Table of Contents
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ARM
Features
®
• Core: ARM
32-bit Cortex
frequency up to 48 MHz
• Memories
– 32 Kbytes of Flash memory
– 4 Kbytes of SRAM with HW parity
• CRC calculation unit
• Power management
– Digital and I/Os supply: V
– Analog supply: V
– Low power modes: Sleep, Stop
– V
supply for RTC and backup registers
BAT
• Clock management
– 4 to 32 MHz crystal oscillator
– 32 kHz oscillator for RTC with calibration
– Internal 8 MHz RC with x6 PLL option
– Internal 40 kHz RC oscillator
• Up to 38 fast I/Os
– All mappable on external interrupt vectors
– Up to 25 I/Os with 5 V tolerant capability
• 5-channel DMA controller
• 1 × 12-bit, 1.0 µs ADC (up to 10 channels)
– Conversion range: 0 to 3.6V
– Separate analog supply from 2.4 up to
3.6 V
• Up to 9 timers
– 1 x 16-bit 7-channel advanced-control timer
for 6 channels PWM output, with deadtime
generation and emergency stop
– 1 x 32-bit and 1 x 16-bit timer, with up to 4
IC/OC, usable for IR control decoding
– 1 x 16-bit timer, with 2 IC/OC, 1 OCN,
deadtime generation and emergency stop
– 1 x 16-bit timer, with IC/OC and OCN,
deadtime generation, emergency stop and
modulator gate for IR control
December 2015
This is information on a product in full production.
®
-based 32-bit MCU with 32 Kbyte Flash, 9 timers,
ADC and communication interfaces, 1.8 V
®
-M0 CPU,
±
= 1.8 V
8%
DD
= from V
to 3.6 V
DDA
DD
DocID026079 Rev 3
STM32F038x6
LQFP48 7x7 mm
UFQFPN32 5x5 mm
UFQFPN28 4x4 mm
– 1 x 16-bit timer with 1 IC/OC
– Independent and system watchdog timers
– SysTick timer: 24-bit downcounter
• Calendar RTC with alarm and periodic wakeup
from Stop
• Communication interfaces
2
– 1 x I
C interface, supporting Fast Mode
Plus (1 Mbit/s) with extra current sink,
SMBus/PMBus, and wakeup from Stop
mode
– 1 x USART supporting master synchronous
SPI and modem control, ISO7816
interface, LIN, IrDA capability, auto baud
rate detection and wakeup feature
– 1 x SPI (18 Mbit/s) with 4 to 16
programmable bit frames, with I
multiplexed
• Serial wire debug (SWD)
• 96-bit unique ID
• Extended temperature range: -40 to +105°C
• All packages ECOPACK
Table 1. Device summary
Reference
STM32F038C6, STM32F038E6,
STM32F038x6
STM32F038F6, STM32F038G6,
STM32F038K6
-
Datasheet
production data
WLCSP25
TSSOP20
2.1x2.1 mm
6.5x4.4 mm
2
S interface
®
2
Part number
www.st.com
1/102
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Table of Contents
Related Manuals for STMicroelectronics STM32F038C6
Summary of Contents for STMicroelectronics STM32F038C6
-
Page 1: Table 1. Device Summary
• Up to 9 timers – 1 x 16-bit 7-channel advanced-control timer Reference Part number for 6 channels PWM output, with deadtime STM32F038C6, STM32F038E6, generation and emergency stop STM32F038x6 STM32F038F6, STM32F038G6, – 1 x 32-bit and 1 x 16-bit timer, with up to 4... -
Page 2: Table Of Contents
Contents STM32F038x6 Contents Introduction ..........8 Description . - Page 3 STM32F038x6 Contents 3.16 Serial wire debug port (SW-DP) ....... . 22 Pinouts and pin description .
- Page 4 Contents STM32F038x6 Package information ........80 LQFP48 package information .
- Page 5 STM32F038x6 List of tables List of tables Table 1. Device summary ............1 Table 2.
- Page 6 List of tables STM32F038x6 Table 48. NPOR pin characteristics ..........69 Table 49.
- Page 7 STM32F038x6 List of figures List of figures Figure 1. Block diagram ............10 Figure 2.
