Reference Voltage
STM32L151x6/8/B, STM32L152x6/8/B Functional overview This dual digital Interface supports the following features: • two DAC converters: one for each output channel • left or right data alignment in 12-bit mode • synchronized update capability • noise-wave generation • triangular-wave generation •... -
Page 26: Timers And Watchdogs
Functional overview STM32L151x6/8/B, STM32L152x6/8/B charging the sensor capacitance and then transferring a part of the accumulated charges into a sampling capacitor until the voltage across this capacitor has reached a specific threshold. The capacitive sensing acquisition only requires few external components to operate. -
Page 27: General-Purpose Timers (Tim2, Tim3, Tim4, Tim9, Tim10 And Tim11)
STM32L151x6/8/B, STM32L152x6/8/B Functional overview 3.15.1 General-purpose timers (TIM2, TIM3, TIM4, TIM9, TIM10 and TIM11) There are six synchronizable general-purpose timers embedded in the STM32L15xx6/8/B devices (see Table 6 for differences). TIM2, TIM3, TIM4 These timers are based on a 16-bit auto-reload up/down-counter and a 16-bit prescaler. They feature 4 independent channels each for input capture/output compare, PWM or one- pulse mode output. -
Page 28: Window Watchdog (Wwdg)
Functional overview STM32L151x6/8/B, STM32L152x6/8/B 3.15.5 Window watchdog (WWDG) The window watchdog is based on a 7-bit down-counter that can be set as free-running. It can be used as a watchdog to reset the device when a problem occurs. It is clocked from the main clock. -
Page 29: Crc (Cyclic Redundancy Check) Calculation Unit
STM32L151x6/8/B, STM32L152x6/8/B Functional overview 3.17 CRC (cyclic redundancy check) calculation unit The CRC (cyclic redundancy check) calculation unit is used to get a CRC code from a 32-bit data word and a fixed generator polynomial. Among other applications, CRC-based techniques are used to verify data transmission or storage integrity. -
Page 30: Pin Descriptions
Pin descriptions STM32L151x6/8/B, STM32L152x6/8/B Pin descriptions Figure 3. STM32L15xVx UFBGA100 ballout 1. This figure shows the package top view. 30/129 DocID17659 Rev 10... -
Page 31: Figure 4. Stm32L15Xvx Lqfp100 Pinout
STM32L151x6/8/B, STM32L152x6/8/B Pin descriptions Figure 4. STM32L15xVx LQFP100 pinout VDD_2 VSS_2 PA13 PE6-WKUP3 PA12 PA11 PC13-WKUP2 PA10 PC14-OSC32_IN PC15-OSC32_OUT VSS_5 VDD_5 PH0-OSC_IN LQFP100 PH1-OSC_OUT NRST PD15 PD14 PD13 PD12 PD11 VSSA PD10 VREF- VREF+ VDDA PB15 PA0-WKUP1 PB14 PB13 PB12 ai15692c 1. -
Page 32: Figure 5. Stm32L15Xrx Tfbga64 Ballout
Pin descriptions STM32L151x6/8/B, STM32L152x6/8/B Figure 5. STM32L15xRx TFBGA64 ballout PC14- PC13- PA15 PA14 PA13 OSC32_IN WKUP2 PC15- VLCD BOOT0 PC11 PC10 PA12 OSC32_OUT PH0- OSC_IN V SS_4 PC12 PA10 PA11 PH1- OSC_OUT V DD_4 V SS_3 V SS_2 V SS_1 NRST V DD_3 V DD_2... -
Page 33: Figure 6. Stm32L15Xrx Lqfp64 Pinout
STM32L151x6/8/B, STM32L152x6/8/B Pin descriptions Figure 6. STM32L15xRx LQFP64 pinout 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 VDD_2 PC13-WKUP2 VSS_2 PC14-OSC32_IN PA13 PC15-OSC32_OUT PA12 PA11 PH0 -OSC_IN PA10 PH1- OSC_OUT NRST LQFP64 VSSA PB15 VDDA... -
Page 34: Figure 8. Stm32L15Xcx Ufqfpn48 Pinout
Pin descriptions STM32L151x6/8/B, STM32L152x6/8/B Figure 8. STM32L15xCx UFQFPN48 pinout 1. This figure shows the package top view. 34/129 DocID17659 Rev 10... -
Page 35: Table 7. Legend/Abbreviations Used In The Pinout Table
STM32L151x6/8/B, STM32L152x6/8/B Pin descriptions Table 7. Legend/abbreviations used in the pinout table Name Abbreviation Definition Unless otherwise specified in brackets below the pin name, the pin function Pin name during and after reset is the same as the actual pin name Supply pin Pin type Input only pin... -
Page 36: Table 8. Stm32L15Xx6/8/B Pin Definitions
Pin descriptions STM32L151x6/8/B, STM32L152x6/8/B Table 8. STM32L15xx6/8/B pin definitions Pins Main Pin name function Alternate functions (after reset) TRACECLK/LCD_SEG38/TIM3_ETR TRACED0/LCD_SEG39/TIM3_CH1 TRACED1/TIM3_CH2 TRACED2/TIM9_CH1 PE6-WKUP3 I/O TRACED3/WKUP3/TIM9_CH2 PC13- PC13 RTC_TAMP1/RTC_TS/RTC_OUT/WKUP2 WKUP2 PC14- PC14 OSC32_IN OSC32_IN PC15- OSC32_OUT PC15 OSC32_OUT SS_5 SS_5 DD_5 DD_5 PH0- 5 C1... - Page 37 STM32L151x6/8/B, STM32L152x6/8/B Pin descriptions Table 8. STM32L15xx6/8/B pin definitions (continued) Pins Main Pin name function Alternate functions (after reset) USART2_RTS/ADC_IN1/TIM2_CH2/ 24 15 H2 LCD_SEG0/COMP1_INP USART2_TX/ADC_IN2/TIM2_CH3/ 25 16 F3 TIM9_CH1/LCD_SEG1/COMP1_INP USART2_RX/ADC_IN3/TIM2_CH4/ 26 17 G3 TIM9_CH2/LCD_SEG2/COMP1_INP 27 18 C2 SS_4 SS_4 28 19 D2 DD_4 DD_4 SPI1_NSS/USART2_CK/...
