STMicroelectronics STM32L162RC Manual page 121

STM32L162VC, STM32L162RC
Date
19-May-2014
13-Oct-2014
06-Mar-2015
Table 72. Document revision history (continued)
Revision
Updated Table 48: I2C
Removed minimum values for f
Updated Output impedance values in
Moved Table 61: Temperature sensor calibration values
Section 3.10.1: Temperature sensor
sensor characteristics
Table 62: Temperature sensor
Modified General PCB design
Removed figures "Power supply and reference decoupling (V
connected to V
6
(V connected to V
REF+
(continued)
Updated Figure 26: Typical connection diagram using the
Added "Marking of engineering samples" sections in
to meet environmental requirements, ST offers these devices in
different grades of ECOPACK® packages, depending on their level of
environmental compliance. ECOPACK® specifications, grade
definitions and product status are available at: www.st.com.
ECOPACK® is an ST
Updated the conditions in
Removed ambiguity of "ambient temperature" in the electrical
characteristics description.
Updated Section 3.18: Communication interfaces
characteristics inside.
Updated DMIPS features in cover page and
Updated max temperature at 105°C instead of 85°C in the whole
datasheet.
Updated Table 9: STM32L162xC pin definitions
7 functions column.
Updated current consumption in
Sleep mode.
Updated Table 25: Peripheral current consumption
current values.
Updated Table 58: Maximum source impedance RAIN max
note 2.
Updated Section 7: Package information
marking.
8
Updated Figure 6: Memory
DocID022881 Rev 10
Changes
characteristics.
in Table 56: ADC
S
Table 59: DAC
to
and updated the table. Removed note 4 in
characteristics.
guidelines.
) and "Power supply and reference decoupling
DDA
)".
DDA
trademark..
Table 26: Low-power mode wakeup
Table 20: Current consumption in
map.
characteristics.
characteristics.
from
Section 6.3.20: Temperature
REF+
ADC.
Figure : In order
timings.
putting I2S
Section 2: Description.
with additional
with new measured
adding
with new package device
not
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