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Ultra-low-power 32-bit MCU ARM
Flash, 80KB SRAM, 16KB EEPROM, LCD, USB, ADC, DAC
Features
• Ultra-low-power platform
– 1.65 V to 3.6 V power supply
– -40 °C to 105 °C temperature range
– 290 nA Standby mode (3 wakeup pins)
– 1.11 µA Standby mode + RTC
– 560 nA Stop mode (16 wakeup lines)
– 1.4 µA Stop mode + RTC
– 11 µA Low-power run mode down to 4.6 µA
in Low-power sleep mode
– 195 µA/MHz Run mode
– 10 nA ultra-low I/O leakage
– 8 µs wakeup time
®
• Core: ARM
Cortex
– From 32 kHz up to 32 MHz max
– 1.25 DMIPS/MHz (Dhrystone 2.1)
– Memory protection unit
• Up to 34 capacitive sensing channels
• CRC calculation unit, 96-bit unique ID
• Reset and supply management
– Low-power, ultrasafe BOR (brownout reset)
with 5 selectable thresholds
– Ultra-low-power POR/PDR
– Programmable voltage detector (PVD)
• Clock sources
– 1 to 24 MHz crystal oscillator
– 32 kHz oscillator for RTC with calibration
– Internal 16 MHz oscillator factory trimmed
RC(+/-1%) with PLL option
– Internal low-power 37 kHz oscillator
– Internal multispeed low-power 65 kHz to
4.2 MHz oscillator
– PLL for CPU clock and USB (48 MHz)
• Pre-programmed bootloader
– USB and USART supported
February 2016
This is information on a product in full production.
STM32L151xE STM32L152xE
®
-M3 32-bit CPU
DocID025433 Rev 8
®
-based Cortex
LQFP144 (20 × 20 mm)
LQFP100 (14 × 14 mm)
LQFP64 (10 × 10 mm)
• Up to 116 fast I/Os (102 I/Os 5V tolerant), all
mappable on 16 external interrupt vectors
• Memories
– 512 KB Flash memory with ECC (with 2
banks of 256 KB enabling RWW capability)
– 80 KB RAM
– 16 KB of true EEPROM with ECC
– 128 Byte backup register
• LCD driver (except STM32L151xE devices) up
to 8x40 segments, contrast adjustment,
blinking mode, step-up converter
• Rich analog peripherals (down to 1.8 V)
– 2x operational amplifiers
– 12-bit ADC 1 Msps up to 40 channels
– 12-bit DAC 2 ch with output buffers
– 2x ultra-low-power comparators
(window mode and wake up capability)
• DMA controller 12x channels
• 11x peripheral communication interfaces
– 1x USB 2.0 (internal 48 MHz PLL)
– 5x USARTs
– Up to 8x SPIs (2x I2S, 3x 16 Mbit/s)
2
– 2x I
Cs (SMBus/PMBus)
• 11x timers: 1x 32-bit, 6x 16-bit with up to 4
IC/OC/PWM channels, 2x 16-bit basic timers,
2x watchdog timers (independent and window)
• Development support: serial wire debug, JTAG
and trace
Table 1. Device summary
Reference
STM32L151QE, STM32L151RE,
STM32L151xE
STM32L151VE, STM32L151ZE
STM32L152QE, STM32L152RE,
STM32L152xE
STM32L152VE, STM32L152ZE
®
-M3 with 512KB
-
Datasheet
production data
WLCSP104
UFBGA132
(7 × 7 mm)
Part number
1/134
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Table of Contents
Related Manuals for STMicroelectronics STM32L151RE
Summary of Contents for STMicroelectronics STM32L151RE
- Page 1 – Internal multispeed low-power 65 kHz to 4.2 MHz oscillator Table 1. Device summary – PLL for CPU clock and USB (48 MHz) Reference Part number • Pre-programmed bootloader STM32L151QE, STM32L151RE, – USB and USART supported STM32L151xE STM32L151VE, STM32L151ZE STM32L152QE, STM32L152RE, STM32L152xE STM32L152VE, STM32L152ZE...
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Page 2: Table Of Contents
Contents STM32L151xE STM32L152xE Contents Introduction ..........9 Description . - Page 3 STM32L151xE STM32L152xE Contents 3.16 Timers and watchdogs ........28 3.16.1 General-purpose timers (TIM2, TIM3, TIM4, TIM5, TIM9, TIM10 and TIM11) .
- Page 4 Contents STM32L151xE STM32L152xE 6.3.4 Supply current characteristics ....... . 64 6.3.5 Wakeup time from low-power mode .
- Page 5 STM32L151xE STM32L152xE List of tables List of tables Table 1. Device summary ............1 Table 2.
- Page 6 List of tables STM32L151xE STM32L152xE Table 47. C characteristics............94 Table 48.
- Page 7 STM32L151xE STM32L152xE List of figures List of figures Figure 1. Ultra-low-power STM32L151xE and STM32L152xE block diagram....13 Figure 2. Clock tree ............. . 22 Figure 3.
- Page 8 List of figures STM32L151xE STM32L152xE Figure 43. WLCSP104, 0.4 mm pitch wafer level chip scale package outline ....126 Figure 44. WLCSP104, 0.4 mm pitch wafer level chip scale package recommended footprint..127 Figure 45.