- Page 38 Pin descriptions STM32L151x6/8/B, STM32L152x6/8/B Table 8. STM32L15xx6/8/B pin definitions (continued) Pins Main Pin name function Alternate functions (after reset) PE15 PE15 SPI1_MOSI I2C2_SCL/USART3_TX/TIM2_CH3/ 47 29 G7 L10 PB10 PB10 LCD_SEG10 I2C2_SDA/USART3_RX/TIM2_CH4/LCD_SE 48 30 H7 L11 PB11 PB11 49 31 D6 F12 SS_1 SS_1 50 32 E6 G12 24...
- Page 39 STM32L151x6/8/B, STM32L152x6/8/B Pin descriptions Table 8. STM32L15xx6/8/B pin definitions (continued) Pins Main Pin name function Alternate functions (after reset) 69 43 C6 C12 31 PA10 PA10 USART1_RX/LCD_COM2 70 44 C8 B12 PA11 PA11 USART1_CTS/USB_DM/SPI1_MISO 71 45 B8 A12 PA12 PA12 USART1_RTS/USB_DP/SPI1_MOSI JTMS/ 72 46 A8 A11...
- Page 40 Pin descriptions STM32L151x6/8/B, STM32L152x6/8/B Table 8. STM32L15xx6/8/B pin definitions (continued) Pins Main Pin name function Alternate functions (after reset) I2C1_SMBA/TIM3_CH2/SPI1_MOSI/ 91 57 C4 COMP2_INP/LCD_SEG9 92 58 D3 I2C1_SCL/TIM4_CH1/USART1_TX 93 59 C3 I2C1_SDA/TIM4_CH2/USART1_RX/PVD_IN 94 60 B4 BOOT0 BOOT0 TIM4_CH3/I2C1_SCL/LCD_SEG16/ 95 61 B3 TIM10_CH1 TIM4_CH4/I2C1_SDA/LCD_COM3/ 96 62 A3...
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Page 41: Table 9. Alternate Function Input/Output
Table 9. Alternate function input/output Digital alternate function number AFIO AFIO AFIO0 AFIO1 AFIO2 AFIO3 AFIO4 AFIO5 AFOI6 AFIO7 AFIO10 AFIO11 AFIO14 AFIO15 Port name Alternate function USART SYSTEM TIM2 TIM3/4 TIM9/10/11 I2C1/2 SPI1/2 SYSTEM 1/2/3 BOOT0 BOOT0 NRST NRST PA0- TIM2_CH1 USART2_... - Page 42 Table 9. Alternate function input/output (continued) Digital alternate function number AFIO AFIO AFIO0 AFIO1 AFIO2 AFIO3 AFIO4 AFIO5 AFOI6 AFIO7 AFIO10 AFIO11 AFIO14 AFIO15 Port name Alternate function USART SYSTEM TIM2 TIM3/4 TIM9/10/11 I2C1/2 SPI1/2 SYSTEM 1/2/3 JTCK- PA14 TIMx_IC3 EVENTOUT SWCLK TIM2_CH1 PA15...
- Page 43 Table 9. Alternate function input/output (continued) Digital alternate function number AFIO AFIO AFIO0 AFIO1 AFIO2 AFIO3 AFIO4 AFIO5 AFOI6 AFIO7 AFIO10 AFIO11 AFIO14 AFIO15 Port name Alternate function USART SYSTEM TIM2 TIM3/4 TIM9/10/11 I2C1/2 SPI1/2 SYSTEM 1/2/3 SEG18 TIMx_IC1 EVENTOUT SEG19 TIMx_IC2 EVENTOUT SEG20...
- Page 44 Table 9. Alternate function input/output (continued) Digital alternate function number AFIO AFIO AFIO0 AFIO1 AFIO2 AFIO3 AFIO4 AFIO5 AFOI6 AFIO7 AFIO10 AFIO11 AFIO14 AFIO15 Port name Alternate function USART SYSTEM TIM2 TIM3/4 TIM9/10/11 I2C1/2 SPI1/2 SYSTEM 1/2/3 TIM9_CH1 SPI2_NSS TIMx_IC1 EVENTOUT SPI2_SCK TIMx_IC2 EVENTOUT COM7 /...
- Page 45 Table 9. Alternate function input/output (continued) Digital alternate function number AFIO AFIO AFIO0 AFIO1 AFIO2 AFIO3 AFIO4 AFIO5 AFOI6 AFIO7 AFIO10 AFIO11 AFIO14 AFIO15 Port name Alternate function USART SYSTEM TIM2 TIM3/4 TIM9/10/11 I2C1/2 SPI1/2 SYSTEM 1/2/3 TIM11_CH1 TIMx_IC2 EVENTOUT TRACECK TIM3_ETR TIMx_IC3 EVENTOUT...
