STMicroelectronics STM32L151CCT6 Manual

STMicroelectronics STM32L151CCT6 Manual

Ultra-low-power 32-bit mcu arm-based cortex-m3, 256kb flash, 32kb sram, 8kb eeprom, lcd, usb, adc, dac
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Ultra-low-power 32-bit MCU ARM
256KB Flash, 32KB SRAM, 8KB EEPROM, LCD, USB, ADC, DAC
Features
• Ultra-low-power platform
– 1.65 V to 3.6 V power supply
– -40 °C to 105 °C temperature range
– 0.29µA Standby mode (3 wakeup pins)
– 1.15 µA Standby mode + RTC
– 0.44 µA Stop mode (16 wakeup lines)
– 1.4 µA Stop mode + RTC
– 8.6 µA Low-power run mode
– 185 µA/MHz Run mode
– 10 nA ultra-low I/O leakage
– 8 µs wakeup time
®
• Core: ARM
Cortex
– From 32 kHz up to 32 MHz max
– 1.25 DMIPS/MHz (Dhrystone 2.1)
– Memory protection unit
• Reset and supply management
– Low-power, ultrasafe BOR (brownout reset)
with 5 selectable thresholds
– Ultra-low-power POR/PDR
– Programmable voltage detector (PVD)
• Clock sources
– 1 to 24 MHz crystal oscillator
– 32 kHz oscillator for RTC with calibration
– High Speed Internal 16 MHz
factory-trimmed RC (+/- 1%)
– Internal Low-power 37 kHz RC
– Internal multispeed low-power 65 kHz to
4.2 MHz PLL for CPU clock and USB
(48 MHz)
• Pre-programmed bootloader
– USB and USART supported
• Development support
– Serial wire debug supported
– JTAG and trace supported
• Up to 83 fast I/Os (70 I/Os 5V tolerant), all
mappable on 16 external interrupt vectors
March 2015
This is information on a product in full production.
STM32L15xCC STM32L15xRC
STM32L15xUC STM32L15xVC
®
-M3 32-bit CPU
DocID022799 Rev 10
®
-based Cortex
UFBGA100
(7 x 7 mm)
LQFP100 (14 × 14 mm)
LQFP64 (10 × 10 mm)
LQFP48 (7 x 7 mm)
• Memories
– 256 KB Flash memory with ECC
– 32 KB RAM
– 8 KB of true EEPROM with ECC
– 128 Byte backup register
• LCD Driver (except STM32L151xC devices) up
to 8x40 segments, contrast adjustment,
blinking mode, step-up converter
• Rich analog peripherals (down to 1.8 V)
– 2x operational amplifiers
– 12-bit ADC 1Msps up to 25 channels
– 12-bit DAC 2 channels with output buffers
– 2x ultra-low-power-comparators
(window mode and wake up capability)
• DMA controller 12x channels
• 9x peripheral communication interfaces
– 1x USB 2.0 (internal 48 MHz PLL)
– 3x USART
– 3x SPI 16 Mbits/s (2x SPI with I2S)
– 2x I2C (SMBus/PMBus)
• 11x timers: 1x 32-bit, 6x 16-bit with up to 4
IC/OC/PWM channels, 2x 16-bit basic timers,
2x watchdog timers (independent and window)
• Up to 23 capacitive sensing channels
• CRC calculation unit, 96-bit unique ID
Table 1. Device summary
Reference
STM32L151CC
STM32L151CCT6, STM32L151CCU6
(1)
STM32L151RC
STM32L151RCT6
STM32L151UC
STM32L151UCY6
(1)
STM32L151VC
STM32L151VCT6, STM32L151VCH6
STM32L152CC
STM32L152CCT6, STM32L152CCU6
(1)
STM32L152RC
STM32L152RCT6
STM32L152UC
STM32L152UCY6
(1)
STM32L152VC
STM32L152VCT6, STM32L152VCH6
1.
For sales types ending with "A" and STM32L15xxC products
in WLCSP64 package, please refer to STM32L15xxC/C-A
datasheets.
®
-M3,
-
Datasheet
production data
WLCSP63
UFQFPN48
(0,400 mm
(7x7 mm)
pitch)
Part number
www.st.com
1/135

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Summary of Contents for STMicroelectronics STM32L151CCT6

  • Page 1 – Internal multispeed low-power 65 kHz to Table 1. Device summary 4.2 MHz PLL for CPU clock and USB Reference Part number (48 MHz) • Pre-programmed bootloader STM32L151CC STM32L151CCT6, STM32L151CCU6 STM32L151RC STM32L151RCT6 – USB and USART supported STM32L151UC STM32L151UCY6 STM32L151VC STM32L151VCT6, STM32L151VCH6 •...
  • Page 2: Table Of Contents

    Contents STM32L151xC STM32L152xC Contents Introduction ..........9 Description .
  • Page 3 STM32L151xC STM32L152xC Contents 3.16 Timers and watchdogs ........28 3.16.1 General-purpose timers (TIM2, TIM3, TIM4, TIM5, TIM9, TIM10 and TIM11) .
  • Page 4 Contents STM32L151xC STM32L152xC 6.3.4 Supply current characteristics ....... . 61 6.3.5 Wakeup time from low-power mode .
  • Page 5 STM32L151xC STM32L152xC List of tables List of tables Table 1. Device summary ............1 Table 2.
  • Page 6 List of tables STM32L151xC STM32L152xC Table 47. TIMx characteristics ............90 Table 48.
  • Page 7 STM32L151xC STM32L152xC List of figures List of figures Figure 1. Ultra-low-power STM32L151xC and STM32L152xC block diagram ....13 Figure 2. Clock tree ............. . 22 Figure 3.
  • Page 8 List of figures STM32L151xC STM32L152xC Figure 47. WLCSP63 device marking example ......... 127 Figure 48.
  • Page 9: Introduction

    This STM32L151xC and STM32L152xC datasheet should be read in conjunction with the STM32L1xxxx reference manual (RM0038). The application note “Getting started with STM32L1xxxx hardware development” (AN3216) gives a hardware implementation overview. Both documents are available from the STMicroelectronics website www.st.com. ® ®...
  • Page 10: Description

    Description STM32L151xC STM32L152xC Description The ultra-low-power STM32L151xC and STM32L152xC devices incorporate the ® connectivity power of the universal serial bus (USB) with the high-performance ARM ® Cortex -M3 32-bit RISC core operating at a frequency of 32 MHz (33.3 DMIPS), a memory protection unit (MPU), high-speed embedded memories (Flash memory up to 256 Kbytes and RAM up to 32 Kbytes) and an extensive range of enhanced I/Os and peripherals connected to two APB buses.
  • Page 11: Device Overview