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Page 9: Introduction
This STM32L151xE and STM32L152xE datasheet should be read in conjunction with the STM32L1xxxx reference manual (RM0038). The application note “Getting started with STM32L1xxxx hardware development” (AN3216) gives a hardware implementation overview. Both documents are available from the STMicroelectronics website www.st.com. ® ®... -
Page 10: Description
Description STM32L151xE STM32L152xE Description The ultra-low-power STM32L151xE and STM32L152xE devices incorporate the ® connectivity power of the universal serial bus (USB) with the high-performance ARM ® Cortex -M3 32-bit RISC core operating at a frequency of 32 MHz (33.3 DMIPS), a memory protection unit (MPU), high-speed embedded memories (Flash memory up to 512 Kbytes and RAM up to 80 Kbytes), and an extensive range of enhanced I/Os and peripherals connected to two APB buses. -
Page 11: Device Overview
STM32L151xE STM32L152xE Description Device overview Table 2. Ultra-low-power STM32L151xE and STM32L152xE device features and peripheral counts Peripheral STM32L15xRE STM32L15xVE STM32L15xQE STM32L15xZE Flash (Kbytes) Data EEPROM (Kbytes) RAM (Kbytes) 32 bit Timers General-purpose Basic 8(3) Communication interfaces USART GPIOs Operational amplifiers 12-bit synchronized ADC Number of channels 12-bit DAC... -
Page 12: Ultra-Low-Power Device Continuum
BOM. Note: STMicroelectronics as a reliable and long-term manufacturer ensures as much as possible the pin-to-pin compatibility between any STM8Lxxxxx and STM32Lxxxxx devices and between any of the STM32Lx and STM32Fx series. Thanks to this unprecedented scalability, the old applications can be upgraded to respond to the latest market features and efficiency demand. -
Page 13: Functional Overview
STM32L151xE STM32L152xE Functional overview Functional overview Figure 1. Ultra-low-power STM32L151xE and STM32L152xE block diagram DocID025433 Rev 8 13/134... -
Page 14: Low-Power Modes
Functional overview STM32L151xE STM32L152xE Low-power modes The ultra-low-power STM32L151xE and STM32L152xE devices support dynamic voltage scaling to optimize its power consumption in run mode. The voltage from the internal low- drop regulator that supplies the logic can be adjusted according to the system’s maximum operating frequency and the external voltage supply. -
Page 15: Table 3. Functionalities Depending On The Operating Power Supply Range
STM32L151xE STM32L152xE Functional overview • Stop mode without RTC Stop mode achieves the lowest power consumption while retaining the RAM and register contents. All clocks are stopped, the PLL, MSI RC, HSI and LSI RC, LSE and HSE crystal oscillators are disabled. The voltage regulator is in the low-power mode. The device can be woken up from Stop mode by any of the EXTI line, in 8 µs. -
Page 16: Table 4. Cpu Frequency Range Depending On Dynamic Voltage Scaling
Functional overview STM32L151xE STM32L152xE Table 3. Functionalities depending on the operating power supply range (continued) Functionalities depending on the operating power supply range Operating power supply DAC and ADC Dynamic voltage I/O operation range operation scaling range Conversion time up Range 1, Range 2 = 2.0 to 2.4 V Functional... -
Page 17: Table 5. Functionalities Depending On The Working Mode
STM32L151xE STM32L152xE Functional overview Table 5. Functionalities depending on the working mode (from Run/active down to standby) Stop Standby Low- Low- Run/Active Sleep power power Wakeup Wakeup Sleep capability capability Flash Backup Registers EEPROM Brown-out rest (BOR) Programmable Voltage Detector (PVD) Power On Reset (POR) -
Page 18: Arm ® Cortex ® -M3 Core With Mpu
Functional overview STM32L151xE STM32L152xE Table 5. Functionalities depending on the working mode (from Run/active down to standby) (continued) Stop Standby Low- Low- Run/Active Sleep power power Wakeup Wakeup Sleep capability capability Tempsensor OP amp Comparators 16-bit and 32-bit Timers IWDG WWDG Touch sensing Systic Timer... -
Page 19: Reset And Supply Management
STM32L151xE STM32L152xE Functional overview The memory protection unit (MPU) improves system reliability by defining the memory attributes (such as read/write access permissions) for different memory regions. It provides up to eight different regions and an optional predefined background region. Owing to its embedded ARM core, the STM32L151xE and STM32L152xE devices are compatible with all ARM tools and software. -
Page 20: Voltage Regulator
Functional overview STM32L151xE STM32L152xE power ramp-up should guarantee that 1.65 V is reached on V at least 1 ms after it exits the POR area. Five BOR thresholds are available through option bytes, starting from 1.8 V to 3 V. To reduce the power consumption in Stop mode, it is possible to automatically switch off the internal reference voltage (V ) in Stop mode. -
Page 21: Clock Management
STM32L151xE STM32L152xE Functional overview Clock management The clock controller distributes the clocks coming from different oscillators to the core and the peripherals. It also manages clock gating for low-power modes and ensures clock robustness. It features: • Clock prescaler: to get the best trade-off between speed and current consumption, the clock frequency to the CPU and peripherals can be adjusted by a programmable prescaler. -
Page 22: Figure 2. Clock Tree
Functional overview STM32L151xE STM32L152xE Figure 2. Clock tree 1. For the USB function to be available, both HSE and PLL must be enabled, with the CPU running at either 24 MHz or 32 MHz. 22/134 DocID025433 Rev 8... -
Page 23: Low-Power Real-Time Clock And Backup Registers
STM32L151xE STM32L152xE Functional overview Low-power real-time clock and backup registers The real-time clock (RTC) is an independent BCD timer/counter. Dedicated registers contain the sub-second, second, minute, hour (12/24 hour), week day, date, month, year, in BCD (binary-coded decimal) format. Correction for 28, 29 (leap year), 30, and 31 day of the month are made automatically. -
Page 24: Memories
Functional overview STM32L151xE STM32L152xE Memories The STM32L151xE and STM32L152xE devices have the following features: • 80 Kbytes of embedded RAM accessed (read/write) at CPU clock speed with 0 wait states. With the enhanced bus matrix, operating the RAM does not lead to any performance penalty during accesses to the system bus (AHB and APB buses). -
Page 25: Lcd (Liquid Crystal Display)
STM32L151xE STM32L152xE Functional overview LCD (liquid crystal display) The LCD drives up to 8 common terminals and 44 segment terminals to drive up to 320 pixels. • Internal step-up converter to guarantee functionality and contrast control irrespective of . This converter can be deactivated, in which case the V pin is used to provide the voltage to the LCD •... -
Page 26: Internal Voltage Reference (Vrefint )