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Page 8: Introduction
Introduction This datasheet provides the ordering information and mechanical device characteristics of the STM32F038x6 microcontrollers. This document should be read in conjunction with the STM32F0xxxx reference manual (RM0091). The reference manual is available from the STMicroelectronics website www.st.com. ® ®... -
Page 9: Description
STM32F038x6 Description Description ® ® The STM32F038x6 microcontrollers incorporate the high-performance ARM Cortex 32-bit RISC core operating at up to 48 MHz frequency, high-speed embedded memories (32 Kbytes of Flash memory and 4 Kbytes of SRAM), and an extensive range of enhanced peripherals and I/Os. -
Page 10: Figure 1. Block Diagram
Description STM32F038x6 Figure 1. Block diagram 10/102 DocID026079 Rev 3... -
Page 11: Functional Overview
STM32F038x6 Functional overview Functional overview Figure 1 shows the general block diagram of the STM32F038x6 devices. ® ® -Cortex -M0 core ® ® The ARM Cortex -M0 is a generation of ARM 32-bit RISC processors for embedded systems. It has been developed to provide a low-cost platform that meets the needs of MCU implementation, with a reduced pin count and low-power consumption, while delivering outstanding computational performance and an advanced system response to interrupts. -
Page 12: Cyclic Redundancy Check Calculation Unit (Crc)
Functional overview STM32F038x6 Cyclic redundancy check calculation unit (CRC) The CRC (cyclic redundancy check) calculation unit is used to get a CRC code from a 32-bit data word and a CRC-32 (Ethernet) polynomial. Among other applications, CRC-based techniques are used to verify data transmission or storage integrity. -
Page 13: Clocks And Startup
STM32F038x6 Functional overview Note: The RTC, the IWDG, and the corresponding clock sources are not stopped by entering Stop mode. Clocks and startup System clock selection is performed on startup, however the internal RC 8 MHz oscillator is selected as default CPU clock on reset. An external 4-32 MHz clock can be selected, in which case it is monitored for failure. -
Page 14: General-Purpose Inputs/Outputs (Gpios)
Functional overview STM32F038x6 Figure 2. Clock tree General-purpose inputs/outputs (GPIOs) Each of the GPIO pins can be configured by software as output (push-pull or open-drain), as input (with or without pull-up or pull-down) or as peripheral alternate function. Most of the GPIO pins are shared with digital or analog alternate functions. -
Page 15: Direct Memory Access Controller (Dma)
STM32F038x6 Functional overview Direct memory access controller (DMA) The 5-channel general-purpose DMAs manage memory-to-memory, peripheral-to-memory and memory-to-peripheral transfers. The DMA supports circular buffer management, removing the need for user code intervention when the controller reaches the end of the buffer. Each channel is connected to dedicated hardware DMA requests, with support for software trigger on each channel. -
Page 16: Temperature Sensor
Functional overview STM32F038x6 An analog watchdog feature allows very precise monitoring of the converted voltage of one, some or all selected channels. An interrupt is generated when the converted voltage is outside the programmed thresholds. 3.10.1 Temperature sensor The temperature sensor (TS) generates a voltage V that varies linearly with SENSE temperature. -
Page 17: Timers And Watchdogs
STM32F038x6 Functional overview 3.11 Timers and watchdogs The STM32F038x6 devices include up to five general-purpose timers and an advanced control timer. Table 5 compares the features of the different timers. Table 5. Timer feature comparison Timer Counter Counter Prescaler Capture/compare Complementary Timer request... -
Page 18: Independent Watchdog (Iwdg)
Functional overview STM32F038x6 TIM2, TIM3 STM32F038x6 devices feature two synchronizable 4-channel general-purpose timers. TIM2 is based on a 32-bit auto-reload up/downcounter and a 16-bit prescaler. TIM3 is based on a 16-bit auto-reload up/downcounter and a 16-bit prescaler. They feature 4 independent channels each for input capture/output compare, PWM or one-pulse mode output. -
Page 19: Systick Timer
STM32F038x6 Functional overview 3.11.5 SysTick timer This timer is dedicated to real-time operating systems, but could also be used as a standard down counter. It features: • a 24-bit down counter • autoreload capability • maskable system interrupt generation when the counter reaches 0 •... -
Page 20: Universal Synchronous/Asynchronous Receiver/Transmitter (Usart)
Functional overview STM32F038x6 Table 6. Comparison of I C analog and digital filters Aspect Analog filter Digital filter Pulse width of Programmable length from 1 to 15 ≥ 50 ns suppressed spikes I2Cx peripheral clocks –Extra filtering capability vs. standard requirements Benefits Available in Stop mode –Stable length... -
Page 21: Table 8. Stm32F038X6 Usart Implementation
STM32F038x6 Functional overview Table 8. STM32F038x6 USART implementation USART modes/features USART1 Hardware flow control for modem Continuous communication using DMA Multiprocessor communication Synchronous mode Smartcard mode Single-wire half-duplex communication IrDA SIR ENDEC block LIN mode Dual clock domain and wakeup from Stop mode Receiver timeout interrupt Modbus communication Auto baud rate detection... -
Page 22: Serial Peripheral Interface (Spi) / Inter-Integrated Sound Interface (I2S)
Functional overview STM32F038x6 3.15 Serial peripheral interface (SPI) / Inter-integrated sound interface (I The SPI is able to communicate up to 18 Mbit/s in slave and master modes in full-duplex and half-duplex communication modes. The 3-bit prescaler gives 8 master mode frequencies and the frame size is configurable from 4 bits to 16 bits. -
Page 23: Pinouts And Pin Description
STM32F038x6 Pinouts and pin description Pinouts and pin description Figure 3. LQFP48 package pinout Figure 4. UFQFPN32 package pinout DocID026079 Rev 3 23/102... -
Page 24: Figure 5. Ufqfpn28 Package Pinout
Pinouts and pin description STM32F038x6 Figure 5. UFQFPN28 package pinout Figure 6. WLCSP25 package pinout 1. The above figure shows the package in top view, changing from bottom view in the previous document versions. 24/102 DocID026079 Rev 3... -
Page 25: Figure 7. Tssop20 Package Pinout
STM32F038x6 Pinouts and pin description Figure 7. TSSOP20 package pinout DocID026079 Rev 3 25/102... -
Page 26: Table 10. Legend/Abbreviations Used In The Pinout Table
Pinouts and pin description STM32F038x6 Table 10. Legend/abbreviations used in the pinout table Name Abbreviation Definition Unless otherwise specified in brackets below the pin name, the pin function Pin name during and after reset is the same as the actual pin name Supply pin Pin type Input-only pin... - Page 27 STM32F038x6 Pinouts and pin description Table 11. Pin definitions (continued) Pin number Pin functions Pin name Notes Additional (function upon reset) Alternate functions functions PF0-OSC_IN OSC_IN (PF0) PF1-OSC_OUT OSC_OUT (PF1) Device reset input / internal reset output NRST (active low) VSSA Analog ground VDDA...