    STM32L151xC STM32L152xC Description Device overview Table 2. Ultra-low-power STM32L151xC and STM32L152xC device features and peripheral counts STM32L15xUC Peripheral STM32L15xCC STM32L15xVC STM32L15xRC Flash (Kbytes) Data EEPROM (Kbytes) RAM (Kbytes) 32 bit General- Timers purpose Basic SPI/(I2S) Communica tion interfaces USART GPIOs Operation amplifiers 12-bit synchronized ADC Number of channels...
  • Page 12: Ultra-Low-Power Device Continuum

    BOM. Note: STMicroelectronics as a reliable and long-term manufacturer ensures as much as possible the pin-to-pin compatibility between any STM8Lxxxxx and STM32Lxxxxx devices and between any of the STM32Lx and STM32Fx series. Thanks to this unprecedented scalability, your old applications can be upgraded to respond to the latest market features and efficiency demand.
  • Page 13: Functional Overview

    STM32L151xC STM32L152xC Functional overview Functional overview Figure 1. Ultra-low-power STM32L151xC and STM32L152xC block diagram DocID022799 Rev 10 13/135...
  • Page 14: Low-Power Modes

    Functional overview STM32L151xC STM32L152xC Low-power modes The ultra-low-power STM32L151xC and STM32L152xC devices support dynamic voltage scaling to optimize its power consumption in run mode. The voltage from the internal low- drop regulator that supplies the logic can be adjusted according to the system’s maximum operating frequency and the external voltage supply.
  • Page 15: Table 3. Functionalities Depending On The Operating Power Supply Range

    STM32L151xC STM32L152xC Functional overview • Stop mode without RTC Stop mode achieves the lowest power consumption while retaining the RAM and register contents. All clocks are stopped, the PLL, MSI RC, HSI and LSI RC, LSE and HSE crystal oscillators are disabled. The voltage regulator is in the low-power mode. The device can be woken up from Stop mode by any of the EXTI line, in 8 µs.
  • Page 16: Table 4. Cpu Frequency Range Depending On Dynamic Voltage Scaling

    Functional overview STM32L151xC STM32L152xC Table 3. Functionalities depending on the operating power supply range (continued) Functionalities depending on the operating power supply range Operating power supply DAC and ADC Dynamic voltage I/O operation range operation scaling range Conversion time up Range 1, Range 2 = 2.0 to 2.4 V Functional...
  • Page 17: Table 5. Functionalities Depending On The Working Mode

    STM32L151xC STM32L152xC Functional overview Table 5. Functionalities depending on the working mode (from Run/active down to standby) Stop Standby Low- Low- Run/Active Sleep power power Wakeup Wakeup Sleep capability capability Flash Backup Registers EEPROM Brown-out rest (BOR) Programmable Voltage Detector (PVD) Power On Reset (POR)
  • Page 18: Arm ® Cortex ® -M3 Core With Mpu

    Functional overview STM32L151xC STM32L152xC Table 5. Functionalities depending on the working mode (from Run/active down to standby) (continued) Stop Standby Low- Low- Run/Active Sleep power power Wakeup Wakeup Sleep capability capability Tempsensor OP amp Comparators 16-bit and 32-bit Timers IWDG WWDG Touch sensing Systic Timer...
  • Page 19: Reset And Supply Management

    STM32L151xC STM32L152xC Functional overview The memory protection unit (MPU) improves system reliability by defining the memory attributes (such as read/write access permissions) for different memory regions. It provides up to eight different regions and an optional predefined background region. Owing to its embedded ARM core, the STM32L151xC and STM32L152xC devices are compatible with all ARM tools and software.
  • Page 20: Voltage Regulator

    Functional overview STM32L151xC STM32L152xC power ramp-up should guarantee that 1.65 V is reached on V at least 1 ms after it exits the POR area. Five BOR thresholds are available through option bytes, starting from 1.8 V to 3 V. To reduce the power consumption in Stop mode, it is possible to automatically switch off the internal reference voltage (V ) in Stop mode.
  • Page 21: Clock Management

    STM32L151xC STM32L152xC Functional overview Clock management The clock controller distributes the clocks coming from different oscillators to the core and the peripherals. It also manages clock gating for low-power modes and ensures clock robustness. It features: • Clock prescaler: to get the best trade-off between speed and current consumption, the clock frequency to the CPU and peripherals can be adjusted by a programmable prescaler.
  • Page 22: Figure 2. Clock Tree

    Functional overview STM32L151xC STM32L152xC Figure 2. Clock tree 1. For the USB function to be available, both HSE and PLL must be enabled, with the CPU running at either 24 MHz or 32 MHz. 22/135 DocID022799 Rev 10...
  • Page 23: Low-Power Real-Time Clock And Backup Registers

    STM32L151xC STM32L152xC Functional overview Low-power real-time clock and backup registers The real-time clock (RTC) is an independent BCD timer/counter. Dedicated registers contain the sub-second, second, minute, hour (12/24 hour), week day, date, month, year, in BCD (binary-coded decimal) format. Correction for 28, 29 (leap year), 30, and 31 day of the month are made automatically.
  • Page 24: Memories

    Functional overview STM32L151xC STM32L152xC Memories The STM32L151xC and STM32L152xC devices have the following features: • 32 Kbytes of embedded RAM accessed (read/write) at CPU clock speed with 0 wait states. With the enhanced bus matrix, operating the RAM does not lead to any performance penalty during accesses to the system bus (AHB and APB buses).
  • Page 25: Lcd (Liquid Crystal Display)

    STM32L151xC STM32L152xC Functional overview LCD (liquid crystal display) The LCD drives up to 8 common terminals and 44 segment terminals to drive up to 320 pixels. • Internal step-up converter to guarantee functionality and contrast control irrespective of . This converter can be deactivated, in which case the V pin is used to provide the voltage to the LCD •...
  • Page 26: Temperature Sensor

    Functional overview STM32L151xC STM32L152xC 3.10.1 Temperature sensor The temperature sensor (TS) generates a voltage V that varies linearly with SENSE temperature. The temperature sensor is internally connected to the ADC_IN16 input channel which is used to convert the sensor output voltage into a digital value. The sensor provides good linearity but it has to be calibrated to obtain good overall accuracy of the temperature measurement.
  • Page 27: Dac (Digital-To-Analog Converter)

    STM32L151xC STM32L152xC Functional overview 3.11 DAC (digital-to-analog converter) The two 12-bit buffered DAC channels can be used to convert two digital signals into two analog voltage signal outputs. The chosen design structure is composed of integrated resistor strings and an amplifier in non-inverting configuration. This dual digital Interface supports the following features: •...
  • Page 28: System Configuration Controller And Routing Interface