Functional overview STM32L151xE STM32L152xE stored by ST in the system memory area, accessible in read-only mode. See Table 60: Temperature sensor calibration values. 3.10.2 Internal voltage reference (V REFINT The internal voltage reference (V ) provides a stable (bandgap) voltage output for the REFINT ADC and Comparators. -
Page 27: Ultra-Low-Power Comparators And Reference Voltage
STM32L151xE STM32L152xE Functional overview 3.13 Ultra-low-power comparators and reference voltage The STM32L151xE and STM32L152xE devices embed two comparators sharing the same current bias and reference voltage. The reference voltage can be internal or external (coming from an I/O). • One comparator with fixed threshold •... -
Page 28: Timers And Watchdogs
Functional overview STM32L151xE STM32L152xE 3.16 Timers and watchdogs The ultra-low-power STM32L151xE and STM32L152xE devices include seven general- purpose timers, two basic timers, and two watchdog timers. Table 6 compares the features of the general-purpose and basic timers. Table 6. Timer feature comparison Counter Capture/compare Complementary... -
Page 29: Basic Timers (Tim6 And Tim7)
STM32L151xE STM32L152xE Functional overview They can also be used as simple time bases and be clocked by the LSE clock source (32.768 kHz) to provide time bases independent from the main CPU clock. 3.16.2 Basic timers (TIM6 and TIM7) These timers are mainly used for DAC trigger generation. They can also be used as generic 16-bit time bases. -
Page 30: Serial Peripheral Interface (Spi)
Functional overview STM32L151xE STM32L152xE 3.17.3 Serial peripheral interface (SPI) Up to three SPIs are able to communicate at up to 16 Mbits/s in slave and master modes in full-duplex and half-duplex communication modes. The 3-bit prescaler gives 8 master mode frequencies and the frame is configurable to 8 bits or 16 bits. -
Page 31: Development Support
STM32L151xE STM32L152xE Functional overview 3.19 Development support 3.19.1 Serial wire JTAG debug port (SWJ-DP) The ARM SWJ-DP interface is embedded, and is a combined JTAG and serial wire debug port that enables either a serial wire debug or a JTAG probe to be connected to the target. The JTAG JTMS and JTCK pins are shared with SWDAT and SWCLK, respectively, and a specific sequence on the JTMS pin is used to switch between JTAG-DP and SW-DP. -
Page 32: Pin Descriptions
Pin descriptions STM32L151xE STM32L152xE Pin descriptions Figure 3. STM32L15xZE LQFP144 pinout 1. This figure shows the package top view. 32/134 DocID025433 Rev 8... -
Page 33: Figure 4. Stm32L15Xqe Ufbga132 Ballout
STM32L151xE STM32L152xE Pin descriptions Figure 4. STM32L15xQE UFBGA132 ballout 1. This figure shows the package top view. DocID025433 Rev 8 33/134... -
Page 34: Figure 5. Stm32L15Xve Lqfp100 Pinout
Pin descriptions STM32L151xE STM32L152xE Figure 5. STM32L15xVE LQFP100 pinout 1. This figure shows the package top view. 34/134 DocID025433 Rev 8... -
Page 35: Figure 6. Stm32L15Xre Lqfp64 Pinout
STM32L151xE STM32L152xE Pin descriptions Figure 6. STM32L15xRE LQFP64 pinout 1. This figure shows the package top view. DocID025433 Rev 8 35/134... -
Page 36: Table 7. Legend/Abbreviations Used In The Pinout Table
Pin descriptions STM32L151xE STM32L152xE Figure 7. STM32L15xVEY WLCSP104 ballout 1. This figure shows the package top view. Table 7. Legend/abbreviations used in the pinout table Name Abbreviation Definition Unless otherwise specified in brackets below the pin name, the pin function Pin name during and after reset is the same as the actual pin name Supply pin... -
Page 37: Table 8. Stm32L151Xe And Stm32L152Xe Pin Definitions
STM32L151xE STM32L152xE Pin descriptions Table 7. Legend/abbreviations used in the pinout table (continued) Name Abbreviation Definition Unless otherwise specified by a note, all I/Os are set as floating inputs during Notes and after reset Alternate Functions selected through GPIOx_AFR registers functions functions Additional... - Page 38 Pin descriptions STM32L151xE STM32L152xE Table 8. STM32L151xE and STM32L152xE pin definitions (continued) Pins Pin functions Main function Pin name Additional (after Alternate functions functions reset) SS_5 SS_5 DD_5 DD_5 TIM5_CH1/TIM5_ETR ADC_IN27 ADC_IN28/ TIM5_CH2 COMP1_INP ADC_IN29/ TIM5_CH3 COMP1_INP ADC_IN30/ TIM5_CH4 COMP1_INP ADC_IN31/ PF10 PF10...
- Page 39 STM32L151xE STM32L152xE Pin descriptions Table 8. STM32L151xE and STM32L152xE pin definitions (continued) Pins Pin functions Main function Pin name Additional (after Alternate functions functions reset) TIM2_CH1_ETR/ WKUP1/RTC_TA 14 K9 PA0-WKUP1 TIM5_CH1/ MP2/ADC_IN0/ USART2_CTS COMP1_INP TIM2_CH2/TIM5_CH2/ ADC_IN1/ USART2_RTS/ COMP1_INP/ LCD_SEG0 OPAMP1_VINP TIM2_CH3/TIM5_CH3/ ADC_IN2/ TIM9_CH1/...
- Page 40 Pin descriptions STM32L151xE STM32L152xE Table 8. STM32L151xE and STM32L152xE pin definitions (continued) Pins Pin functions Main function Pin name Additional (after Alternate functions functions reset) OPAMP2_ OPAMP2_VINM VINM ADC_IN14/ LCD_SEG22 COMP1_INP ADC_IN15/ 25 M7 LCD_SEG23 COMP1_INP ADC_IN8/ COMP1_INP/ TIM3_CH3/LCD_SEG5 OPAMP2_VOUT/ VREF_OUT ADC_IN9/ 27 K6...
- Page 41 STM32L151xE STM32L152xE Pin descriptions Table 8. STM32L151xE and STM32L152xE pin definitions (continued) Pins Pin functions Main function Pin name Additional (after Alternate functions functions reset) ADC_IN25/ PE10 PE10 TIM2_CH2 COMP1_INP PE11 PE11 TIM2_CH3 PE12 PE12 TIM2_CH4/SPI1_NSS PE13 PE13 SPI1_SCK PE14 PE14 SPI1_MISO PE15...
- Page 42 Pin descriptions STM32L151xE STM32L152xE Table 8. STM32L151xE and STM32L152xE pin definitions (continued) Pins Pin functions Main function Pin name Additional (after Alternate functions functions reset) USART3_CK/ PD10 PD10 LCD_SEG30 USART3_CTS/ PD11 PD11 LCD_SEG31 TIM4_CH1/ PD12 PD12 USART3_RTS/ LCD_SEG32 PD13 PD13 TIM4_CH2/LCD_SEG33 SS_8 SS_8...
- Page 43 STM32L151xE STM32L152xE Pin descriptions Table 8. STM32L151xE and STM32L152xE pin definitions (continued) Pins Pin functions Main function Pin name Additional (after Alternate functions functions reset) USART1_RX / 102 C12 PA10 PA10 LCD_COM2 USART1_CTS/ 103 B12 44 E1 PA11 PA11 USB_DM SPI1_MISO USART1_RTS/ 104 A12...
- Page 44 Pin descriptions STM32L151xE STM32L152xE Table 8. STM32L151xE and STM32L152xE pin definitions (continued) Pins Pin functions Main function Pin name Additional (after Alternate functions functions reset) TIM3_ETR/UART5_RX/ 54 C3 LCD_SEG31/ LCD_SEG43/LCD_COM7 SPI2_MISO/ USART2_CTS SPI2_MOSI/I2S2_SD/ USART2_RTS USART2_TX SS_10 SS_10 DD_10 DD_10 USART2_RX TIM9_CH2/USART2_CK PG10 PG10...
- Page 45 STM32L151xE STM32L152xE Pin descriptions Table 8. STM32L151xE and STM32L152xE pin definitions (continued) Pins Pin functions Main function Pin name Additional (after Alternate functions functions reset) COMP2_INP TIM4_CH1/I2C1_SCL/ 58 C5 USART1_TX TIM4_CH2/I2C1_SDA/ COMP2_INP/ 59 B6 USART1_RX PVD_IN 60 A7 BOOT0 BOOT0 TIM4_CH3/TIM10_CH1/ 61 D5 I2C1_SCL/...