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Page 46: Memory Mapping
Memory mapping STM32L151x6/8/B, STM32L152x6/8/B Memory mapping The memory map is shown in the following figure. Figure 9. Memory map APB memory space 0xFFFF FFFF reserved 0xE010 0000 reserved 0x6000 0000 reserved 0x4002 6400 0x4002 6000 reserved 0xFFFF FFFF 0x4002 4000 Flash Interface 0x4002 3C00 0x4002 3800... -
Page 47: Electrical Characteristics
STM32L151x6/8/B, STM32L152x6/8/B Electrical characteristics Electrical characteristics Parameter conditions Unless otherwise specified, all voltages are referenced to V 6.1.1 Minimum and maximum values Unless otherwise specified the minimum and maximum values are guaranteed in the worst conditions of ambient temperature, supply voltage and frequencies by tests in production on 100% of the devices with an ambient temperature at T = 25 °C and T max (given by... -
Page 48: Power Supply Scheme
Electrical characteristics STM32L151x6/8/B, STM32L152x6/8/B Figure 10. Pin loading conditions Figure 11. Pin input voltage 6.1.6 Power supply scheme Figure 12. Power supply scheme 48/129 DocID17659 Rev 10... -
Page 49: Optional Lcd Power Supply Scheme
STM32L151x6/8/B, STM32L152x6/8/B Electrical characteristics 6.1.7 Optional LCD power supply scheme Figure 13. Optional LCD power supply scheme VSEL Step-up DD1/2/.../N N x 100 nF Converter + 1 x 10 μF Option 1 100 nF Option 2 SS1/2/.../N MS32462V1 1. Option 1: LCD power supply is provided by a dedicated VLCD supply source, VSEL switch is open. 2. -
Page 50: Absolute Maximum Ratings
Electrical characteristics STM32L151x6/8/B, STM32L152x6/8/B Absolute maximum ratings Stresses above the absolute maximum ratings listed in Table 10: Voltage characteristics, Table 11: Current characteristics, and Table 12: Thermal characteristics may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these conditions is not implied. -
Page 51: Operating Conditions
STM32L151x6/8/B, STM32L152x6/8/B Electrical characteristics Table 12. Thermal characteristics Symbol Ratings Value Unit Storage temperature range –65 to +150 °C Maximum junction temperature °C Operating conditions 6.3.1 General operating conditions Table 13. General operating conditions Symbol Parameter Conditions Unit Internal AHB clock frequency HCLK Internal APB1 clock frequency PCLK1... -
Page 52: Embedded Reset And Power Control Block Characteristics
Electrical characteristics STM32L151x6/8/B, STM32L152x6/8/B 6.3.2 Embedded reset and power control block characteristics The parameters given in the following table are derived from the tests performed under the ambient temperature condition summarized in the following table. Table 14. Embedded reset and power control block characteristics Symbol Parameter Conditions... - Page 53 STM32L151x6/8/B, STM32L152x6/8/B Electrical characteristics Table 14. Embedded reset and power control block characteristics (continued) Symbol Parameter Conditions Unit Falling edge 1.85 1.88 Programmable voltage detector PVD0 threshold 0 Rising edge 1.88 1.94 1.99 Falling edge 1.98 2.04 2.09 PVD threshold 1 PVD1 Rising edge 2.08...
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Page 54: Embedded Internal Reference Voltage
Electrical characteristics STM32L151x6/8/B, STM32L152x6/8/B 6.3.3 Embedded internal reference voltage The parameters given in the following table are based on characterization results, unless otherwise specified. Table 15. Embedded internal reference voltage calibration values Calibration value name Description Memory address Raw data acquired at VREFINT_CAL 0x1FF8 0078-0x1FF8 0079 temperature of 30 °C, V... -
Page 55: Supply Current Characteristics
STM32L151x6/8/B, STM32L152x6/8/B Electrical characteristics 6.3.4 Supply current characteristics The current consumption is a function of several parameters and factors such as the operating voltage, ambient temperature, I/O pin loading, device software configuration, operating frequencies, I/O pin switching rate, program location in memory and executed binary code. -
Page 56: Table 17. Current Consumption In Run Mode, Code With Data Processing Running From Flash
Electrical characteristics STM32L151x6/8/B, STM32L152x6/8/B Table 17. Current consumption in Run mode, code with data processing running from Flash Symbol Parameter Conditions Unit HCLK 55 °C 85 °C 105 °C 1 MHz Range 3, =1.2 V 2 MHz µA CORE VOS[1:0] = 11 4 MHz 1025 1025... -
Page 57: Table 18. Current Consumption In Run Mode, Code With Data Processing Running From Ram
STM32L151x6/8/B, STM32L152x6/8/B Electrical characteristics Table 18. Current consumption in Run mode, code with data processing running from RAM Symbol Parameter Conditions Unit HCLK 55 °C 85 °C 105 °C 1 MHz Range 3, =1.2 V 2 MHz µA CORE VOS[1:0] = 11 4 MHz HCLK 4 MHz... -
Page 58: Table 19. Current Consumption In Sleep Mode
Electrical characteristics STM32L151x6/8/B, STM32L152x6/8/B Table 19. Current consumption in Sleep mode Symbol Parameter Conditions Unit HCLK 55 °C 85 °C 105 °C 1 MHz Range 3, =1.2 V 2 MHz CORE VOS[1:0] = 11 4 MHz up to HCLK 4 MHz 16 MHz included, Range 2, =1.5 V... - Page 59 STM32L151x6/8/B, STM32L152x6/8/B Electrical characteristics Table 19. Current consumption in Sleep mode (continued) Symbol Parameter Conditions Unit HCLK 55 °C 85 °C 105 °C Supply MSI clock, 65 kHz 65 kHz current in MSI clock, 524 kHz 524 kHz Sleep Range 3, mode, =1.2V µA...