- Page 28 Pinouts and pin description STM32F038x6 Table 11. Pin definitions (continued) Pin number Pin functions Pin name Notes Additional (function upon reset) Alternate functions functions SPI1_MOSI, I2S1_SD, TIM3_CH2, TIM14_CH1, ADC_IN7 TIM1_CH1N, TIM17_CH1, EVENTOUT TIM3_CH3, TIM1_CH2N, ADC_IN8 EVENTOUT TIM3_CH4, TIM14_CH1, ADC_IN9 TIM1_CH3N NPOR Device power-on reset input TIM2_CH3,...
- Page 29 STM32F038x6 Pinouts and pin description Table 11. Pin definitions (continued) Pin number Pin functions Pin name Notes Additional (function upon reset) Alternate functions functions USART1_TX, TIM1_CH2, I2C1_SCL USART1_RX, TIM1_CH3, PA10 TIM17_BKIN, I2C1_SDA USART1_CTS, PA11 TIM1_CH4, EVENTOUT USART1_RTS, PA12 TIM1_ETR, EVENTOUT PA13 IR_OUT, (SWDIO)
- Page 30 Pinouts and pin description STM32F038x6 Table 11. Pin definitions (continued) Pin number Pin functions Pin name Notes Additional (function upon reset) Alternate functions functions SPI1_MOSI, I2S1_SD, I2C1_SMBA, TIM16_BKIN, TIM3_CH2 I2C1_SCL, USART1_TX, TIM16_CH1N I2C1_SDA, USART1_RX, TIM17_CH1N BOOT0 Boot memory selection I2C1_SCL, TIM16_CH1 I2C1_SDA, IR_OUT,...
-
Page 31: Table 12. Alternate Functions Selected Through Gpioa_Afr Registers For Port A
Table 12. Alternate functions selected through GPIOA_AFR registers for port A Pin name TIM2_CH1_ USART1_CTS EVENTOUT USART1_RTS TIM2_CH2 USART1_TX TIM2_CH3 USART1_RX TIM2_CH4 SPI1_NSS, USART1_CK TIM14_CH1 I2S1_WS SPI1_SCK, TIM2_CH1_ I2S1_CK SPI1_MISO, TIM3_CH1 TIM1_BKIN TIM16_CH1 EVENTOUT I2S1_MCK SPI1_MOSI, TIM3_CH2 TIM1_CH1N TIM14_CH1 TIM17_CH1 EVENTOUT I2S1_SD USART1_CK... -
Page 32: Table 13. Alternate Functions Selected Through Gpiob_Afr Registers For Port B
Table 13. Alternate functions selected through GPIOB_AFR registers for port B Pin name EVENTOUT TIM3_CH3 TIM1_CH2N TIM14_CH1 TIM3_CH4 TIM1_CH3N SPI1_SCK, I2S1_CK EVENTOUT TIM2_CH2 SPI1_MISO, I2S1_MCK TIM3_CH1 EVENTOUT SPI1_MOSI, I2S1_SD TIM3_CH2 TIM16_BKIN I2C1_SMBA USART1_TX I2C1_SCL TIM16_CH1N USART1_RX I2C1_SDA TIM17_CH1N I2C1_SCL TIM16_CH1 IR_OUT I2C1_SDA TIM17_CH1... -
Page 33: Memory Mapping
STM32F038x6 Memory mapping Memory mapping Figure 8. STM32F038x6 memory map DocID026079 Rev 3 33/102... -
Page 34: Table 14. Stm32F038X6 Peripheral Register Boundary Addresses
Memory mapping STM32F038x6 Table 14. STM32F038x6 peripheral register boundary addresses Boundary address Size Peripheral 0x4800 1800 - 0x5FFF FFFF ~384 MB Reserved 0x4800 1400 - 0x4800 17FF GPIOF 0x4800 0C00 - 0x4800 13FF Reserved AHB2 0x4800 0800 - 0x4800 0BFF GPIOC 0x4800 0400 - 0x4800 07FF GPIOB... - Page 35 STM32F038x6 Memory mapping Table 14. STM32F038x6 peripheral register boundary addresses (continued) Boundary address Size Peripheral 0x4000 7400 - 0x4000 7FFF Reserved 0x4000 7000 - 0x4000 73FF 0x4000 5800 - 0x4000 6FFF Reserved 0x4000 5400 - 0x4000 57FF I2C1 0x4000 3400 - 0x4000 53FF Reserved 0x4000 3000 - 0x4000 33FF IWDG...