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Page 46: Table 9. Alternate Function Input/Output
Alternate functions Table 9. Alternate function input/output Digital alternate function number AFIO0 AFIO1 AFIO2 AFIO3 AFIO4 AFIO5 AFIO6 AFIO7 AFIO8 AFIO11 AFIO14 AFIO15 Port name Alternate function TIM3/4/ TIM9/ USART1/2/ UART4/ SYSTEM TIM2 I2C1/2 SPI1/2 SPI3 CPRI SYSTEM 10/11 EVENT BOOT0 BOOT0 NRST... - Page 47 Table 9. Alternate function input/output (continued) Digital alternate function number AFIO0 AFIO1 AFIO2 AFIO3 AFIO4 AFIO5 AFIO6 AFIO7 AFIO8 AFIO11 AFIO14 AFIO15 Port name Alternate function TIM3/4/ TIM9/ USART1/2/ UART4/ SYSTEM TIM2 I2C1/2 SPI1/2 SPI3 CPRI SYSTEM 10/11 EVENT PA11 SPI1_MISO USART1_CTS - TIMx_IC4...
- Page 48 EVENT TIM4_CH4 TIM11_CH1 I2C1_SDA - COM3 EVENT PB10 TIM2_CH3 I2C2_SCL USART3_TX - SEG10...
- Page 49 Table 9. Alternate function input/output (continued) Digital alternate function number AFIO0 AFIO1 AFIO2 AFIO3 AFIO4 AFIO5 AFIO6 AFIO7 AFIO8 AFIO11 AFIO14 AFIO15 Port name Alternate function TIM3/4/ TIM9/ USART1/2/ UART4/ SYSTEM TIM2 I2C1/2 SPI1/2 SPI3 CPRI SYSTEM 10/11 EVENT TIM3_CH2 I2S3_MCK - SEG25 - TIMx_IC4...
- Page 50 Table 9. Alternate function input/output (continued) Digital alternate function number AFIO0 AFIO1 AFIO2 AFIO3 AFIO4 AFIO5 AFIO6 AFIO7 AFIO8 AFIO11 AFIO14 AFIO15 Port name Alternate function TIM3/4/ TIM9/ USART1/2/ UART4/ SYSTEM TIM2 I2C1/2 SPI1/2 SPI3 CPRI SYSTEM 10/11 SPI2_MOSI EVENT USART2_RTS - TIMx_IC1 I2S2_SD...
- Page 51 Table 9. Alternate function input/output (continued) Digital alternate function number AFIO0 AFIO1 AFIO2 AFIO3 AFIO4 AFIO5 AFIO6 AFIO7 AFIO8 AFIO11 AFIO14 AFIO15 Port name Alternate function TIM3/4/ TIM9/ USART1/2/ UART4/ SYSTEM TIM2 I2C1/2 SPI1/2 SPI3 CPRI SYSTEM 10/11 EVENT TRACECK TIM3_ETR - SEG 38 - TIMx_IC3...
- Page 52 Table 9. Alternate function input/output (continued) Digital alternate function number AFIO0 AFIO1 AFIO2 AFIO3 AFIO4 AFIO5 AFIO6 AFIO7 AFIO8 AFIO11 AFIO14 AFIO15 Port name Alternate function TIM3/4/ TIM9/ USART1/2/ UART4/ SYSTEM TIM2 I2C1/2 SPI1/2 SPI3 CPRI SYSTEM 10/11 EVENT EVENT EVENT EVENT EVENT...
- Page 53 Table 9. Alternate function input/output (continued) Digital alternate function number AFIO0 AFIO1 AFIO2 AFIO3 AFIO4 AFIO5 AFIO6 AFIO7 AFIO8 AFIO11 AFIO14 AFIO15 Port name Alternate function TIM3/4/ TIM9/ USART1/2/ UART4/ SYSTEM TIM2 I2C1/2 SPI1/2 SPI3 CPRI SYSTEM 10/11 EVENT PF14 EVENT PF15 EVENT...
- Page 54 Table 9. Alternate function input/output (continued) Digital alternate function number AFIO0 AFIO1 AFIO2 AFIO3 AFIO4 AFIO5 AFIO6 AFIO7 AFIO8 AFIO11 AFIO14 AFIO15 Port name Alternate function TIM3/4/ TIM9/ USART1/2/ UART4/ SYSTEM TIM2 I2C1/2 SPI1/2 SPI3 CPRI SYSTEM 10/11 EVENT PG12 EVENT PG13 EVENT...
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Page 55: Memory Mapping
STM32L151xE STM32L152xE Memory mapping Memory mapping Figure 8. Memory map DocID025433 Rev 8 55/134... -
Page 56: Electrical Characteristics
Electrical characteristics STM32L151xE STM32L152xE Electrical characteristics Parameter conditions Unless otherwise specified, all voltages are referenced to V 6.1.1 Minimum and maximum values Unless otherwise specified the minimum and maximum values are guaranteed in the worst conditions of ambient temperature, supply voltage and frequencies by tests in production on 100% of the devices with an ambient temperature at T = 25 °C and T max (given by... -
Page 57: Power Supply Scheme
STM32L151xE STM32L152xE Electrical characteristics 6.1.6 Power supply scheme Figure 11. Power supply scheme DocID025433 Rev 8 57/134... -
Page 58: Optional Lcd Power Supply Scheme
Electrical characteristics STM32L151xE STM32L152xE 6.1.7 Optional LCD power supply scheme Figure 12. Optional LCD power supply scheme 1. Option 1: LCD power supply is provided by a dedicated VLCD supply source, VSEL switch is open. 2. Option 2: LCD power supply is provided by the internal step-up converter, VSEL switch is closed, an external capacitance is needed for correct behavior of this converter. -
Page 59: Absolute Maximum Ratings
STM32L151xE STM32L152xE Electrical characteristics Absolute maximum ratings Stresses above the absolute maximum ratings listed in Table 10: Voltage characteristics, Table 11: Current characteristics, and Table 12: Thermal characteristics may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these conditions is not implied. -
Page 60: Operating Conditions
Electrical characteristics STM32L151xE STM32L152xE 4. Positive current injection is not possible on these I/Os. A negative injection is induced by V <V must never be INJ(PIN) exceeded. Refer to Table 10 for maximum allowed input voltage values. 5. A positive injection is induced by V >... -
Page 61: Embedded Reset And Power Control Block Characteristics
STM32L151xE STM32L152xE Electrical characteristics Table 13. General operating conditions (continued) Symbol Parameter Conditions Unit 6 suffix version –40 Junction temperature range °C 7 suffix version –40 1. When the ADC is used, refer to Table 55: ADC characteristics. 2. It is recommended to power V and V from the same source. - Page 62 Electrical characteristics STM32L151xE STM32L152xE Table 14. Embedded reset and power control block characteristics (continued) Symbol Parameter Conditions Unit Falling edge 2.45 2.55 Brown-out reset threshold 3 BOR3 Rising edge 2.54 2.66 Falling edge 2.68 2.85 Brown-out reset threshold 4 BOR4 Rising edge 2.78 2.95...