    Functional overview STM32L151xC STM32L152xC Both comparators can wake up from Stop mode, and be combined into a window comparator. The internal reference voltage is available externally via a low-power / low-current output buffer (driving current capability of 1 µA typical). 3.14 System configuration controller and routing interface The system configuration controller provides the capability to remap some alternate...
  • Page 29: General-Purpose Timers

    STM32L151xC STM32L152xC Functional overview Table 7. Timer feature comparison Counter Capture/compare Complementary Timer Counter type Prescaler factor request resolution channels outputs generation TIM2, Up, down, Any integer between TIM3, 16-bit up/down 1 and 65536 TIM4 Up, down, Any integer between TIM5 32-bit up/down...
  • Page 30: Basic Timers (Tim6 And Tim7)

    Functional overview STM32L151xC STM32L152xC 3.16.2 Basic timers (TIM6 and TIM7) These timers are mainly used for DAC trigger generation. They can also be used as generic 16-bit time bases. 3.16.3 SysTick timer This timer is dedicated to the OS, but could also be used as a standard downcounter. It is based on a 24-bit downcounter with autoreload capability and a programmable clock source.
  • Page 31: Inter-Integrated Sound (I2S)

    STM32L151xC STM32L152xC Functional overview The SPIs can be served by the DMA controller. 3.17.4 Inter-integrated sound (I Two standard I2S interfaces (multiplexed with SPI2 and SPI3) are available. They can operate in master or slave mode, and can be configured to operate with a 16-/32-bit resolution as input or output channels.
  • Page 32: Development Support

    Functional overview STM32L151xC STM32L152xC 3.19 Development support 3.19.1 Serial wire JTAG debug port (SWJ-DP) The ARM SWJ-DP interface is embedded, and is a combined JTAG and serial wire debug port that enables either a serial wire debug or a JTAG probe to be connected to the target. The JTAG JTMS and JTCK pins are shared with SWDAT and SWCLK, respectively, and a specific sequence on the JTMS pin is used to switch between JTAG-DP and SW-DP.
  • Page 33: Pin Descriptions

    STM32L151xC STM32L152xC Pin descriptions Pin descriptions Figure 3. STM32L15xVC UFBGA100 ballout 1. This figure shows the package top view DocID022799 Rev 10 33/135...
  • Page 34: Figure 4. Stm32L15Xvc Lqfp100 Pinout

    Pin descriptions STM32L151xC STM32L152xC Figure 4. STM32L15xVC LQFP100 pinout 1. This figure shows the package top view 34/135 DocID022799 Rev 10...
  • Page 35: Figure 5. Stm32L15Xrc Lqfp64 Pinout

    STM32L151xC STM32L152xC Pin descriptions Figure 5. STM32L15xRC LQFP64 pinout 1. This figure shows the package top view. DocID022799 Rev 10 35/135...
  • Page 36: Figure 6. Stm32L15Xuc Wlcsp63 Ballout

    Pin descriptions STM32L151xC STM32L152xC Figure 6. STM32L15xUC WLCSP63 ballout 1. This figure shows the package top view. 36/135 DocID022799 Rev 10...
  • Page 37: Figure 7. Stm32L15Xcc Ufqfpn48 Pinout

    STM32L151xC STM32L152xC Pin descriptions Figure 7. STM32L15xCC UFQFPN48 pinout 1. This figure shows the package top view. DocID022799 Rev 10 37/135...
  • Page 38: Table 8. Legend/Abbreviations Used In The Pinout Table

    Pin descriptions STM32L151xC STM32L152xC Figure 8. STM32L15xCC LQFP48 pinout 1. This figure shows the package top view Table 8. Legend/abbreviations used in the pinout table Name Abbreviation Definition Unless otherwise specified in brackets below the pin name, the pin function Pin name during and after reset is the same as the actual pin name Supply pin...
  • Page 39: Table 9. Stm32L151Xc And Stm32L152Xc Pin Definitions

    STM32L151xC STM32L152xC Pin descriptions Table 8. Legend/abbreviations used in the pinout table (continued) Name Abbreviation Definition Alternate Functions selected through GPIOx_AFR registers functions functions Additional Functions directly selected/enabled through peripheral registers functions Table 9. STM32L151xC and STM32L152xC pin definitions Pins Pin functions Main function...
  • Page 40 Pin descriptions STM32L151xC STM32L152xC Table 9. STM32L151xC and STM32L152xC pin definitions (continued) Pins Pin functions Main function Pin name (after Alternate functions Additional functions reset) PH1- OSC_OUT OSC_OUT NRST I/O RST NRST ADC_IN10/ LCD_SEG18 COMP1_INP ADC_IN11/ LCD_SEG19 COMP1_INP ADC_IN12/ 10 G7 LCD_SEG20 COMP1_INP ADC_IN13/...
  • Page 41 STM32L151xC STM32L152xC Pin descriptions Table 9. STM32L151xC and STM32L152xC pin definitions (continued) Pins Pin functions Main function Pin name (after Alternate functions Additional functions reset) SPI1_NSS/SPI3_NSS/ ADC_IN4/ 20 J6 I2S3_WS/ DAC_OUT1/ USART2_CK COMP1_INP ADC_IN5/ TIM2_CH1_ETR/ 21 H4 15 DAC_OUT2/ SPI1_SCK COMP1_INP ADC_IN6/ TIM3_CH1/TIM10_CH1/...
  • Page 42 Pin descriptions STM32L151xC STM32L152xC Table 9. STM32L151xC and STM32L152xC pin definitions (continued) Pins Pin functions Main function Pin name (after Alternate functions Additional functions reset) ADC_IN25/ PE10 PE10 TIM2_CH2 COMP1_INP PE11 PE11 TIM2_CH3 VLCDRAIL2 PE12 PE12 TIM2_CH4/SPI1_NSS VLCDRAIL3 M10 44 PE13 PE13 SPI1_SCK...
  • Page 43 STM32L151xC STM32L152xC Pin descriptions Table 9. STM32L151xC and STM32L152xC pin definitions (continued) Pins Pin functions Main function Pin name (after Alternate functions Additional functions reset) USART3_TX/ LCD_SEG28 USART3_RX/ LCD_SEG29 USART3_CK/ PD10 PD10 LCD_SEG30 USART3_CTS/ PD11 PD11 LCD_SEG31 TIM4_CH1/ PD12 PD12 USART3_RTS/ LCD_SEG32 PD13...
  • Page 44 Pin descriptions STM32L151xC STM32L152xC Table 9. STM32L151xC and STM32L152xC pin definitions (continued) Pins Pin functions Main function Pin name (after Alternate functions Additional functions reset) JTMS- 46 C2 34 PA13 JTMS-SWDIO SWDIO 47 A1 35 SS_2 SS_2 48 B2 36 DD_2 DD_2 JTCK-...
  • Page 45 STM32L151xC STM32L152xC Pin descriptions Table 9. STM32L151xC and STM32L152xC pin definitions (continued) Pins Pin functions Main function Pin name (after Alternate functions Additional functions reset) SPI2_MISO/ USART2_CTS SPI2_MOSI/I2S2_SD/ USART2_RTS USART2_TX USART2_RX TIM9_CH2/USART2_CK TIM2_CH2/SPI1_SCK/ COMP2_INM 55 C4 39 JTDO SPI3_SCK/I2S3_CK/ LCD_SEG7/JTDO TIM3_CH1/SPI1_MISO/ COMP2_INP 56 D4 40...
  • Page 46 Pin descriptions STM32L151xC STM32L152xC Table 9. STM32L151xC and STM32L152xC pin definitions (continued) Pins Pin functions Main function Pin name (after Alternate functions Additional functions reset) 63 A7 47 SS_3 SS_3 100 64 B7 48 DD_3 DD_3 1. I = input, O = output, S = supply. 2.
  • Page 47: Table 10. Alternate Function Input/Output

