Figure 27. Maximum Dynamic Current Consumption On V; Conversion - STMicroelectronics STM32L162RC Manual

Ultra-low-power 32-bit mcu arm-based cortex -m3, 256kb flash, 32kb sram, 8kb eeprom, lcd, usb, adc, dac, aes
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STM32L162VC, STM32L162RC

Figure 27. Maximum dynamic current consumption on V

ADC clock
I
ref+
700µA
300µA
Ts
Multiplexed channels
(µs)
2.4 V < V
< 3.6 V 1.8 V < V
DDA
0.25
Not allowed
0.5625
0.8
1
2.0
1.5
3.0
3
6.8
6
15.0
12
32.0
24
50.0
1. Guaranteed by design.
2. Number of samples calculated for f
with respect to the minimum sampling time Ts (µs),
General PCB design guidelines
Power supply decoupling should be performed as shown in
procedure depends on whether V
should be ceramic (good quality). They should be placed as close as possible to the chip.
Sampling (n cycles)
Table 58. Maximum source impedance R
R
AIN
< 2.4 V 2.4 V < V
DDA
Not allowed
Not allowed
0.8
1.8
4.0
10.0
25.0
50.0
= 16 MHz. For f
ADC
DocID022881 Rev 10

conversion

Conversion (12 cycles)
max (kΩ)
Direct channels
< 3.6 V 1.8 V < V
DDA
0.7
2.0
4.0
6.0
15.0
30.0
50.0
50.0
= 8 and 4 MHz the number of sampling cycles can be reduced
ADC
is connected to V
REF+
supply pin during ADC
REF+
(1)
max
AIN
f
< 2.4 V
DDA
Not allowed
1.0
3.0
4.5
10.0
20.0
40.0
50.0
Figure
9. The applicable
or not. The 100 nF capacitors
DDA
MS36686V1
Ts (cycles)
(2)
=16 MHz
ADC
4
9
16
24
48
96
192
384
97/123
104

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