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Page 63: Embedded Internal Reference Voltage
STM32L151xE STM32L152xE Electrical characteristics 6.3.3 Embedded internal reference voltage The parameters given in Table 16 are based on characterization results, unless otherwise specified. Table 15. Embedded internal reference voltage calibration values Calibration value name Description Memory address Raw data acquired at VREFINT_CAL temperature of 30 °C ±5 °C 0x1FF8 00F8 - 0x1FF8 00F9... -
Page 64: Supply Current Characteristics
Electrical characteristics STM32L151xE STM32L152xE 6.3.4 Supply current characteristics The current consumption is a function of several parameters and factors such as the operating voltage, temperature, I/O pin loading, device software configuration, operating frequencies, I/O pin switching rate, program location in memory and executed binary code. The current consumption is measured as described in Figure 13: Current consumption measurement... -
Page 65: Table 17. Current Consumption In Run Mode, Code With Data Processing Running From Flash
STM32L151xE STM32L152xE Electrical characteristics Table 17. Current consumption in Run mode, code with data processing running from Flash Symbol Parameter Conditions Unit HCLK 1 MHz Range 3, V =1.2 CORE 2 MHz µA V VOS[1:0] = 11 4 MHz 1200 up to HCLK 4 MHz... -
Page 66: Table 18. Current Consumption In Run Mode, Code With Data Processing Running From Ram
Electrical characteristics STM32L151xE STM32L152xE Table 18. Current consumption in Run mode, code with data processing running from Symbol Parameter Conditions Unit HCLK 1 MHz Range 3, =1.2 V 2 MHz µA CORE VOS[1:0] = 11 4 MHz 1200 up to HCLK 4 MHz 0.80... -
Page 67: Table 19. Current Consumption In Sleep Mode
STM32L151xE STM32L152xE Electrical characteristics Table 19. Current consumption in Sleep mode Symbol Parameter Conditions Unit HCLK 1 MHz Range 3, =1.2 V 2 MHz CORE VOS[1:0] = 11 4 MHz up to HCLK 4 MHz 16 MHz included, Range 2, =1.5 V 8 MHz HCLK... -
Page 68: Table 20. Current Consumption In Low-Power Run Mode
Electrical characteristics STM32L151xE STM32L152xE Table 20. Current consumption in Low-power run mode Symbol Parameter Conditions Unit = -40 °C to 25 °C MSI clock, 65 kHz = 85 °C 36.2 = 32 kHz HCLK = 105 °C 65.4 peripherals OFF, code =-40 °C to 25 °C 16.5 executed... -
Page 69: Table 21. Current Consumption In Low-Power Sleep Mode
STM32L151xE STM32L152xE Electrical characteristics Table 21. Current consumption in Low-power sleep mode Symbol Parameter Conditions Unit MSI clock, 65 kHz = 32 kHz = -40 °C to 25 °C HCLK Flash OFF = -40 °C to 25 °C 18.5 MSI clock, 65 kHz = 32 kHz = 85 °C 26.8... -
Page 70: Table 22. Typical And Maximum Current Consumptions In Stop Mode
Electrical characteristics STM32L151xE STM32L152xE Table 22. Typical and maximum current consumptions in Stop mode Symbol Parameter Conditions Unit = -40°C to 25°C 1.18 = 1.8 V = -40°C to 25°C = 55°C 3.02 = 85°C 7.44 RTC clocked by LSI = 105°C 15.5 or LSE external clock... - Page 71 STM32L151xE STM32L152xE Electrical characteristics Table 22. Typical and maximum current consumptions in Stop mode (continued) Symbol Parameter Conditions Unit Regulator in LP mode, HSI and HSE OFF, independent = -40°C to 25°C watchdog and LSI enabled Supply current in = -40°C to 25°C 0.560 (Stop) Stop mode (RTC...
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Page 72: Table 23. Typical And Maximum Current Consumptions In Standby Mode
Electrical characteristics STM32L151xE STM32L152xE Table 23. Typical and maximum current consumptions in Standby mode Symbol Parameter Conditions Unit = -40 °C to 25 °C 0.865 = 1.8 V = -40 °C to 25 °C 1.11 RTC clocked by LSI (no independent watchdog) = 55 °C 1.72... -
Page 73: Table 24. Peripheral Current Consumption
STM32L151xE STM32L152xE Electrical characteristics Table 24. Peripheral current consumption Typical consumption, V = 3.0 V, T = 25 °C Range 1, Range 2, Range 3, Peripheral Unit Low-power CORE CORE CORE 1.8 V 1.5 V 1.2 V sleep and run VOS[1:0] = 01 VOS[1:0] = 10 VOS[1:0] = 11... - Page 74 Electrical characteristics STM32L151xE STM32L152xE Table 24. Peripheral current consumption (continued) Typical consumption, V = 3.0 V, T = 25 °C Range 1, Range 2, Range 3, Peripheral Unit Low-power CORE CORE CORE 1.8 V 1.5 V 1.2 V sleep and run VOS[1:0] = 01 VOS[1:0] = 10 VOS[1:0] = 11...
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Page 75: Wakeup Time From Low-Power Mode
STM32L151xE STM32L152xE Electrical characteristics 3. Data based on a differential I measurement between ADC in reset configuration and continuous ADC conversion (HSI consumption not included). 4. Data based on a differential I measurement between DAC in reset configuration and continuous DAC conversion of /2. -
Page 76: External Clock Source Characteristics
Electrical characteristics STM32L151xE STM32L152xE 76/134 DocID025433 Rev 8... -
Page 77: Table 27. Low-Speed External User Clock Characteristics
STM32L151xE STM32L152xE Electrical characteristics Low-speed external user clock generated from an external source The characteristics given in the following table result from tests performed using a low- speed external clock source, and under the conditions summarized in Table Table 27. Low-speed external user clock characteristics Symbol Parameter Conditions... -
Page 78: Table 28. Hse Oscillator Characteristics
Electrical characteristics STM32L151xE STM32L152xE (1)(2) Table 28. HSE oscillator characteristics Symbol Parameter Conditions Min Typ Unit Oscillator frequency OSC_IN Feedback resistor kΩ Recommended load capacitance versus = 30 Ω equivalent serial resistance of the crystal = 3.3 V, HSE driving current with 30 pF load 2.5 (startup) -
Page 79: Figure 16. Hse Oscillator Circuit Diagram
STM32L151xE STM32L152xE Electrical characteristics Figure 16. HSE oscillator circuit diagram 1. R value depends on the crystal characteristics. Low-speed external clock generated from a crystal/ceramic resonator The low-speed external (LSE) clock can be supplied with a 32.768 kHz crystal/ceramic resonator oscillator. All the information given in this paragraph are based on characterization results obtained with typical external components specified in Table 29. -
Page 80: Figure 17. Typical Application With A 32.768 Khz Crystal
Electrical characteristics STM32L151xE STM32L152xE is the startup time measured from the moment it is enabled (by software) to a stabilized SU(LSE) 32.768 kHz oscillation is reached. This value is measured for a standard crystal resonator and it can vary significantly with the crystal manufacturer. Note: For C and C... -
Page 81: Internal Clock Source Characteristics
STM32L151xE STM32L152xE Electrical characteristics 6.3.7 Internal clock source characteristics The parameters given in Table 30 are derived from tests performed under the conditions summarized in Table High-speed internal (HSI) RC oscillator Table 30. HSI oscillator characteristics Symbol Parameter Conditions Unit Frequency = 3.0 V ±... -
Page 82: Table 32. Msi Oscillator Characteristics
Electrical characteristics STM32L151xE STM32L152xE Multi-speed internal (MSI) RC oscillator Table 32. MSI oscillator characteristics Symbol Parameter Condition Max Unit MSI range 0 65.5 MSI range 1 MSI range 2 Frequency after factory calibration, done at MSI range 3 = 3.3 V and T = 25 °C MSI range 4 1.05... - Page 83 STM32L151xE STM32L152xE Electrical characteristics Table 32. MSI oscillator characteristics (continued) Symbol Parameter Condition Max Unit MSI range 0 MSI range 1 MSI range 2 MSI range 3 MSI range 4 MSI oscillator stabilization time µs STAB(MSI) MSI range 5 MSI range 6, Voltage range 1 and 2 MSI range 3,...