    Alternate functions Table 10. Alternate function input/output Digital alternate function number AFIO0 AFIO1 AFIO2 AFIO3 AFIO4 AFIO5 AFIO6 AFIO7 AFIO11 AFIO14 AFIO15 Port name Alternate function TIM9/ SYSTEM TIM2 TIM3/4/5 I2C1/2 SPI1/2 SPI3 USART1/2/3 CPRI SYSTEM 10/11 BOOT0 BOOT0 EVENT OUT NRST NRST PA0-...
  • Page 48 Table 10. Alternate function input/output (continued) Digital alternate function number AFIO0 AFIO1 AFIO2 AFIO3 AFIO4 AFIO5 AFIO6 AFIO7 AFIO11 AFIO14 AFIO15 Port name Alternate function TIM9/ SYSTEM TIM2 TIM3/4/5 I2C1/2 SPI1/2 SPI3 USART1/2/3 CPRI SYSTEM 10/11 TIM3_CH3 SEG5 EVEN TOUT TIM3_CH4 SEG6 EVENT OUT...
  • Page 49 Table 10. Alternate function input/output (continued) Digital alternate function number AFIO0 AFIO1 AFIO2 AFIO3 AFIO4 AFIO5 AFIO6 AFIO7 AFIO11 AFIO14 AFIO15 Port name Alternate function TIM9/ SYSTEM TIM2 TIM3/4/5 I2C1/2 SPI1/2 SPI3 USART1/2/3 CPRI SYSTEM 10/11 SEG22 TIMx_IC1 EVENT OUT SEG23 TIMx_IC2 EVENT OUT...
  • Page 50 Table 10. Alternate function input/output (continued) Digital alternate function number AFIO0 AFIO1 AFIO2 AFIO3 AFIO4 AFIO5 AFIO6 AFIO7 AFIO11 AFIO14 AFIO15 Port name Alternate function TIM9/ SYSTEM TIM2 TIM3/4/5 I2C1/2 SPI1/2 SPI3 USART1/2/3 CPRI SYSTEM 10/11 SPI2_MISO USART2_CTS TIMx_IC4 EVENT OUT SPI2_MOSI USART2_RTS TIMx_IC1...
  • Page 51 Table 10. Alternate function input/output (continued) Digital alternate function number AFIO0 AFIO1 AFIO2 AFIO3 AFIO4 AFIO5 AFIO6 AFIO7 AFIO11 AFIO14 AFIO15 Port name Alternate function TIM9/ SYSTEM TIM2 TIM3/4/5 I2C1/2 SPI1/2 SPI3 USART1/2/3 CPRI SYSTEM 10/11 TIMx_IC1 EVENT OUT TIM2_CH1_ETR TIM5_ETR TIMx_IC2 EVENT OUT...
  • Page 52: Memory Mapping

    Memory mapping STM32L151xC STM32L152xC Memory mapping Figure 9. Memory map 52/135 DocID022799 Rev 10...
  • Page 53: Electrical Characteristics

    STM32L151xC STM32L152xC Electrical characteristics Electrical characteristics Parameter conditions Unless otherwise specified, all voltages are referenced to V 6.1.1 Minimum and maximum values Unless otherwise specified the minimum and maximum values are guaranteed in the worst conditions of ambient temperature, supply voltage and frequencies by tests in production on 100% of the devices with an ambient temperature at T = 25 °C and T max (given by...
  • Page 54: Power Supply Scheme

    Electrical characteristics STM32L151xC STM32L152xC 6.1.6 Power supply scheme Figure 12. Power supply scheme 54/135 DocID022799 Rev 10...
  • Page 55: Optional Lcd Power Supply Scheme

    STM32L151xC STM32L152xC Electrical characteristics 6.1.7 Optional LCD power supply scheme Figure 13. Optional LCD power supply scheme 1. Option 1: LCD power supply is provided by a dedicated VLCD supply source, VSEL switch is open. 2. Option 2: LCD power supply is provided by the internal step-up converter, VSEL switch is closed, an external capacitance is needed for correct behavior of this converter.
  • Page 56: Absolute Maximum Ratings

    Electrical characteristics STM32L151xC STM32L152xC Absolute maximum ratings Stresses above the absolute maximum ratings listed in Table 11: Voltage characteristics, Table 12: Current characteristics, and Table 13: Thermal characteristics may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these conditions is not implied.
  • Page 57: Operating Conditions

    STM32L151xC STM32L152xC Electrical characteristics 5. A positive injection is induced by V > V while a negative injection is induced by V < V must never be INJ(PIN) exceeded. Refer to Table 11: Voltage characteristics for the maximum allowed input voltage values. 6.
  • Page 58: Embedded Reset And Power Control Block Characteristics

    Electrical characteristics STM32L151xC STM32L152xC Table 14. General operating conditions (continued) Symbol Parameter Conditions Unit 6 suffix version –40 Junction temperature range °C 7 suffix version –40 1. When the ADC is used, refer to Table 56: ADC characteristics. 2. It is recommended to power V and V from the same source.
  • Page 59 STM32L151xC STM32L152xC Electrical characteristics Table 15. Embedded reset and power control block characteristics (continued) Symbol Parameter Conditions Unit Falling edge 2.45 2.55 Brown-out reset threshold 3 BOR3 Rising edge 2.54 2.66 Falling edge 2.68 2.85 Brown-out reset threshold 4 BOR4 Rising edge 2.78 2.95...
  • Page 60: Embedded Internal Reference Voltage