-
Page 36: Electrical Characteristics
Electrical characteristics STM32F038x6 Electrical characteristics Parameter conditions Unless otherwise specified, all voltages are referenced to V 6.1.1 Minimum and maximum values Unless otherwise specified, the minimum and maximum values are guaranteed in the worst conditions of ambient temperature, supply voltage and frequencies by tests in production on 100% of the devices with an ambient temperature at T = 25 °C and T max (given by... -
Page 37: Power Supply Scheme
STM32F038x6 Electrical characteristics 6.1.6 Power supply scheme Figure 11. Power supply scheme Caution: Each power supply pair (V etc.) must be decoupled with filtering ceramic capacitors as shown above. These capacitors must be placed as close as possible to, or below, the appropriate pins on the underside of the PCB to ensure the good functionality of the device. -
Page 38: Current Consumption Measurement
Electrical characteristics STM32F038x6 6.1.7 Current consumption measurement Figure 12. Current consumption measurement scheme 38/102 DocID026079 Rev 3... -
Page 39: Absolute Maximum Ratings
STM32F038x6 Electrical characteristics Absolute maximum ratings Stresses above the absolute maximum ratings listed in Table 15: Voltage characteristics, Table 16: Current characteristics Table 17: Thermal characteristics may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these conditions is not implied. -
Page 40: Table 16. Current Characteristics
Electrical characteristics STM32F038x6 Table 16. Current characteristics Symbol Ratings Max. Unit ΣI Total current into sum of all VDD power lines (source) ΣI Total current out of sum of all VSS ground lines (sink) -120 Maximum current into each VDD power pin (source) VDD(PIN) Maximum current out of each VSS ground pin (sink) -100... -
Page 41: Operating Conditions
STM32F038x6 Electrical characteristics Operating conditions 6.3.1 General operating conditions Table 18. General operating conditions Symbol Parameter Conditions Unit Internal AHB clock frequency HCLK Internal APB clock frequency PCLK Standard operating voltage 1.65 1.95 Analog operating voltage (ADC not used) Must have a potential equal to or higher than V Analog operating voltage (ADC used) -
Page 42: Operating Conditions At Power-Up / Power-Down
Electrical characteristics STM32F038x6 6.3.2 Operating conditions at power-up / power-down The parameters given in Table 19 are derived from tests performed under the ambient temperature condition summarized in Table Table 19. Operating conditions at power-up / power-down Symbol Parameter Conditions Unit ∞... - Page 43 STM32F038x6 Electrical characteristics All Run-mode current consumption measurements given in this section are performed with a reduced code that gives a consumption equivalent to CoreMark code. Typical and maximum current consumption The MCU is placed under the following conditions: • All I/O pins are in analog input mode •...
- Page 44 Electrical characteristics STM32F038x6 Table 21. Typical and maximum current consumption from V supply at V = 1.8 V All peripherals enabled All peripherals disabled Symbol Parameter Conditions Max @ T Max @ T Unit HCLK 25 °C 85 °C 105 °C 25 °C 85 °C 105 °C...
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Page 45: Table 23. Typical And Maximum Consumption In Stop Mode
STM32F038x6 Electrical characteristics Table 22. Typical and maximum current consumption from the V supply = 2.4 V = 3.6 V Conditions Symbol Parameter Unit Max @ T Max @ T HCLK 25 °C 85 °C 105 °C 25 °C 85 °C 105 °C 48 MHz bypass, 32 MHz... -
Page 46: Table 24. Typical And Maximum Current Consumption From The Vbat Supply
Electrical characteristics STM32F038x6 Table 24. Typical and maximum current consumption from the V supply Typ @ V Symbol Parameter Conditions Unit 25 °C 85 °C 105 °C LSE & RTC ON; “Xtal mode”: lower driving capability; LSEDRV[1:0] = '00' domain µA VBAT supply... -
Page 47: Table 25. Typical Current Consumption, Code Executing From Flash Memory, Running From Hse 8 Mhz Crystal
STM32F038x6 Electrical characteristics Table 25. Typical current consumption, code executing from Flash memory, running from HSE 8 MHz crystal Typical consumption in Typical consumption in Run mode Sleep mode Symbol Parameter Unit HCLK Peripherals Peripherals Peripherals Peripherals enabled disabled enabled disabled 48 MHz 18.5... - Page 48 Electrical characteristics STM32F038x6 trigger circuits used to discriminate the input value. Unless this specific configuration is required by the application, this supply current consumption can be avoided by configuring these I/Os in analog mode. This is notably the case of ADC input pins which should be configured as analog inputs.