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Page 84: Pll Characteristics
Electrical characteristics STM32L151xE STM32L152xE 6.3.8 PLL characteristics The parameters given in Table 33 are derived from tests performed under the conditions summarized in Table Table 33. PLL characteristics Value Symbol Parameter Unit PLL input clock PLL_IN PLL input clock duty cycle PLL output clock PLL_OUT PLL lock time... -
Page 85: Table 35. Flash Memory And Data Eeprom Characteristics
STM32L151xE STM32L152xE Electrical characteristics Flash memory and data EEPROM Table 35. Flash memory and data EEPROM characteristics Symbol Parameter Conditions Unit Operating voltage 1.65 Read / Write / Erase Programming/ erasing Erasing 3.28 3.94 time for byte / word / prog Programming 3.28... -
Page 86: Emc Characteristics
Electrical characteristics STM32L151xE STM32L152xE 6.3.10 EMC characteristics Susceptibility tests are performed on a sample basis during device characterization. Functional EMS (electromagnetic susceptibility) While a simple application is executed on the device (toggling 2 LEDs through I/O ports). the device is stressed by two electromagnetic events until a failure occurs. The failure is indicated by the LEDs: •... -
Page 87: Electrical Sensitivity Characteristics
STM32L151xE STM32L152xE Electrical characteristics To complete these trials, ESD stress can be applied directly on the device, over the range of specification values. When unexpected behavior is detected, the software can be hardened to prevent unrecoverable errors occurring (see application note AN1015). Electromagnetic Interference (EMI) The electromagnetic field emitted by the device are monitored while a simple application is executed (toggling 2 LEDs through the I/O ports). -
Page 88: I/O Current Injection Characteristics
Electrical characteristics STM32L151xE STM32L152xE 1. Guaranteed by characterization results. Static latch-up Two complementary static tests are required on six parts to assess the latch-up performance: • A supply overvoltage is applied to each power supply pin • A current injection is applied to each input, output and configurable I/O pin These tests are compliant with EIA/JESD 78A IC latch-up standard. -
Page 89: I/O Port Characteristics
STM32L151xE STM32L152xE Electrical characteristics 6.3.13 I/O port characteristics General input/output characteristics Unless otherwise specified, the parameters given in Table 48 are derived from tests performed under the conditions summarized in Table 13. All I/Os are CMOS and TTL compliant. Table 42. I/O static characteristics Symbol Parameter Conditions... -
Page 90: Table 43. Output Voltage Characteristics
Electrical characteristics STM32L151xE STM32L152xE Output driving current The GPIOs (general purpose input/outputs) can sink or source up to ±8 mA, and sink or source up to ±20 mA with the non-standard V specifications given in Table In the user application, the number of I/O pins which can drive current must be limited to respect the absolute maximum rating specified in Section 6.2:... -
Page 91: Table 44. I/O Ac Characteristics
STM32L151xE STM32L152xE Electrical characteristics Input/output AC characteristics The definition and values of input/output AC characteristics are given in Figure 18 Table 44, respectively. Unless otherwise specified, the parameters given in Table 44 are derived from tests performed under the conditions summarized in Table Table 44. -
Page 92: Nrst Pin Characteristics
Electrical characteristics STM32L151xE STM32L152xE Figure 18. I/O AC characteristics definition 6.3.14 NRST pin characteristics The NRST pin input driver uses CMOS technology. It is connected to a permanent pull-up resistor, R (see Table Unless otherwise specified, the parameters given in Table 45 are derived from tests performed under the conditions summarized in... -
Page 93: Tim Timer Characteristics
STM32L151xE STM32L152xE Electrical characteristics Figure 19. Recommended NRST pin protection 1. The reset network protects the device against parasitic resets. 2. The user must ensure that the level on the NRST pin can go below the V max level specified in IL(NRST) Table 45. -
Page 94: Communications Interfaces
Electrical characteristics STM32L151xE STM32L152xE 6.3.16 Communications interfaces C interface characteristics The device I C interface meets the requirements of the standard I C communication protocol with the following restrictions: SDA and SCL are not “true” open-drain I/O pins. When configured as open-drain, the PMOS connected between the I/O pin and V disabled, but is still present. -
Page 95: Table 48. Scl Frequency
STM32L151xE STM32L152xE Electrical characteristics Figure 20. I C bus AC waveforms and measurement circuit 1. R = series protection resistor. 2. R = external pull-up resistor. 3. V is the I2C bus power supply. DD_I2C 4. Measurement points are done at CMOS levels: 0.3V and 0.7V (1)(2) Table 48. - Page 96 Electrical characteristics STM32L151xE STM32L152xE SPI characteristics Unless otherwise specified, the parameters given in the following table are derived from tests performed under the conditions summarized in Table Refer to Section 6.3.12: I/O current injection characteristics for more details on the input/output alternate function characteristics (NSS, SCK, MOSI, MISO).