    Electrical characteristics STM32L151xC STM32L152xC 6.3.3 Embedded internal reference voltage The parameters given in Table 17 are based on characterization results, unless otherwise specified. Table 16. Embedded internal reference voltage calibration values Calibration value name Description Memory address Raw data acquired at VREFINT_CAL temperature of 30 °C ±5 °C 0x1FF8 00F8 - 0x1FF8 00F9...
  • Page 61: Supply Current Characteristics

    STM32L151xC STM32L152xC Electrical characteristics 5. To guarantee less than 1% VREF_OUT deviation. 6.3.4 Supply current characteristics The current consumption is a function of several parameters and factors such as the operating voltage, temperature, I/O pin loading, device software configuration, operating frequencies, I/O pin switching rate, program location in memory and executed binary code.
  • Page 62: Table 18. Current Consumption In Run Mode, Code With Data Processing Running From Flash

    Electrical characteristics STM32L151xC STM32L152xC Table 18. Current consumption in Run mode, code with data processing running from Flash Symbol Parameter Conditions Unit HCLK 1 MHz Range 3, V =1.2 V CORE 2 MHz µA VOS[1:0] = 11 4 MHz 4 MHz 0.915 up to 16 HCLK...
  • Page 63: Table 19. Current Consumption In Run Mode, Code With Data Processing Running From Ram

    STM32L151xC STM32L152xC Electrical characteristics Table 19. Current consumption in Run mode, code with data processing running from RAM Symbol Parameter Conditions Unit HCLK 1 MHz Range 3, =1.2 V VOS[1:0] 2 MHz µA CORE = 11 4 MHz HCLK 0.755 4 MHz up to 16 MHz, Range 2,...
  • Page 64: Table 20. Current Consumption In Sleep Mode

    Electrical characteristics STM32L151xC STM32L152xC Table 20. Current consumption in Sleep mode Symbol Parameter Conditions Unit HCLK 1 MHz Range 3, =1.2 V 2 MHz 78.5 CORE VOS[1:0] = 11 4 MHz up to HCLK 4 MHz 16 MHz included, Range 2, =1.5 V 8 MHz HCLK...
  • Page 65: Table 21. Current Consumption In Low-Power Run Mode

    STM32L151xC STM32L152xC Electrical characteristics Table 21. Current consumption in Low-power run mode Symbol Parameter Conditions Unit = -40 °C to 25 °C MSI clock, 65 kHz = 85 °C = 32 kHz HCLK = 105 °C peripherals OFF, code =-40 °C to 25 °C executed MSI clock, 65 kHz = 85 °C...
  • Page 66: Table 22. Current Consumption In Low-Power Sleep Mode

    Electrical characteristics STM32L151xC STM32L152xC Table 22. Current consumption in Low-power sleep mode Symbol Parameter Conditions Unit MSI clock, 65 kHz = 32 kHz = -40 °C to 25 °C HCLK Flash OFF = -40 °C to 25 °C MSI clock, 65 kHz = 32 kHz = 85 °C HCLK...
  • Page 67: Table 23. Typical And Maximum Current Consumptions In Stop Mode

    STM32L151xC STM32L152xC Electrical characteristics Table 23. Typical and maximum current consumptions in Stop mode Symbol Parameter Conditions Unit = -40°C to 25°C 1.15 = 1.8 V = -40°C to 25°C = 55°C = 85°C RTC clocked by LSI = 105°C 6.35 or LSE external clock = -40°C to 25°C...
  • Page 68 Electrical characteristics STM32L151xC STM32L152xC Table 23. Typical and maximum current consumptions in Stop mode (continued) Symbol Parameter Conditions Unit Regulator in LP mode, HSI and HSE OFF, independent = -40°C to 25°C watchdog and LSI enabled Supply current in = -40°C to 25°C 0.435 (Stop) Stop mode (RTC...
  • Page 69: Table 24. Typical And Maximum Current Consumptions In Standby Mode

    STM32L151xC STM32L152xC Electrical characteristics Table 24. Typical and maximum current consumptions in Standby mode Symbol Parameter Conditions Unit = -40 °C to 25 °C 0.905 = 1.8 V = -40 °C to 25 °C 1.15 RTC clocked by LSI (no independent watchdog) = 55 °C = 85 °C...
  • Page 70: Table 25. Peripheral Current Consumption

    Electrical characteristics STM32L151xC STM32L152xC Table 25. Peripheral current consumption Typical consumption, V = 3.0 V, T = 25 °C Range 1, Range 2, Range 3, Low-power Peripheral Unit CORE CORE CORE 1.8 V 1.5 V 1.2 V sleep and VOS[1:0] = VOS[1:0] = VOS[1:0] = TIM2...
  • Page 71 STM32L151xC STM32L152xC Electrical characteristics Table 25. Peripheral current consumption (continued) Typical consumption, V = 3.0 V, T = 25 °C Range 1, Range 2, Range 3, Low-power Peripheral Unit CORE CORE CORE 1.8 V 1.5 V 1.2 V sleep and VOS[1:0] = VOS[1:0] = VOS[1:0] =...
  • Page 72: Wakeup Time From Low-Power Mode

    Electrical characteristics STM32L151xC STM32L152xC 3. In Low-power sleep and run mode, the Flash memory must always be in power-down mode. 4. Data based on a differential I measurement between ADC in reset configuration and continuous ADC conversion (HSI consumption not included). 5.
  • Page 73: External Clock Source Characteristics

    STM32L151xC STM32L152xC Electrical characteristics 6.3.6 External clock source characteristics High-speed external user clock generated from an external source In bypass mode the HSE oscillator is switched off and the input pin is a standard GPIO.The external clock signal has to respect the I/O characteristics in Section 6.3.12.
  • Page 74: Table 28. Low-Speed External User Clock Characteristics

    Electrical characteristics STM32L151xC STM32L152xC Low-speed external user clock generated from an external source The characteristics given in the following table result from tests performed using a low- speed external clock source, and under the conditions summarized in Table Table 28. Low-speed external user clock characteristics Symbol Parameter Conditions...
  • Page 75: Table 29. Hse Oscillator Characteristics

    STM32L151xC STM32L152xC Electrical characteristics (1)(2) Table 29. HSE oscillator characteristics Symbol Parameter Conditions Min Typ Unit Oscillator frequency OSC_IN Feedback resistor kΩ Recommended load capacitance versus = 30 Ω equivalent serial resistance of the crystal = 3.3 V, HSE driving current with 30 pF load 2.5 (startup)
  • Page 76: Figure 17. Hse Oscillator Circuit Diagram

    Electrical characteristics STM32L151xC STM32L152xC Figure 17. HSE oscillator circuit diagram 1. R value depends on the crystal characteristics. Low-speed external clock generated from a crystal/ceramic resonator The low-speed external (LSE) clock can be supplied with a 32.768 kHz crystal/ceramic resonator oscillator. All the information given in this paragraph are based on characterization results obtained with typical external components specified in Table 30.
  • Page 77: Figure 18. Typical Application With A 32.768 Khz Crystal