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Page 60: Table 20. Current Consumption In Low Power Run Mode
Electrical characteristics STM32L151x6/8/B, STM32L152x6/8/B Table 20. Current consumption in Low power run mode Symbol Parameter Conditions Unit = -40 °C to 25 °C MSI clock, 65 kHz = 85 °C 17.5 = 32 kHz HCLK = 105 °C peripherals OFF, code = -40 °C to 25 °C executed MSI clock, 65 kHz... -
Page 61: Table 21. Current Consumption In Low Power Sleep Mode
STM32L151x6/8/B, STM32L152x6/8/B Electrical characteristics Table 21. Current consumption in Low power sleep mode Symbol Parameter Conditions Unit MSI clock, 65 kHz = 32 kHz = -40 °C to 25 °C HCLK Flash OFF = -40 °C to 25 °C 17.5 MSI clock, 65 kHz = 32 kHz = 85 °C... -
Page 62: Table 22. Typical And Maximum Current Consumptions In Stop Mode
Electrical characteristics STM32L151x6/8/B, STM32L152x6/8/B Table 22. Typical and maximum current consumptions in Stop mode Symbol Parameter Conditions Unit (1)(2) = -40°C to 25°C 2.75 = 1.8 V = -40°C to 25°C = 55°C = 85°C = 105°C 10.2 RTC clocked by LSI, = -40°C to 25°C regulator in LP mode, HSI and HSE OFF... - Page 63 STM32L151x6/8/B, STM32L152x6/8/B Electrical characteristics Table 22. Typical and maximum current consumptions in Stop mode (continued) Symbol Parameter Conditions Unit (1)(2) Regulator in LP mode, HSI and HSE OFF, independent = -40°C to 25°C watchdog and LSI enabled Supply current in Stop mode = -40°C to 25°C µA DD (Stop)
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Page 64: Table 23. Typical And Maximum Current Consumptions In Standby Mode
Electrical characteristics STM32L151x6/8/B, STM32L152x6/8/B Table 23. Typical and maximum current consumptions in Standby mode Symbol Parameter Conditions Unit (1)(2) = -40 °C to 25 °C = 1.8 V = -40 °C to 25 °C RTC clocked by LSI (no independent watchdog) = 55 °C 1.42 = 85 °C... -
Page 65: Table 24. Peripheral Current Consumption
STM32L151x6/8/B, STM32L152x6/8/B Electrical characteristics Table 24. Peripheral current consumption Typical consumption, V = 3.0 V, T = 25 °C Range 1, Range 2, Range 3, Peripheral Unit Low power =1.8 V =1.5 V =1.2 V CORE CORE CORE sleep and run VOS[1:0] = 01 VOS[1:0] = 10 VOS[1:0] = 11... - Page 66 Electrical characteristics STM32L151x6/8/B, STM32L152x6/8/B Table 24. Peripheral current consumption (continued) Typical consumption, V = 3.0 V, T = 25 °C Range 1, Range 2, Range 3, Peripheral Unit Low power =1.8 V =1.5 V =1.2 V CORE CORE CORE sleep and run VOS[1:0] = 01 VOS[1:0] = 10 VOS[1:0] = 11...
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Page 67: Wakeup Time From Low Power Mode
STM32L151x6/8/B, STM32L152x6/8/B Electrical characteristics 6.3.5 Wakeup time from Low power mode The wakeup times given in the following table are measured with the MSI RC oscillator. The clock source used to wake up the device depends on the current operating mode: •... -
Page 68: External Clock Source Characteristics
Electrical characteristics STM32L151x6/8/B, STM32L152x6/8/B 6.3.6 External clock source characteristics High-speed external user clock generated from an external source In bypass mode the HSE oscillator is switched off and the input pin is a standard GPIO. The external clock signal has to respect the I/O characteristics in Section 6.3.13. -
Page 69: Table 27. Low-Speed External User Clock Characteristics
STM32L151x6/8/B, STM32L152x6/8/B Electrical characteristics Low-speed external user clock generated from an external source The characteristics given in the following table result from tests performed using a low- speed external clock source, and under ambient temperature and supply voltage conditions summarized in Table Table 27. -
Page 70: Table 28. Hse Oscillator Characteristics
Electrical characteristics STM32L151x6/8/B, STM32L152x6/8/B (1)(2) Table 28. HSE oscillator characteristics Symbol Parameter Conditions Min Typ Unit Oscillator frequency OSC_IN Feedback resistor kΩ Recommended load capacitance versus = 30 Ω equivalent serial resistance of the crystal (R = 3.3 V, V HSE driving current with 30 pF load C = 20 pF... -
Page 71: Table 29. Lse Oscillator Characteristics (F Lse = 32.768 Khz)
STM32L151x6/8/B, STM32L152x6/8/B Electrical characteristics Figure 17. HSE oscillator circuit diagram 1. R value depends on the crystal characteristics. Low-speed external clock generated from a crystal/ceramic resonator The low-speed external (LSE) clock can be supplied with a 32.768 kHz crystal/ceramic resonator oscillator. All the information given in this paragraph are based on characterization results obtained with typical external components specified in Table 29. -
Page 72: Figure 18. Typical Application With A 32.768 Khz Crystal
Electrical characteristics STM32L151x6/8/B, STM32L152x6/8/B Note: For CL1 and CL2, it is recommended to use high-quality ceramic capacitors in the 5 pF to 15 pF range selected to match the requirements of the crystal or resonator (see Figure 18 CL1 and CL2, are usually the same size. The crystal manufacturer typically specifies a load capacitance which is the series combination of CL1 and CL2. -
Page 73: Internal Clock Source Characteristics