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Page 97: Figure 21. Spi Timing Diagram - Slave Mode And Cpha = 0
STM32L151xE STM32L152xE Electrical characteristics Figure 21. SPI timing diagram - slave mode and CPHA = 0 Figure 22. SPI timing diagram - slave mode and CPHA = 1 1. Measurement points are done at CMOS levels: 0.3V and 0.7V DocID025433 Rev 8 97/134... -
Page 98: Figure 23. Spi Timing Diagram - Master Mode (1)
Electrical characteristics STM32L151xE STM32L152xE Figure 23. SPI timing diagram - master mode 1. Measurement points are done at CMOS levels: 0.3V and 0.7V 98/134 DocID025433 Rev 8... -
Page 99: Table 50. Usb Startup Time
STM32L151xE STM32L152xE Electrical characteristics USB characteristics The USB interface is USB-IF certified (full speed). Table 50. USB startup time Symbol Parameter Unit USB transceiver startup time µs STARTUP 1. Guaranteed by design. Table 51. USB DC electrical characteristics Symbol Parameter Conditions Min. -
Page 100: Table 53. I2S Characteristics
Electrical characteristics STM32L151xE STM32L152xE Table 52. USB: full speed electrical characteristics (continued) Driver characteristics Symbol Parameter Conditions Unit Rise/ fall time matching Output signal crossover voltage 1. Guaranteed by design. 2. Measured from 10% to 90% of the data signal. For more detailed informations, please refer to USB Specification - Chapter 7 (version 2.0). -
Page 101: Figure 25. I 2 S Slave Timing Diagram (Philips Protocol)
STM32L151xE STM32L152xE Electrical characteristics ODD bit value, digital contribution leads to a min of (I2SDIV/(2*I2SDIV+ODD) and a max of (I2SDIV+ODD)/(2*I2SDIV+ODD). Fs max is supported for each mode/condition. Figure 25. I S slave timing diagram (Philips protocol) 1. Measurement points are done at CMOS levels: 0.3 × V and 0.7 ×... -
Page 102: 12-Bit Adc Characteristics
Electrical characteristics STM32L151xE STM32L152xE 6.3.17 12-bit ADC characteristics Unless otherwise specified, the parameters given in Table 55 are guaranteed by design. Table 54. ADC clock frequency Symbol Parameter Conditions Unit REF+ = < V REF+ 2.4 V ≤ V ≤ 3.6 V >... - Page 103 STM32L151xE STM32L152xE Electrical characteristics Table 55. ADC characteristics (continued) Symbol Parameter Conditions Unit Direct channels 0.25 2.4 V ≤ V ≤ 3.6 V Multiplexed channels 0.56 2.4 V ≤ V ≤ 3.6 V µs Sampling time Direct channels 0.56 1.8 V ≤ V ≤...
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Page 104: Table 56. Adc Accuracy
Electrical characteristics STM32L151xE STM32L152xE (1)(2) Table 56. ADC accuracy Symbol Parameter Test conditions Unit Total unadjusted error Offset error 2.4 V ≤ V ≤ 3.6 V 2.4 V ≤ V ≤ 3.6 V REF+ Gain error = 8 MHz, R = 50 Ω... -
Page 105: Figure 27. Adc Accuracy Characteristics
STM32L151xE STM32L152xE Electrical characteristics Figure 27. ADC accuracy characteristics Figure 28. Typical connection diagram using the ADC 1. Refer to Table 57: Maximum source impedance RAIN max for the value of R Table 55: ADC characteristics for the value of C 2. -
Page 106: Table 57. Maximum Source Impedance R
Electrical characteristics STM32L151xE STM32L152xE Figure 29. Maximum dynamic current consumption on V supply pin during ADC REF+ conversion Sampling (n cycles) Conversion (12 cycles) ADC clock ref+ 700µA 300µA MS36686V1 Table 57. Maximum source impedance R max (kΩ) Ts (cycles) Multiplexed channels Direct channels (µs) -
Page 107: Dac Electrical Specifications
STM32L151xE STM32L152xE Electrical characteristics 6.3.18 DAC electrical specifications Data guaranteed by design, unless otherwise specified. Table 58. DAC characteristics Symbol Parameter Conditions Unit Analog supply voltage Reference supply must always be below REF+ REF+ voltage Lower reference voltage REF- Current consumption on No load, middle code (0x800) supply DDVREF+... - Page 108 Electrical characteristics STM32L151xE STM32L152xE = 3.3V = 3.0V REF+ = 0 to 50 ° C DAC output buffer OFF Offset error temperature dOffset/dT µV/°C coefficient (code 0x800) = 3.3V = 3.0V REF+ = 0 to 50 ° C DAC output buffer ON ≤...
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Page 109: Operational Amplifier Characteristics
STM32L151xE STM32L152xE Electrical characteristics 4. Difference between measured value at Code i and the value at Code i on a line drawn between Code 0 and last Code 4095. 5. Difference between the value measured at Code (0x800) and the ideal value = V REF+ 6. - Page 110 Electrical characteristics STM32L151xE STM32L152xE Table 59. Operational amplifier characteristics (continued) Symbol Parameter Condition Unit Normal mode Power supply PSRR rejection ratio Low-power mode Normal mode 1000 3000 >2.4 V Low-power mode Bandwidth Normal mode 2200 <2.4 V Low-power mode >2.4 V Normal mode (between 0.1 V and -0.1 V)
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Page 111: Temperature Sensor Characteristics
STM32L151xE STM32L152xE Electrical characteristics 6.3.20 Temperature sensor characteristics Table 60. Temperature sensor calibration values Calibration value name Description Memory address TS ADC raw data acquired at temperature of 30 °C ±5 °C TS_CAL1 0x1FF8 00FA - 0x1FF8 00FB = 3 V ±10 mV TS ADC raw data acquired at temperature of 110 °C ±5 °C TS_CAL2... -
Page 112: Table 63. Comparator 2 Characteristics
Electrical characteristics STM32L151xE STM32L152xE 1. Guaranteed by characterization results. 2. The delay is characterized for 100 mV input step with 10 mV overdrive on the inverting input, the non- inverting input set to the reference. 3. Comparator consumption only. Internal reference voltage not included. Table 63. -
Page 113: Lcd Controller
STM32L151xE STM32L152xE Electrical characteristics 6.3.22 LCD controller The device embeds a built-in step-up converter to provide a constant LCD reference voltage independently from the V voltage. An external capacitor C must be connected to the pin to decouple this converter. Table 64. -
Page 114: Package Information
Package information STM32L151xE STM32L152xE Package information In order to meet environmental requirements, ST offers these devices in different grades of ® ® ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ®... -
Page 115: Table 65. Lqfp144, 20 X 20 Mm, 144-Pin Low-Profile Quad Flat Package Mechanical Data
STM32L151xE STM32L152xE Package information Table 65. LQFP144, 20 x 20 mm, 144-pin low-profile quad flat package mechanical data millimeters inches Symbol 1.600 0.0630 0.050 0.150 0.0020 0.0059 1.350 1.400 1.450 0.0531 0.0551 0.0571 0.170 0.220 0.270 0.0067 0.0087 0.0106 0.090 0.200 0.0035 0.0079... -
Page 116: Figure 32. Lqfp144, 20 X 20 Mm, 144-Pin Low-Profile Quad Flat Package