    STM32L151xC STM32L152xC Electrical characteristics is the startup time measured from the moment it is enabled (by software) to a stabilized SU(LSE) 32.768 kHz oscillation is reached. This value is measured for a standard crystal resonator and it can vary significantly with the crystal manufacturer. Note: For C and C...
  • Page 78: Internal Clock Source Characteristics

    Electrical characteristics STM32L151xC STM32L152xC 6.3.7 Internal clock source characteristics The parameters given in Table 31 are derived from tests performed under the conditions summarized in Table High-speed internal (HSI) RC oscillator Table 31. HSI oscillator characteristics Symbol Parameter Conditions Unit Frequency = 3.0 V ±...
  • Page 79: Table 33. Msi Oscillator Characteristics

    STM32L151xC STM32L152xC Electrical characteristics Multi-speed internal (MSI) RC oscillator Table 33. MSI oscillator characteristics Symbol Parameter Condition Max Unit MSI range 0 65.5 MSI range 1 MSI range 2 Frequency after factory calibration, done at MSI range 3 = 3.3 V and T = 25 °C MSI range 4 1.05...
  • Page 80 Electrical characteristics STM32L151xC STM32L152xC Table 33. MSI oscillator characteristics (continued) Symbol Parameter Condition Max Unit MSI range 0 MSI range 1 MSI range 2 MSI range 3 MSI range 4 MSI oscillator stabilization time µs STAB(MSI) MSI range 5 MSI range 6, Voltage range 1 and 2 MSI range 3,...
  • Page 81: Pll Characteristics

    STM32L151xC STM32L152xC Electrical characteristics 6.3.8 PLL characteristics The parameters given in Table 34 are derived from tests performed under the conditions summarized in Table Table 34. PLL characteristics Value Symbol Parameter Unit PLL input clock PLL_IN PLL input clock duty cycle PLL output clock PLL_OUT PLL lock time...
  • Page 82: Table 36. Flash Memory And Data Eeprom Characteristics

    Electrical characteristics STM32L151xC STM32L152xC Flash memory and data EEPROM Table 36. Flash memory and data EEPROM characteristics Symbol Parameter Conditions Unit Operating voltage 1.65 Read / Write / Erase Programming/ erasing Erasing 3.28 3.94 time for byte / word / prog Programming 3.28...
  • Page 83: Emc Characteristics

    STM32L151xC STM32L152xC Electrical characteristics 6.3.10 EMC characteristics Susceptibility tests are performed on a sample basis during device characterization. Functional EMS (electromagnetic susceptibility) While a simple application is executed on the device (toggling 2 LEDs through I/O ports). the device is stressed by two electromagnetic events until a failure occurs. The failure is indicated by the LEDs: •...
  • Page 84: Electrical Sensitivity Characteristics

    Electrical characteristics STM32L151xC STM32L152xC To complete these trials, ESD stress can be applied directly on the device, over the range of specification values. When unexpected behavior is detected, the software can be hardened to prevent unrecoverable errors occurring (see application note AN1015). Electromagnetic Interference (EMI) The electromagnetic field emitted by the device are monitored while a simple application is executed (toggling 2 LEDs through the I/O ports).
  • Page 85: I/O Current Injection Characteristics

    STM32L151xC STM32L152xC Electrical characteristics Static latch-up Two complementary static tests are required on six parts to assess the latch-up performance: • A supply overvoltage is applied to each power supply pin • A current injection is applied to each input, output and configurable I/O pin These tests are compliant with EIA/JESD 78A IC latch-up standard.
  • Page 86: I/O Port Characteristics

    Electrical characteristics STM32L151xC STM32L152xC 6.3.13 I/O port characteristics General input/output characteristics Unless otherwise specified, the parameters given in Table 49 are derived from tests performed under the conditions summarized in Table 14. All I/Os are CMOS and TTL compliant. Table 43. I/O static characteristics Symbol Parameter Conditions...
  • Page 87: Table 44. Output Voltage Characteristics

    STM32L151xC STM32L152xC Electrical characteristics Output driving current The GPIOs (general purpose input/outputs) can sink or source up to ±8 mA, and sink or source up to ±20 mA with the non-standard V specifications given in Table In the user application, the number of I/O pins which can drive current must be limited to respect the absolute maximum rating specified in Section 6.2:...
  • Page 88: Table 45. I/O Ac Characteristics

    Electrical characteristics STM32L151xC STM32L152xC Input/output AC characteristics The definition and values of input/output AC characteristics are given in Figure 19 Table 45, respectively. Unless otherwise specified, the parameters given in Table 45 are derived from tests performed under the conditions summarized in Table Table 45.
  • Page 89: Nrst Pin Characteristics

    STM32L151xC STM32L152xC Electrical characteristics Figure 19. I/O AC characteristics definition 6.3.14 NRST pin characteristics The NRST pin input driver uses CMOS technology. It is connected to a permanent pull-up resistor, R (see Table Unless otherwise specified, the parameters given in Table 46 are derived from tests performed under the conditions summarized in...
  • Page 90: Tim Timer Characteristics

    Electrical characteristics STM32L151xC STM32L152xC Figure 20. Recommended NRST pin protection 1. The reset network protects the device against parasitic resets. 2. The user must ensure that the level on the NRST pin can go below the V max level specified in IL(NRST) Table 46.
  • Page 91: Communications Interfaces

    STM32L151xC STM32L152xC Electrical characteristics 6.3.16 Communications interfaces C interface characteristics The device I C interface meets the requirements of the standard I C communication protocol with the following restrictions: SDA and SCL are not “true” open-drain I/O pins. When configured as open-drain, the PMOS connected between the I/O pin and V disabled, but is still present.
  • Page 92: Table 49. Scl Frequency

    Electrical characteristics STM32L151xC STM32L152xC Figure 21. I C bus AC waveforms and measurement circuit 1. R = series protection resistor. 2. R = external pull-up resistor. 3. V is the I2C bus power supply. DD_I2C 4. Measurement points are done at CMOS levels: 0.3V and 0.7V (1)(2) Table 49.
  • Page 93: Table 50. Spi Characteristics

    STM32L151xC STM32L152xC Electrical characteristics SPI characteristics Unless otherwise specified, the parameters given in the following table are derived from tests performed under the conditions summarized in Table Refer to Section 6.3.12: I/O current injection characteristics for more details on the input/output alternate function characteristics (NSS, SCK, MOSI, MISO).
  • Page 94: Figure 22. Spi Timing Diagram - Slave Mode And Cpha = 0