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Page 49: Table 26. Switching Output I/O Current Consumption
STM32F038x6 Electrical characteristics Table 26. Switching output I/O current consumption I/O toggling Symbol Parameter Conditions Unit frequency (f 2 MHz 0.09 4 MHz 0.17 = 1.8 V DDIOx 8 MHz 0.34 = 0 pF 18 MHz 0.79 C = C 36 MHz 1.50 48 MHz... -
Page 50: Table 21. Table
Electrical characteristics STM32F038x6 On-chip peripheral current consumption The current consumption of the on-chip peripherals is given in Table 27. The MCU is placed under the following conditions: • All I/O pins are in analog mode • All peripherals are disabled unless otherwise mentioned •... - Page 51 STM32F038x6 Electrical characteristics Table 27. Peripheral current consumption (continued) Peripheral Typical consumption at 25 °C Unit APB-Bridge SYSCFG TIM1 17.1 SPI1 USART1 17.4 TIM16 TIM17 µA/MHz DBG (MCU Debug Support) TIM2 17.4 TIM3 12.8 TIM14 WWDG I2C1 All APB peripherals 110.9 The BusMatrix automatically is active when at least one master is ON (CPU or DMA1).
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Page 52: Wakeup Time From Low-Power Mode
Electrical characteristics STM32F038x6 6.3.5 Wakeup time from low-power mode The wakeup times given in Table 28 are the latency between the event and the execution of the first user instruction. The device goes in low-power mode after the WFE (Wait For Event) instruction, in the case of a WFI (Wait For Interruption) instruction, 16 CPU cycles must be added to the following timings due to the interrupt latency in the Cortex M0 architecture. -
Page 53: Table 30. Low-Speed External User Clock Characteristics
STM32F038x6 Electrical characteristics Figure 13. High-speed external clock source AC timing diagram Low-speed external user clock generated from an external source In bypass mode the LSE oscillator is switched off and the input pin is a standard GPIO. The external clock signal has to respect the I/O characteristics in Section 6.3.13. -
Page 54: Table 31. Hse Oscillator Characteristics
Electrical characteristics STM32F038x6 High-speed external clock generated from a crystal/ceramic resonator The high-speed external (HSE) clock can be supplied with a 4 to 32 MHz crystal/ceramic resonator oscillator. All the information given in this paragraph are based on design simulation results obtained with typical external components specified in Table 31. -
Page 55: Table 32. Lse Oscillator Characteristics (F Lse = 32.768 Khz)
STM32F038x6 Electrical characteristics Figure 15. Typical application with an 8 MHz crystal 1. R value depends on the crystal characteristics. Low-speed external clock generated from a crystal resonator The low-speed external (LSE) clock can be supplied with a 32.768 kHz crystal resonator oscillator. -
Page 56: Internal Clock Source Characteristics
Electrical characteristics STM32F038x6 Table 32. LSE oscillator characteristics (f = 32.768 kHz) Symbol Parameter Conditions Unit LSEDRV[1:0]=00 lower driving capability LSEDRV[1:0]= 01 medium low driving capability Oscillator µA/V transconductance LSEDRV[1:0] = 10 medium high driving capability LSEDRV[1:0]=11 higher driving capability Startup time is stabilized SU(LSE) -
Page 57: Table 33. Hsi Oscillator Characteristics
STM32F038x6 Electrical characteristics High-speed internal (HSI) RC oscillator Table 33. HSI oscillator characteristics Symbol Parameter Conditions Unit Frequency TRIM HSI user trimming step DuCy Duty cycle (HSI) = -40 to 105°C -2.8 = -10 to 85°C -1.9 = 0 to 85°C -1.9 Accuracy of the HSI oscillator... -
Page 58: Table 34. Hsi14 Oscillator Characteristics
Electrical characteristics STM32F038x6 High-speed internal 14 MHz (HSI14) RC oscillator (dedicated to ADC) Table 34. HSI14 oscillator characteristics Symbol Parameter Conditions Unit Frequency HSI14 TRIM HSI14 user-trimming step DuCy Duty cycle (HSI14) = –40 to 105 °C –4.2 = –10 to 85 °C –3.2 Accuracy of the HSI14 HSI14... -
Page 59: Pll Characteristics
STM32F038x6 Electrical characteristics Low-speed internal (LSI) RC oscillator Table 35. LSI oscillator characteristics Symbol Parameter Unit Frequency LSI oscillator startup time µs su(LSI) LSI oscillator power consumption 0.75 µA DDA(LSI) 1. V = 3.3 V, T = –40 to 105 °C unless otherwise specified. 2. -
Page 60: Emc Characteristics
Electrical characteristics STM32F038x6 Table 38. Flash memory endurance and data retention Symbol Parameter Conditions Unit Endurance = –40 to +105 °C kcycle 1 kcycle at T = 85 °C Data retention 1 kcycle at T = 105 °C Year 10 kcycle at T = 55 °C 1. -
Page 61: Electrical Sensitivity Characteristics
STM32F038x6 Electrical characteristics Software recommendations The software flowchart must include the management of runaway conditions such as: • Corrupted program counter • Unexpected reset • Critical Data corruption (for example control registers) Prequalification trials Most of the common failures (unexpected reset and program counter corruption) can be reproduced by manually forcing a low state on the NRST pin or the Oscillator pins for 1 second. -
Page 62: I/O Current Injection Characteristics
Electrical characteristics STM32F038x6 Table 41. ESD absolute maximum ratings Maximum Symbol Ratings Conditions Packages Class Unit value = +25 °C, conforming Electrostatic discharge voltage 2000 ESD(HBM) (human body model) to JESD22-A114 Electrostatic discharge voltage = +25 °C, conforming ESD(CDM) (charge device model) to ANSI/ESD STM5.3.1 1. -
Page 63: I/O Port Characteristics
STM32F038x6 Electrical characteristics Table 43. I/O current injection susceptibility Functional susceptibility Symbol Description Unit Negative Positive injection injection Injected current on BOOT0 –0 Injected current on all FT, FTf and POR pins –5 Injected current on all TTa, TC and RESET pins –5 6.3.13 I/O port characteristics... - Page 64 Electrical characteristics STM32F038x6 Table 44. I/O static characteristics (continued) Symbol Parameter Conditions Unit Weak pull-up equivalent resistor kΩ Weak pull-down equivalent kΩ DDIOx resistor I/O pin capacitance 1. Data based on design simulation only. Not tested in production. 2. The leakage could be higher than the maximum value, if negative current is injected on adjacent pins. Refer to Table 43: I/O current injection susceptibility.