Package information STM32L151xE STM32L152xE Figure 32. LQFP144, 20 x 20 mm, 144-pin low-profile quad flat package recommended footprint 1. Dimensions are in millimeters. Marking of engineering samples The following figure gives an example of topside marking orientation versus pin 1 identifier location. -
Page 117: Lqfp100, 14 X 14 Mm, 100-Pin Low-Profile Quad Flat Package
STM32L151xE STM32L152xE Package information LQFP100, 14 x 14 mm, 100-pin low-profile quad flat package information Figure 34. LQFP100, 14 x 14 mm, 100-pin low-profile quad flat package outline 1. Drawing is not to scale. Table 66. LQPF100, 14 x 14 mm, 100-pin low-profile quad flat package mechanical data millimeters inches... -
Page 118: Figure 35. Lqfp100, 14 X 14 Mm, 100-Pin Low-Profile Quad Flat Package
Package information STM32L151xE STM32L152xE Table 66. LQPF100, 14 x 14 mm, 100-pin low-profile quad flat package mechanical data (continued) millimeters inches Symbol 12.000 0.4724 0.500 0.0197 0.450 0.600 0.750 0.0177 0.0236 0.0295 1.000 0.0394 0.0° 3.5° 7.0° 0.0° 3.5° 7.0° 0.080 0.0031 1. -
Page 119: Figure 36. Lqfp100, 14 X 14 Mm, 100-Pin Low-Profile Quad Flat Package Top View Example
STM32L151xE STM32L152xE Package information Marking of engineering samples The following figure gives an example of topside marking orientation versus pin 1 identifier location. Figure 36. LQFP100, 14 x 14 mm, 100-pin low-profile quad flat package top view example 1. Parts marked as “ES”, “E” or accompanied by an Engineering Sample notification letter, are not yet qualified and therefore not yet ready to be used in production and any consequences deriving from such usage will not be at ST charge. -
Page 120: Lqfp64, 10 X 10 Mm, 64-Pin Low-Profile Quad Flat Package Information
Package information STM32L151xE STM32L152xE LQFP64, 10 x 10 mm, 64-pin low-profile quad flat package information Figure 37. LQFP64, 10 x 10 mm, 64-pin low-profile quad flat package outline 1. Drawing is not to scale. Table 67. LQFP64, 10 x 10 mm 64-pin low-profile quad flat package mechanical data millimeters inches... -
Page 121: Figure 38. Lqfp64, 10 X 10 Mm, 64-Pin Low-Profile Quad Flat Package
STM32L151xE STM32L152xE Package information Table 67. LQFP64, 10 x 10 mm 64-pin low-profile quad flat package mechanical data (continued) millimeters inches Symbol 7.500 0.2953 0.500 0.0197 0° 3.5° 7° 0° 3.5° 7° 0.450 0.600 0.750 0.0177 0.0236 0.0295 1.000 0.0394 0.080 0.0031 1. -
Page 122: Figure 39. Lqfp64 10 X 10 Mm, 64-Pin Low-Profile Quad Flat Package Top View Example
Package information STM32L151xE STM32L152xE Marking of engineering samples The following figure gives an example of topside marking orientation versus pin 1 identifier location. Figure 39. LQFP64 10 x 10 mm, 64-pin low-profile quad flat package top view example 1. Parts marked as “ES”, “E” or accompanied by an Engineering Sample notification letter, are not yet qualified and therefore not yet ready to be used in production and any consequences deriving from such usage will not be at ST charge. -
Page 123: Ufbga132, 7 X 7 Mm, 132-Ball Ultra Thin, Fine-Pitch Ball Grid Array Package Information
STM32L151xE STM32L152xE Package information UFBGA132, 7 x 7 mm, 132-ball ultra thin, fine-pitch ball grid array package information Figure 40. UFBGA132, 7 x 7 mm, 132-ball ultra thin, fine-pitch ball grid array package outline 1. Drawing is not to scale. Table 68. - Page 124 Package information STM32L151xE STM32L152xE Table 68. UFBGA132, 7 x 7 mm, 132-ball ultra thin, fine-pitch ball grid array package mechanical data (continued) millimeters inches Symbol 0.080 0.0031 0.150 0.0059 0.050 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. Figure 41.
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Page 125: Top View Example
STM32L151xE STM32L152xE Package information Marking of engineering samples The following figure gives an example of topside marking orientation versus ball A1 identifier location. Figure 42. UFBGA132, 7 x 7 mm, 132-ball ultra thin, fine-pitch ball grid array package top view example 1. -
Page 126: Information
Package information STM32L151xE STM32L152xE WLCSP104, 0.4 mm pitch wafer level chip scale package information Figure 43. WLCSP104, 0.4 mm pitch wafer level chip scale package outline 1. Drawing is not to scale. 126/134 DocID025433 Rev 8... -
Page 127: Table 69. Wlcsp104, 0.4 Mm Pitch Wafer Level Chip Scale Package Mechanical Data
STM32L151xE STM32L152xE Package information Table 69. WLCSP104, 0.4 mm pitch wafer level chip scale package mechanical data millimeters inches Symbol 0.525 0.555 0.585 0.0207 0.0219 0.023 0.175 0.0069 0.38 0.015 0.025 0.001 ø b 0.22 0.25 0.28 0.0087 0.0098 0.011 4.06 4.095 4.13... -
Page 128: Table 70. Wlcsp104, 0.4 Mm Pitch Recommended Pcb Design Rules
Package information STM32L151xE STM32L152xE Table 70. WLCSP104, 0.4 mm pitch recommended PCB design rules Dimension Recommended values Pitch 260 µm max. (circular) Dpad 220 µm recommended 300 µm min. (for 260 µm diameter pad) PCB pad design Non-solder mask defined via underbump allowed. Marking of engineering samples The following figure gives an example of topside marking orientation versus ball A1 identifier location. -
Page 129: Thermal Characteristics
STM32L151xE STM32L152xE Package information Thermal characteristics The maximum chip-junction temperature, T max, in degrees Celsius, may be calculated using the following equation: max = T max + (P max × Θ Where: • max is the maximum ambient temperature in ° C, •... -
Page 130: Reference Document
Package information STM32L151xE STM32L152xE Figure 46. Thermal resistance suffix 6 Figure 47. Thermal resistance suffix 7 7.6.1 Reference document JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air). Available from www.jedec.org. 130/134 DocID025433 Rev 8... -
Page 131: Part Numbering
STM32L151xE STM32L152xE Part numbering Part numbering Table 72. STM32L151xE and STM32L152xE Ordering information scheme Example: STM32 L 151 R D TR Device family STM32 = ARM-based 32-bit microcontroller Product type L = Low-power Device subfamily 151: Devices without LCD 152: Devices with LCD Pin count R = 64 pins V = 100/104 pins... -
Page 132: Revision History
Revision History STM32L151xE STM32L152xE Revision History Table 73. Document revision history Date Revision Changes 31-Oct-2013 Initial release. Added Input Voltage in Table 13: General operating conditions Updated: Chapter 2.2: Ultra-low-power device continuum, Table 13: General operating conditions, Table 28: Current consumption in Low- power run mode, Table 21: Current consumption in Low-power sleep... - Page 133 STM32L151xE STM32L152xE Revision History Table 73. Document revision history (continued) Date Revision Changes Updated Section : In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: 10-Feb-2015 www.st.com.
- Page 134 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders.
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