    Electrical characteristics STM32L151xC STM32L152xC Figure 22. SPI timing diagram - slave mode and CPHA = 0 Figure 23. SPI timing diagram - slave mode and CPHA = 1 1. Measurement points are done at CMOS levels: 0.3V and 0.7V 94/135 DocID022799 Rev 10...
  • Page 95: Figure 24. Spi Timing Diagram - Master Mode (1)

    STM32L151xC STM32L152xC Electrical characteristics Figure 24. SPI timing diagram - master mode 1. Measurement points are done at CMOS levels: 0.3V and 0.7V DocID022799 Rev 10 95/135...
  • Page 96: Table 51. Usb Startup Time

    Electrical characteristics STM32L151xC STM32L152xC USB characteristics The USB interface is USB-IF certified (full speed). Table 51. USB startup time Symbol Parameter Unit USB transceiver startup time µs STARTUP 1. Guaranteed by design, not tested in production. Table 52. USB DC electrical characteristics Symbol Parameter Conditions...
  • Page 97: Table 54. I2S Characteristics

    STM32L151xC STM32L152xC Electrical characteristics Table 53. USB: full speed electrical characteristics (continued) Driver characteristics Symbol Parameter Conditions Unit Rise/ fall time matching Output signal crossover voltage 1. Guaranteed by design, not tested in production. 2. Measured from 10% to 90% of the data signal. For more detailed informations, please refer to USB Specification - Chapter 7 (version 2.0).
  • Page 98: Figure 26. I 2 S Slave Timing Diagram (Philips Protocol)

    Electrical characteristics STM32L151xC STM32L152xC ODD bit value, digital contribution leads to a min of (I2SDIV/(2*I2SDIV+ODD) and a max of (I2SDIV+ODD)/(2*I2SDIV+ODD). Fs max is supported for each mode/condition. Figure 26. I S slave timing diagram (Philips protocol) 1. Measurement points are done at CMOS levels: 0.3 × V and 0.7 ×...
  • Page 99: 12-Bit Adc Characteristics

    STM32L151xC STM32L152xC Electrical characteristics 6.3.17 12-bit ADC characteristics Unless otherwise specified, the parameters given in Table 56 are guaranteed by design. Table 55. ADC clock frequency Symbol Parameter Conditions Unit REF+ = < V REF+ 2.4 V ≤ V ≤ 3.6 V >...
  • Page 100 Electrical characteristics STM32L151xC STM32L152xC Table 56. ADC characteristics (continued) Symbol Parameter Conditions Unit Direct channels 0.25 2.4 V ≤ V ≤ 3.6 V Multiplexed channels 0.56 2.4 V ≤ V ≤ 3.6 V µs Sampling time Direct channels 0.56 1.8 V ≤ V ≤...
  • Page 101: Table 57. Adc Accuracy

    STM32L151xC STM32L152xC Electrical characteristics (1)(2) Table 57. ADC accuracy Symbol Parameter Test conditions Unit Total unadjusted error Offset error 2.4 V ≤ V ≤ 3.6 V 2.4 V ≤ V ≤ 3.6 V REF+ Gain error = 8 MHz, R = 50 Ω...
  • Page 102: Figure 28. Adc Accuracy Characteristics

    Electrical characteristics STM32L151xC STM32L152xC Figure 28. ADC accuracy characteristics Figure 29. Typical connection diagram using the ADC 1. Refer to Table 58: Maximum source impedance RAIN max for the value of R Table 56: ADC characteristics for the value of C 2.
  • Page 103: Figure 30. Maximum Dynamic Current Consumption On V

    STM32L151xC STM32L152xC Electrical characteristics Figure 30. Maximum dynamic current consumption on V supply pin during ADC REF+ conversion Sampling (n cycles) Conversion (12 cycles) ADC clock ref+ 700µA 300µA MS36686V1 Table 58. Maximum source impedance R max (kΩ) Ts (cycles) Multiplexed channels Direct channels (µs)
  • Page 104: Dac Electrical Specifications

    Electrical characteristics STM32L151xC STM32L152xC 6.3.18 DAC electrical specifications Data guaranteed by design, not tested in production, unless otherwise specified. Table 59. DAC characteristics Symbol Parameter Conditions Unit Analog supply voltage Reference supply must always be below REF+ REF+ voltage Lower reference voltage REF- Current consumption on No load, middle code (0x800)
  • Page 105 STM32L151xC STM32L152xC Electrical characteristics Table 59. DAC characteristics (continued) Symbol Parameter Conditions Unit = 3.3V = 3.0V REF+ = 0 to 50 ° C DAC output buffer OFF Offset error temperature dOffset/dT µV/°C coefficient (code 0x800) = 3.3V = 3.0V REF+ = 0 to 50 °...
  • Page 106: Operational Amplifier Characteristics

    Electrical characteristics STM32L151xC STM32L152xC 4. Difference between measured value at Code i and the value at Code i on a line drawn between Code 0 and last Code 4095. 5. Difference between the value measured at Code (0x800) and the ideal value = V REF+ 6.
  • Page 107 STM32L151xC STM32L152xC Electrical characteristics Table 60. Operational amplifier characteristics (continued) Symbol Parameter Condition Unit Normal mode Power supply PSRR rejection ratio Low-power mode Normal mode 1000 3000 >2.4 V Low-power mode Bandwidth Normal mode 2200 <2.4 V Low-power mode >2.4 V Normal mode (between 0.1 V and -0.1 V)
  • Page 108: Temperature Sensor Characteristics

    Electrical characteristics STM32L151xC STM32L152xC 6.3.20 Temperature sensor characteristics Table 61. Temperature sensor calibration values Calibration value name Description Memory address TS ADC raw data acquired at temperature of 30 °C ±5 °C TS_CAL1 0x1FF8 00FA - 0x1FF8 00FB = 3 V ±10 mV TS ADC raw data acquired at temperature of 110 °C ±5 °C TS_CAL2...
  • Page 109: Table 64. Comparator 2 Characteristics

    STM32L151xC STM32L152xC Electrical characteristics 1. Guaranteed by characterization results, not tested in production. 2. The delay is characterized for 100 mV input step with 10 mV overdrive on the inverting input, the non- inverting input set to the reference. 3. Comparator consumption only. Internal reference voltage not included. Table 64.
  • Page 110: Lcd Controller

    Electrical characteristics STM32L151xC STM32L152xC 6.3.22 LCD controller The device embeds a built-in step-up converter to provide a constant LCD reference voltage independently from the V voltage. An external capacitor C must be connected to the pin to decouple this converter. Table 65.
  • Page 111: Package Characteristics