STM32L151x6/8/B, STM32L152x6/8/B Electrical characteristics 6.3.7 Internal clock source characteristics The parameters given in the following table are derived from tests performed under ambient temperature and V supply voltage conditions summarized in Table High-speed internal (HSI) RC oscillator Table 30. HSI oscillator characteristics Symbol Parameter Conditions... -
Page 74: Table 32. Msi Oscillator Characteristics
Electrical characteristics STM32L151x6/8/B, STM32L152x6/8/B Multi-speed internal (MSI) RC oscillator Table 32. MSI oscillator characteristics Symbol Parameter Condition Unit MSI range 0 65.5 MSI range 1 MSI range 2 Frequency after factory calibration, done at MSI range 3 = 3.3 V and T = 25 °C MSI range 4 1.05... -
Page 75: Pll Characteristics
STM32L151x6/8/B, STM32L152x6/8/B Electrical characteristics Table 32. MSI oscillator characteristics (continued) Symbol Parameter Condition Unit MSI range 0 MSI range 1 MSI range 2 MSI range 3 MSI range 4 MSI oscillator stabilization time µs STAB(MSI) MSI range 5 MSI range 6, Voltage range 1 and 2 MSI range 3,... -
Page 76: Memory Characteristics
Electrical characteristics STM32L151x6/8/B, STM32L152x6/8/B 6.3.9 Memory characteristics The characteristics are given at T = -40 to 105 °C unless otherwise specified. RAM memory Table 34. RAM and hardware registers Symbol Parameter Conditions Unit Data retention mode STOP mode (or RESET) 1.65 1. -
Page 77: Emc Characteristics
STM32L151x6/8/B, STM32L152x6/8/B Electrical characteristics Table 36. Flash memory, data EEPROM endurance and data retention Value Symbol Parameter Conditions Unit Typ Max Cycling (erase / write) Program memory = -40°C to NCYC kcycles 105 °C Cycling (erase / write) EEPROM data memory Data retention (program memory) after 10 kcycles at T = 85 °C... -
Page 78: Table 38. Emi Characteristics
Electrical characteristics STM32L151x6/8/B, STM32L152x6/8/B Designing hardened software to avoid noise problems EMC characterization and optimization are performed at component level with a typical application environment and simplified MCU software. It should be noted that good EMC performance is highly dependent on the user application and the software in particular. Therefore it is recommended that the user applies EMC software optimization and prequalification tests in relation with the EMC level requested for his application. -
Page 79: Electrical Sensitivity Characteristics
STM32L151x6/8/B, STM32L152x6/8/B Electrical characteristics 6.3.11 Electrical sensitivity characteristics Based on three different tests (ESD, LU) using specific measurement methods, the device is stressed in order to determine its performance in terms of electrical sensitivity. Electrostatic discharge (ESD) Electrostatic discharges (a positive then a negative pulse separated by 1 second) are applied to the pins of each sample according to each pin combination. -
Page 80: Table 41. I/O Current Injection Susceptibility
Electrical characteristics STM32L151x6/8/B, STM32L152x6/8/B Functional susceptibility to I/O current injection While a simple application is executed on the device, the device is stressed by injecting current into the I/O pins programmed in floating input mode. While current is injected into the I/O pin, one at a time, the device is checked for functional failures. -
Page 81: I/O Port Characteristics
STM32L151x6/8/B, STM32L152x6/8/B Electrical characteristics 6.3.13 I/O port characteristics General input/output characteristics Unless otherwise specified, the parameters given in Table 42 are derived from tests performed under conditions summarized in Table 13. All I/Os are CMOS and TTL compliant. Table 42. I/O static characteristics Symbol Parameter Conditions... -
Page 82: Table 43. Output Voltage Characteristics
Electrical characteristics STM32L151x6/8/B, STM32L152x6/8/B Output driving current The GPIOs (general purpose input/outputs) can sink or source up to ±8 mA, and sink or source up to ±20 mA (with the non-standard V specifications given in Table In the user application, the number of I/O pins which can drive current must be limited to respect the absolute maximum rating specified in Section 6.2:... -
Page 83: Table 44. I/O Ac Characteristics
STM32L151x6/8/B, STM32L152x6/8/B Electrical characteristics Input/output AC characteristics The definition and values of input/output AC characteristics are given in Figure 19 Table 44, respectively. Unless otherwise specified, the parameters given in Table 44 are derived from tests performed under ambient temperature and V supply voltage conditions summarized in Table Table 44. -
Page 84: Nrst Pin Characteristics
Electrical characteristics STM32L151x6/8/B, STM32L152x6/8/B Figure 19. I/O AC characteristics definition 6.3.14 NRST pin characteristics The NRST pin input driver uses CMOS technology. It is connected to a permanent pull-up resistor, RPU (see Table 45). Unless otherwise specified, the parameters given in Table 45 are derived from tests performed under ambient temperature and V... -
Page 85: Tim Timer Characteristics
STM32L151x6/8/B, STM32L152x6/8/B Electrical characteristics Figure 20. Recommended NRST pin protection 1. The reset network protects the device against parasitic resets. 2. The user must ensure that the level on the NRST pin can go below the V max level specified in IL(NRST) Table 45. -