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Page 65: Figure 19. Tc And Tta I/O Input Characteristics
STM32F038x6 Electrical characteristics Figure 19. TC and TTa I/O input characteristics Figure 20. Five volt tolerant (FT and FTf) I/O input characteristics DocID026079 Rev 3 65/102... -
Page 66: Table 45. Output Voltage Characteristics
Electrical characteristics STM32F038x6 Output driving current The GPIOs (general purpose input/outputs) can sink or source up to +/-8 mA, and sink or source up to +/- 20 mA (with a relaxed V In the user application, the number of I/O pins which can drive current must be limited to respect the absolute maximum rating specified in Section 6.2:... -
Page 67: Table 46. I/O Ac Characteristics
STM32F038x6 Electrical characteristics Input/output AC characteristics The definition and values of input/output AC characteristics are given in Figure 21 Table 46, respectively. Unless otherwise specified, the parameters given are derived from tests performed under the ambient temperature and supply voltage conditions summarized Table 18: General operating conditions. -
Page 68: Nrst And Npor Pin Characteristics
Electrical characteristics STM32F038x6 6.3.14 NRST and NPOR pin characteristics NRST pin characteristics The NRST pin input driver uses the CMOS technology. It is connected to a permanent pull- up resistor, R Unless otherwise specified, the parameters given in the table below are derived from tests performed under the ambient temperature and supply voltage conditions summarized in Table 18: General operating conditions. -
Page 69: 12-Bit Adc Characteristics
STM32F038x6 Electrical characteristics Table 48. NPOR pin characteristics Symbol Parameter Conditions Unit NPOR Input low level voltage 0.475 V - 0.2 IL(NPOR) NPOR Input high level 0.5 V + 0.2 IH(NPOR) voltage NPOR Schmitt trigger voltage hys(NPOR) hysteresis Weak pull-up equivalent kΩ... -
Page 70: Table 50. Rain Max For F Adc = 14 Mhz
Electrical characteristics STM32F038x6 Table 49. ADC characteristics (continued) Symbol Parameter Conditions Unit 1.5 ADC 1.5 ADC cycles + 3 ADC clock = HSI14 cycles + 2 cycles cycles PCLK PCLK ADC_DR register ready (2)(4) LATENCY PCLK latency ADC clock = PCLK/2 cycle PCLK ADC clock = PCLK/4... -
Page 71: Table 51. Adc Accuracy
STM32F038x6 Electrical characteristics Table 50. R max for f = 14 MHz (continued) (cycles) (µs) max (kΩ) 28.5 2.04 25.2 41.5 2.96 37.2 55.5 3.96 71.5 5.11 239.5 17.1 1. Guaranteed by design, not tested in production. (1)(2)(3) Table 51. ADC accuracy Symbol Parameter Test conditions... -
Page 72: Figure 23. Adc Accuracy Characteristics
Electrical characteristics STM32F038x6 Figure 23. ADC accuracy characteristics Figure 24. Typical connection diagram using the ADC 1. Refer to Table 49: ADC characteristics for the values of R and C 2. C represents the capacitance of the PCB (dependent on soldering and PCB layout quality) plus the parasitic pad capacitance (roughly 7 pF). -
Page 73: Temperature Sensor Characteristics
STM32F038x6 Electrical characteristics 6.3.16 Temperature sensor characteristics Table 52. TS characteristics Symbol Parameter Unit ± 1 ± 2 linearity with temperature °C SENSE Avg_Slope Average slope mV/°C Voltage at 30 °C (± 5 °C) 1.34 1.43 1.52 ADC_IN16 buffer startup time µs START ADC sampling time when reading the... -
Page 74: Communication Interfaces
Electrical characteristics STM32F038x6 Table 55. IWDG min/max timeout period at 40 kHz (LSI) Min timeout RL[11:0]= Max timeout RL[11:0]= Prescaler divider PR[2:0] bits Unit 0x000 0xFFF 409.6 819.2 1638.4 3276.8 6553.6 /128 13107.2 /256 6 or 7 26214.4 1. These timings are given for a 40 kHz clock but the microcontroller internal RC frequency can vary from 30 to 60 kHz. -
Page 75: Table 57. I2C Analog Filter Characteristics
STM32F038x6 Electrical characteristics Table 57. I C analog filter characteristics Symbol Parameter Unit Maximum width of spikes that are suppressed by the analog filter 1. Guaranteed by design, not tested in production. 2. Spikes with widths below t are filtered. AF(min) 3. -
Page 76: Figure 25. Spi Timing Diagram - Slave Mode And Cpha = 0
Electrical characteristics STM32F038x6 Figure 25. SPI timing diagram - slave mode and CPHA = 0 Figure 26. SPI timing diagram - slave mode and CPHA = 1 1. Measurement points are done at CMOS levels: 0.3 V and 0.7 V 76/102 DocID026079 Rev 3... -
Page 77: Table 59. I 2 S Characteristics
STM32F038x6 Electrical characteristics Figure 27. SPI timing diagram - master mode 1. Measurement points are done at CMOS levels: 0.3 V and 0.7 V Table 59. I S characteristics Symbol Parameter Conditions Unit Master mode (data: 16 bits, Audio 1.597 1.601 frequency = 48 kHz) S clock frequency... -