Page 86: Communication Interfaces
Electrical characteristics STM32L151x6/8/B, STM32L152x6/8/B 6.3.16 Communication interfaces C interface characteristics The STM32L15xx6/8/B product line I C interface meets the requirements of the standard C communication protocol with the following restrictions: SDA and SCL are not “true” open-drain I/O pins. When configured as open-drain, the PMOS connected between the I/O pin and V is disabled, but is still present. -
Page 87: Table 48. Scl Frequency
STM32L151x6/8/B, STM32L152x6/8/B Electrical characteristics Figure 21. I C bus AC waveforms and measurement circuit 1. R = series protection resistors 2. R = pull-up resistors 3. V = I2C bus supply DD_I2C 4. Measurement points are done at CMOS levels: 0.3V and 0.7V (1)(2) Table 48. -
Page 88: Table 49. Spi Characteristics
Electrical characteristics STM32L151x6/8/B, STM32L152x6/8/B SPI characteristics Unless otherwise specified, the parameters given in the following table are derived from tests performed under ambient temperature, f frequency and V supply voltage PCLKx conditions summarized in Table Refer to Section 6.3.12: I/O current injection characteristics for more details on the input/output alternate function characteristics (NSS, SCK, MOSI, MISO). -
Page 89: Figure 22. Spi Timing Diagram - Slave Mode And Cpha = 0
STM32L151x6/8/B, STM32L152x6/8/B Electrical characteristics Figure 22. SPI timing diagram - slave mode and CPHA = 0 NSS input t c(SCK) t h(NSS) t SU(NSS) CPHA= 0 CPOL=0 t w(SCKH) CPHA= 0 t w(SCKL) CPOL=1 t r(SCK) t v(SO) t a(SO) t h(SO) t dis(SO) t f(SCK) -
Page 90: Table 50. Usb Startup Time
Electrical characteristics STM32L151x6/8/B, STM32L152x6/8/B Figure 24. SPI timing diagram - master mode High NSS input t c(SCK) CPHA= 0 CPOL=0 CPHA= 0 CPOL=1 CPHA=1 CPOL=0 CPHA=1 CPOL=1 t w(SCKH) t r(SCK) t su(MI) t w(SCKL) t f(SCK) MISO MS BIN BI T6 IN LSB IN INP UT... -
Page 91: Table 51. Usb Dc Electrical Characteristics
STM32L151x6/8/B, STM32L152x6/8/B Electrical characteristics Table 51. USB DC electrical characteristics Symbol Parameter Conditions Min. Max. Unit Input levels USB operating voltage Differential input sensitivity I(USB_DP, USB_DM) Differential common mode range Includes V range Single ended receiver threshold Output levels Static output level low of 1.5 kΩ... -
Page 92: 12-Bit Adc Characteristics
Electrical characteristics STM32L151x6/8/B, STM32L152x6/8/B 6.3.17 12-bit ADC characteristics Unless otherwise specified, the parameters given in Table 54 are guaranteed by design. Table 53. ADC clock frequency Symbol Parameter Conditions Unit REF+ = < V REF+ 2.4 V ≤ V ≤ 3.6 V >... - Page 93 STM32L151x6/8/B, STM32L152x6/8/B Electrical characteristics Table 54. ADC characteristics (continued) Symbol Parameter Conditions Unit Direct channels 0.25 2.4 V ≤ V ≤ 3.6 V Multiplexed channels 0.56 2.4 V ≤ V ≤ 3.6 V µs Sampling time Direct channels 0.56 1.8 V ≤ V ≤...
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Page 94: Table 55. Adc Accuracy
Electrical characteristics STM32L151x6/8/B, STM32L152x6/8/B (1)(2) Table 55. ADC accuracy Symbol Parameter Test conditions Unit Total unadjusted error 2.4 V ≤ V ≤ 3.6 V Offset error 2.4 V ≤ V ≤ 3.6 V REF+ Gain error = 50 Ω = 8 MHz, R Differential linearity error = -40 to 105 °... -
Page 95: Figure 26. Adc Accuracy Characteristics
STM32L151x6/8/B, STM32L152x6/8/B Electrical characteristics Figure 26. ADC accuracy characteristics REF+ [1LSB depending on package)] IDEAL 4096 4096 (1) Example of an actual transfer curve 4095 (2) The ideal transfer curve 4094 (3) End point correlation line 4093 =Total Unadjusted Error: maximum deviation between the actual and the ideal transfer curves. -
Page 96: Figure 28. Maximum Dynamic Current Consumption On V
Electrical characteristics STM32L151x6/8/B, STM32L152x6/8/B Figure 28. Maximum dynamic current consumption on V supply pin during ADC REF+ conversion Sampling (n cycles) Conversion (12 cycles) ADC clock ref+ 700µA 300µA Table 56. R max for f = 16 MHz max (kOhm) Multiplexed channels Direct channels (cycles) -
Page 97: Figure 29. Power Supply And Reference Decoupling
STM32L151x6/8/B, STM32L152x6/8/B Electrical characteristics Figure 29. Power supply and reference decoupling (V not connected to REF+ 1. V and V inputs are available only on 100-pin packages. REF+ REF– Figure 30. Power supply and reference decoupling (V connected to REF+ 1. -
Page 98: Dac Electrical Specifications
Electrical characteristics STM32L151x6/8/B, STM32L152x6/8/B 6.3.18 DAC electrical specifications Data guaranteed by design, not tested in production, unless otherwise specified. Table 57. DAC characteristics Symbol Parameter Conditions Unit Analog supply voltage must always be below REF+ Reference supply voltage REF+ Lower reference voltage REF- Current consumption on No load, middle code (0x800) - Page 99 STM32L151x6/8/B, STM32L152x6/8/B Electrical characteristics Table 57. DAC characteristics (continued) Symbol Parameter Conditions Unit = 3.3V, T = 0 to 50 ° C DAC output buffer OFF Offset error temperature dOffset/dT µV/°C coefficient (code 0x800) = 3.3V, T = 0 to 50 ° C DAC output buffer ON ≤...
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Page 100: Temperature Sensor Characteristics
Electrical characteristics STM32L151x6/8/B, STM32L152x6/8/B 8. In buffered mode, the output can overshoot above the final value for low input code (starting from min value). Figure 31. 12-bit buffered /non-buffered DAC Buffered/Non-buffered DAC Buffer(1) DAC_OUTx 12-bit digital to analog converter ai17157V2 1. -
Page 101: Comparator
STM32L151x6/8/B, STM32L152x6/8/B Electrical characteristics 6.3.20 Comparator Table 60. Comparator 1 characteristics Symbol Parameter Conditions Unit Analog supply voltage 1.65 value 400K 400K kΩ value Comparator 1 input voltage range Comparator startup time START µs Propagation delay ±3 ±10 Voffset Comparator offset = 3.6 V Comparator offset = 0 V... -
Page 102: Table 61. Comparator 2 Characteristics
Electrical characteristics STM32L151x6/8/B, STM32L152x6/8/B Table 61. Comparator 2 characteristics Symbol Parameter Conditions Min Typ Max Unit Analog supply voltage Comparator 2 input voltage range Fast mode Comparator startup time START Slow mode 1. V ≤ V ≤ 2.7 V Propagation delay in slow mode µs d slow... -
Page 103: Lcd Controller (Stm32L152Xx Only)
STM32L151x6/8/B, STM32L152x6/8/B Electrical characteristics 6.3.21 LCD controller (STM32L152xx only) The embeds a built-in step-up converter to provide a constant LCD reference voltage independently from the V voltage. An external capacitor C must be connected to the pin to decouple this converter. Table 62. -
Page 104: Package Characteristics
Package characteristics STM32L151x6/8/B, STM32L152x6/8/B Package characteristics Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ® ® ECOPACK packages, depending on their level of environmental compliance. ECOPACK specification s, grade definitions and product status are available at: www.st.com. ®... -
Page 105: Figure 32. Lqfp100 14 X 14 Mm, 100-Pin Low-Profile Quad Flat Package Outline
STM32L151x6/8/B, STM32L152x6/8/B Package characteristics Figure 32. LQFP100 14 x 14 mm, 100-pin low-profile quad flat package outline 1. Drawing is not to scale. DocID17659 Rev 10 105/129... -
Page 106: Table 63. Lqpf100 14 X 14 Mm, 100-Pin Low-Profile Quad Flat Package
Package characteristics STM32L151x6/8/B, STM32L152x6/8/B Table 63. LQPF100 14 x 14 mm, 100-pin low-profile quad flat package mechanical data millimeters inches Symbol 1.600 0.0630 0.050 0.150 0.0020 0.0059 1.350 1.400 1.450 0.0531 0.0551 0.0571 0.170 0.220 0.270 0.0067 0.0087 0.0106 0.090 0.200 0.0035 0.0079... -
Page 107: Figure 33. Recommended Footprint
STM32L151x6/8/B, STM32L152x6/8/B Package characteristics Figure 33. Recommended footprint 1. Dimensions are in millimeters. DocID17659 Rev 10 107/129... -
Page 108: Figure 34. Lqfp64 10 X 10 Mm, 64-Pin Low-Profile Quad Flat Package Outline
Package characteristics STM32L151x6/8/B, STM32L152x6/8/B Figure 34. LQFP64 10 x 10 mm, 64-pin low-profile quad flat package outline 1. Drawing is not to scale. 108/129 DocID17659 Rev 10... -
Page 109: Table 64. Lqfp64 10 X 10 Mm 64-Pin Low-Profile Quad Flat Package Mechanical Data
STM32L151x6/8/B, STM32L152x6/8/B Package characteristics Table 64. LQFP64 10 x 10 mm 64-pin low-profile quad flat package mechanical data millimeters inches Symbol 1.600 0.0630 0.050 0.150 0.0020 0.0059 1.350 1.400 1.450 0.0531 0.0551 0.0571 0.170 0.220 0.270 0.0067 0.0087 0.0106 0.090 0.200 0.0035 0.0079... -
Page 110: Figure 36. Lqfp48 7 X 7 Mm, 48-Pin Low-Profile Quad Flat Package Outline
Package characteristics STM32L151x6/8/B, STM32L152x6/8/B Figure 36. LQFP48 7 x 7 mm, 48-pin low-profile quad flat package outline 1. Drawing is not to scale. 110/129 DocID17659 Rev 10... -
Page 111: Table 65. Lqfp48 7 X 7 Mm, 48-Pin Low-Profile Quad Flat Package Mechanical Data
STM32L151x6/8/B, STM32L152x6/8/B Package characteristics Table 65. LQFP48 7 x 7 mm, 48-pin low-profile quad flat package mechanical data millimeters inches Symbol 1.600 0.0630 0.050 0.150 0.0020 0.0059 1.350 1.400 1.450 0.0531 0.0551 0.0571 0.170 0.220 0.270 0.0067 0.0087 0.0106 0.090 0.200 0.0035 0.0079... -
Page 112: Figure 38. Ufqfpn48 7 X 7 Mm 0.5 Mm Pitch, Ultra Thin Fine-Pitch Quad Flat No-Lead
Package characteristics STM32L151x6/8/B, STM32L152x6/8/B Figure 38. UFQFPN48 7 x 7 mm 0.5 mm pitch, ultra thin fine-pitch quad flat no-lead package outline 1. Drawing is not to scale. 2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life. 3. -
Page 113: Table 66. Ufqfpn48 7 X 7 Mm, 0.5 Mm Pitch, Ultra Thin Fine-Pitch Quad Flat No-Lead
STM32L151x6/8/B, STM32L152x6/8/B Package characteristics Table 66. UFQFPN48 7 x 7 mm, 0.5 mm pitch, ultra thin fine-pitch quad flat no-lead package mechanical data millimeters inches Symbol 0.500 0.550 0.600 0.0197 0.0217 0.0236 0.000 0.020 0.050 0.0000 0.0008 0.0020 6.900 7.000 7.100 0.2717 0.2756... -
Page 114: Table 67. Ufbga100 7 X 7 X 0.6 Mm 0.5 Mm Pitch, Ultra Thin Fine-Pitch Ball Grid Array
Package characteristics STM32L151x6/8/B, STM32L152x6/8/B Figure 40. UFBGA100 7 x 7 x 0.6 mm 0.5 mm pitch, ultra thin fine-pitch ball grid array package outline 1. Drawing is not to scale. Table 67. UFBGA100 7 x 7 x 0.6 mm 0.5 mm pitch, ultra thin fine-pitch ball grid array package mechanical data millimeters inches... - Page 115 STM32L151x6/8/B, STM32L152x6/8/B Package characteristics Table 67. UFBGA100 7 x 7 x 0.6 mm 0.5 mm pitch, ultra thin fine-pitch ball grid array package mechanical data (continued) millimeters inches Symbol 0.15 0.0059 0.05 0.002 1. Values in inches are converted from mm and rounded to 4 decimal digits. DocID17659 Rev 10 115/129...