Page 78: Figure 28. I2S Slave Timing Diagram (Philips Protocol)
Electrical characteristics STM32F038x6 Table 59. I S characteristics (continued) Symbol Parameter Conditions Unit Master receiver su(SD_MR) Data input setup time Slave receiver su(SD_SR) Master receiver h(SD_MR) Data input hold time Slave receiver h(SD_SR) Master transmitter v(SD_MT) Data output valid time Slave transmitter v(SD_ST) Master transmitter... -
Page 79: Figure 29. I2S Master Timing Diagram (Philips Protocol)
STM32F038x6 Electrical characteristics Figure 29. I S master timing diagram (Philips protocol) 1. Data based on characterization results, not tested in production. 2. LSB transmit/receive of the previously transmitted byte. No LSB transmit/receive is sent before the first byte. DocID026079 Rev 3 79/102... -
Page 80: Package Information
Package information STM32F038x6 Package information In order to meet environmental requirements, ST offers these devices in different grades of ® ® ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ®... -
Page 81: Table 60. Lqfp48 Package Mechanical Data
STM32F038x6 Package information Table 60. LQFP48 package mechanical data millimeters inches Symbol 1.600 0.0630 0.050 0.150 0.0020 0.0059 1.350 1.400 1.450 0.0531 0.0551 0.0571 0.170 0.220 0.270 0.0067 0.0087 0.0106 0.090 0.200 0.0035 0.0079 8.800 9.000 9.200 0.3465 0.3543 0.3622 6.800 7.000 7.200... -
Page 82: Ufqfpn32 Package Information
Package information STM32F038x6 Device marking The following figure gives an example of topside marking orientation versus pin 1 identifier location. Figure 32. LQFP48 package marking example 1. Parts marked as "ES", "E" or accompanied by an Engineering Sample notification letter, are not yet qualified and therefore not yet ready to be used in production and any consequences deriving from such usage will not be at ST charge. -
Page 83: Figure 33. Ufqfpn32 Package Outline
STM32F038x6 Package information Figure 33. UFQFPN32 package outline 1. Drawing is not to scale. 2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life. 3. There is an exposed die pad on the underside of the UFQFPN package. This pad is used for the device ground and must be connected. -
Page 84: Table 61. Ufqfpn32 Package Mechanical Data
Package information STM32F038x6 Table 61. UFQFPN32 package mechanical data millimeters inches Symbol 0.500 0.550 0.600 0.0197 0.0217 0.0236 0.000 0.020 0.050 0.0000 0.0008 0.0020 0.152 0.0060 0.180 0.230 0.280 0.0071 0.0091 0.0110 4.900 5.000 5.100 0.1929 0.1969 0.2008 3.400 3.500 3.600 0.1339 0.1378... -
Page 85: Figure 35. Ufqfpn32 Package Marking Example
STM32F038x6 Package information Device marking The following figure gives an example of topside marking orientation versus pin 1 identifier location. Figure 35. UFQFPN32 package marking example 1. Parts marked as "ES", "E" or accompanied by an Engineering Sample notification letter, are not yet qualified and therefore not yet ready to be used in production and any consequences deriving from such usage will not be at ST charge. -
Page 86: Ufqfpn28 Package Information
Package information STM32F038x6 UFQFPN28 package information UFQFPN28 is a 28-lead, 4x4 mm, 0.5 mm pitch, ultra-thin fine-pitch quad flat package. Figure 36. UFQFPN28 package outline 1. Drawing is not to scale. Table 62. UFQFPN28 package mechanical data millimeters inches Symbol 0.500 0.550 0.600... -
Page 87: Figure 37. Recommended Footprint For Ufqfpn28 Package
STM32F038x6 Package information 1. Values in inches are converted from mm and rounded to 4 decimal digits. Figure 37. Recommended footprint for UFQFPN28 package 1. Dimensions are expressed in millimeters. DocID026079 Rev 3 87/102... -
Page 88: Figure 38. Ufqfpn28 Package Marking Example
Package information STM32F038x6 Device marking The following figure gives an example of topside marking orientation versus pin 1 identifier location. Figure 38. UFQFPN28 package marking example 1. Parts marked as "ES", "E" or accompanied by an Engineering Sample notification letter, are not yet qualified and therefore not yet ready to be used in production and any consequences deriving from such usage will not be at ST charge. -
Page 89: Wlcsp25 Package Information
STM32F038x6 Package information WLCSP25 package information WLCSP25 is a 25-ball, 2.423 x 2.325 mm, 0.4 mm pitch wafer level chip scale package. Figure 39. WLCSP25 package outline 1. Drawing is not to scale. Table 63. WLCSP25 package mechanical data millimeters inches Symbol 0.525... -
Page 90: Table 64. Wlcsp25 Recommended Pcb Design Rules