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Page 116: Table 68. Tfbga64 5.0X5.0X1.2 Mm, 0.5 Mm Pitch Thin Fine-Pitch Ball Grid Array
Package characteristics STM32L151x6/8/B, STM32L152x6/8/B Figure 41. TFBGA64 - 5.0x5.0x1.2 mm, 0.5 mm pitch, thin fine-pitch ball grid array package outline 1. Drawing is not to scale. Table 68. TFBGA64 5.0x5.0x1.2 mm, 0.5 mm pitch thin fine-pitch ball grid array package mechanical data millimeters inches Symbol... - Page 117 STM32L151x6/8/B, STM32L152x6/8/B Package characteristics Table 68. TFBGA64 5.0x5.0x1.2 mm, 0.5 mm pitch thin fine-pitch ball grid array package mechanical data (continued) millimeters inches Symbol 0.15 0.0059 0.05 0.002 1. Values in inches are converted from mm and rounded to 4 decimal digits. DocID17659 Rev 10 117/129...
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Page 118: Figure 42. Recommended Pcb Design Rules For Pads (0.5 Mm Pitch Bga)
Package characteristics STM32L151x6/8/B, STM32L152x6/8/B Figure 42. Recommended PCB design rules for pads (0.5 mm pitch BGA) 0.5 mm Pitch D pad 0.27 mm 0.35 mm typ (depends on the soldermask registration tolerance) Solder paste 0.27 mm aperture diameter Dpad ai15495 1. -
Page 119: Thermal Characteristics
STM32L151x6/8/B, STM32L152x6/8/B Package characteristics Thermal characteristics The maximum chip-junction temperature, T max, in degrees Celsius, may be calculated using the following equation: max = T max + (P max × Θ Where: • max is the maximum ambient temperature in ° C, •... -
Page 120: Reference Document
Package characteristics STM32L151x6/8/B, STM32L152x6/8/B Figure 43. Thermal resistance 7.2.1 Reference document JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air). Available from www.jedec.org. 120/129 DocID17659 Rev 10... -
Page 121: Part Numbering
STM32L151x6/8/B, STM32L152x6/8/B Part numbering Part numbering Table 70. Ordering information scheme Example: STM32 L 151 C Device family STM32 = ARM-based 32-bit microcontroller Product type L = Low power Device subfamily 151: Devices without LCD 152: Devices with LCD Pin count C = 48 pins R = 64 pins V = 100 pins... -
Page 122: Revision History
Revision history STM32L151x6/8/B, STM32L152x6/8/B Revision history Table 71. Document revision history Date Revision Changes 02-Jul-2010 Initial release. Removed 5 V tolerance (FT) from PA3, PB0 and PC3 in Table 8: STM32L15xx6/8/B pin definitions Updated Table 14: Embedded reset and power control block characteristics 01-Oct-2010 Updated... - Page 123 STM32L151x6/8/B, STM32L152x6/8/B Revision history Table 71. Document revision history (continued) Date Revision Changes Features: updated value of Low-power sleep. Section 3.3.2: Power supply supervisor: updated note. Table 8: STM32L15xx6/8/B pin definitions: modified main function (after reset) and alternate function for OSC_IN and OSC_OUT pins; modified footnote 5;...
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Page 124: Ref
Revision history STM32L151x6/8/B, STM32L152x6/8/B Table 71. Document revision history (continued) Date Revision Changes Updated Table 23: Typical and maximum current consumptions in Standby mode on page 64 (WU from Standby) instead of (I (WU from Stop). Table 25: Low-power mode wakeup timings on page 67: updated condition for Wakeup from Stop mode, regulator in Run mode;... - Page 125 STM32L151x6/8/B, STM32L152x6/8/B Revision history Table 71. Document revision history (continued) Date Revision Changes Modified 1st page (low power features) Added STM32L15xC6 and STM32L15xR6 devices (32 Kbytes of Flash memory). Modified Section 3.6: GPIOs (general-purpose inputs/outputs) on 17-June-2011 page 22 Modified Section 6.3: Operating conditions on page 51 Modified Table 55: ADC accuracy on page...
- Page 126 Revision history STM32L151x6/8/B, STM32L152x6/8/B Table 71. Document revision history (continued) Date Revision Changes Updated cover page. Updated Section 3.10: ADC (analog-to-digital converter) Updated Table 3: Functionalities depending on the operating power supply range, added Table 4: CPU frequency range depending on dynamic voltage scaling Table 5: Working mode-dependent functionalities (from Run/active down to...
- Page 127 STM32L151x6/8/B, STM32L152x6/8/B Revision history Table 71. Document revision history (continued) Date Revision Changes Changed voltage Range 1 minimum to 1.71 V and updated dynamic voltage scaling range in Table 3: Functionalities depending on the operating power supply range Updated LCD and ADC features in Table 2: Ultralow power STM32L15xx6/8/B device features and peripheral counts.
- Page 128 Revision history STM32L151x6/8/B, STM32L152x6/8/B Table 71. Document revision history (continued) Date Revision Changes Updated Table 54: ADC characteristics Figure 27: Typical connection diagram using the ADC. Table 58: Temperature sensor calibration values was previously in Section 3.10.1: Temperature sensor. Updated Table 59: Temperature sensor characteristics.
- Page 129 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders.
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