Package information STM32F038x6 Table 63. WLCSP25 package mechanical data (continued) millimeters inches Symbol 0.100 0.0039 0.100 0.0039 0.100 0.0039 0.050 0.0020 0.050 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. 2. Back side coating. 3. -
Page 91: Figure 41. Wlcsp25 Package Marking Example
STM32F038x6 Package information Device marking The following figure gives an example of topside marking orientation versus ball A1 identifier location. Figure 41. WLCSP25 package marking example 1. Parts marked as "ES", "E" or accompanied by an Engineering Sample notification letter, are not yet qualified and therefore not yet ready to be used in production and any consequences deriving from such usage will not be at ST charge. -
Page 92: Tssop20 Package Information
Package information STM32F038x6 TSSOP20 package information TSSOP20 is a 20-lead thin shrink small-outline, 6.5 x 4.4 mm, 0.65 mm pitch, package. Figure 42.TSSOP20 package outline 1. Drawing is not to scale. Table 65. TSSOP20 package mechanical data millimeters inches Symbol Min. -
Page 93: Figure 43. Recommended Footprint For Tssop20 Package
STM32F038x6 Package information Table 65. TSSOP20 package mechanical data (continued) millimeters inches Symbol Min. Typ. Max. Min. Typ. Max. 0° 8° 0° 8° 0.100 0.0039 1. Values in inches are converted from mm and rounded to four decimal digits. 2. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed 0.15mm per side. -
Page 94: Figure 44. Tssop20 Package Marking Example
Package information STM32F038x6 Device marking The following figure gives an example of topside marking orientation versus pin 1 identifier location. Figure 44. TSSOP20 package marking example 1. Parts marked as "ES", "E" or accompanied by an Engineering Sample notification letter, are not yet qualified and therefore not yet ready to be used in production and any consequences deriving from such usage will not be at ST charge. -
Page 95: Thermal Characteristics
STM32F038x6 Package information Thermal characteristics The maximum chip junction temperature (T max) must never exceed the values given in Table 18: General operating conditions. The maximum chip-junction temperature, T max, in degrees Celsius, may be calculated using the following equation: max = T max + (P max x Θ... -
Page 96: Selecting The Product Temperature Range
Package information STM32F038x6 7.6.2 Selecting the product temperature range When ordering the microcontroller, the temperature range is specified in the ordering information scheme shown in Section 8: Part numbering. Each temperature range suffix corresponds to a specific guaranteed ambient temperature at maximum dissipation and, to a specific maximum junction temperature. - Page 97 STM32F038x6 Package information Assuming the following application conditions: Maximum ambient temperature T = 100 °C (measured according to JESD51-2), Amax = 20 mA, V = 3.5 V, maximum 20 I/Os used at the same time in output at low DDmax level with I = 8 mA, V = 0.4 V...
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Page 98: Part Numbering
Part numbering STM32F038x6 Part numbering For a list of available options (memory, package, and so on) or for further information on any aspect of this device, please contact your nearest ST sales office. Table 67. Ordering information scheme Example: STM32 038 G Device family STM32 = ARM-based 32-bit microcontroller... -
Page 99: Revision History
STM32F038x6 Revision history Revision history Table 68. Document revision history Date Revision Changes 28-May-2014 Initial release. Updated: – Table 2: STM32F038x6 family device features and peripheral counts – Figure 8: STM32F038x6 memory map – AF1 alternate functions for PA0, PA1, PA2, PA3 and PA4 in Table 11: Alternate functions selected through GPIOA_AFR registers for port A –... -
Page 100: Table 7. Stm32F038X6 I 2 C Implementation
Revision history STM32F038x6 Table 68. Document revision history (continued) Date Revision Changes Added WLCSP25 package, updates in the following: – Table 1: Device summary – Section 2: Description – Table 2: STM32F038x6 family device features and peripheral counts – Section 4: Pinouts and pin description: addition of 24-Sep-2015 (continued) Figure 6: WLCSP25 25-ball package ballout (bump... - Page 101 STM32F038x6 Revision history Table 68. Document revision history (continued) Date Revision Changes – Table 49: ADC characteristics - updated some parameter values, test conditions and added footnotes – Section 6.3.15: 12-bit ADC characteristics - changed introductory sentence – Table 59: I2S characteristics: table reorganized, 16-Dec-2015 max value updated...
- Page 102 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders.
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