    STM32L151xC STM32L152xC Package characteristics Package characteristics Package information In order to meet environmental requirements, ST offers these devices in different grades of ® ® ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ®...
  • Page 112: Table 66. Lqpf100, 14 X 14 Mm, 100-Pin Low-Profile Quad Flat Package Mechanical Data

    Package characteristics STM32L151xC STM32L152xC Table 66. LQPF100, 14 x 14 mm, 100-pin low-profile quad flat package mechanical data millimeters inches Symbol 1.600 0.0630 0.050 0.150 0.0020 0.0059 1.350 1.400 1.450 0.0531 0.0551 0.0571 0.170 0.220 0.270 0.0067 0.0087 0.0106 0.090 0.200 0.0035 0.0079...
  • Page 113: Figure 34. Lqfp100 Package Top View Example

    STM32L151xC STM32L152xC Package characteristics Marking of engineering samples The following figure gives an example of topside marking orientation versus pin 1 identifier location. Figure 34. LQFP100 package top view example 1. Parts marked as “ES”, “E” or accompanied by an Engineering Sample notification letter, are not yet qualified and therefore not yet ready to be used in production and any consequences deriving from such usage will not be at ST charge.
  • Page 114: Lqfp64, 10 X 10 Mm, 64-Pin Low-Profile Quad Flat Package

    Package characteristics STM32L151xC STM32L152xC 7.1.2 LQFP64, 10 x 10 mm, 64-pin low-profile quad flat package information Figure 35. LQFP64, 10 x 10 mm, 64-pin low-profile quad flat package outline 1. Drawing is not to scale. 114/135 DocID022799 Rev 10...
  • Page 115: Table 67. Lqfp64, 10 X 10 Mm 64-Pin Low-Profile Quad Flat Package Mechanical Data

    STM32L151xC STM32L152xC Package characteristics Table 67. LQFP64, 10 x 10 mm 64-pin low-profile quad flat package mechanical data millimeters inches Symbol 1.600 0.0630 0.050 0.150 0.0020 0.0059 1.350 1.400 1.450 0.0531 0.0551 0.0571 0.170 0.220 0.270 0.0067 0.0087 0.0106 0.090 0.200 0.0035 0.0079...
  • Page 116: Figure 37. Lqfp64 Package Top View Example

    Package characteristics STM32L151xC STM32L152xC Marking of engineering samples The following figure gives an example of topside marking orientation versus pin 1 identifier location. Figure 37. LQFP64 package top view example 1. Parts marked as “ES”, “E” or accompanied by an Engineering Sample notification letter, are not yet qualified and therefore not yet ready to be used in production and any consequences deriving from such usage will not be at ST charge.
  • Page 117: Lqfp48, 7 X 7 Mm, 48-Pin Low-Profile Quad Flat Package

    STM32L151xC STM32L152xC Package characteristics 7.1.3 LQFP48, 7 x 7 mm, 48-pin low-profile quad flat package information Figure 38. LQFP48, 7 x 7 mm, 48-pin low-profile quad flat package outline 1. Drawing is not to scale. DocID022799 Rev 10 117/135...
  • Page 118: Table 68. Lqfp48, 7 X 7 Mm, 48-Pin Low-Profile Quad Flat Package Mechanical Data

    Package characteristics STM32L151xC STM32L152xC Table 68. LQFP48, 7 x 7 mm, 48-pin low-profile quad flat package mechanical data millimeters inches Symbol 1.600 0.0630 0.050 0.150 0.0020 0.0059 1.350 1.400 1.450 0.0531 0.0551 0.0571 0.170 0.220 0.270 0.0067 0.0087 0.0106 0.090 0.200 0.0035 0.0079...
  • Page 119: Figure 40. Lqfp48 Package Top View Example

    STM32L151xC STM32L152xC Package characteristics Marking of engineering samples The following figure gives an example of topside marking orientation versus pin 1 identifier location. Figure 40. LQFP48 package top view example 1. Parts marked as “ES”, “E” or accompanied by an Engineering Sample notification letter, are not yet qualified and therefore not yet ready to be used in production and any consequences deriving from such usage will not be at ST charge.
  • Page 120: Ufqfpn48 7 X 7 Mm, 0.5 Mm Pitch, Package Information

    Package characteristics STM32L151xC STM32L152xC 7.1.4 UFQFPN48 7 x 7 mm, 0.5 mm pitch, package information Figure 41. UFQFPN48 7 x 7 mm, 0.5 mm pitch, package outline 1. Drawing is not to scale. 2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life. 3.
  • Page 121: Table 69. Ufqfpn48 - Ultra Thin Fine Pitch Quad Flat Pack No-Lead 7 × 7 Mm

    STM32L151xC STM32L152xC Package characteristics Table 69. UFQFPN48 – ultra thin fine pitch quad flat pack no-lead 7 × 7 mm, 0.5 mm pitch package mechanical data millimeters inches Symbol 0.500 0.550 0.600 0.0197 0.0217 0.0236 0.000 0.020 0.050 0.0000 0.0008 0.0020 6.900 7.000...
  • Page 122: Figure 43. Ufqfpn48 Package Top View Example

    Package characteristics STM32L151xC STM32L152xC Marking of engineering samples The following figure gives an example of topside marking orientation versus pin 1 identifier location. Figure 43. UFQFPN48 package top view example 1. Parts marked as “ES”, “E” or accompanied by an Engineering Sample notification letter, are not yet qualified and therefore not yet ready to be used in production and any consequences deriving from such usage will not be at ST charge.
  • Page 123: Ufbga100, 7 X 7 Mm, 100-Ball Ultra Thin, Fine Pitch Ball Grid Array Package Information

    STM32L151xC STM32L152xC Package characteristics 7.1.5 UFBGA100, 7 x 7 mm, 100-ball ultra thin, fine pitch ball grid array package information Figure 44. UFBGA100, 7 x 7 mm, 100-ball ultra thin, fine pitch ball grid array package outline 1. Drawing is not to scale. Table 70.
  • Page 124: Figure 45. Ufbga100 Package Top View Example

    Package characteristics STM32L151xC STM32L152xC Table 70. UFBGA100, 7 x 7 mm, 100-ball ultra thin, fine pitch ball grid array package mechanical data (continued) millimeters inches Symbol 0.150 0.0059 0.050 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. Marking of engineering samples The following figure gives an example of topside marking orientation versus ball A1 identifier location.
  • Page 125: Information

    STM32L151xC STM32L152xC Package characteristics 7.1.6 WLCSP63, 0.400 mm pitch wafer level chip size package information Figure 46. WLCSP63, 0.400 mm pitch wafer level chip size package outline 1. Drawing is not to scale. DocID022799 Rev 10 125/135...
  • Page 126: Table 71. Wlcsp63, 0.400 Mm Pitch Wafer Level Chip Size Package Mechanical Data

    Package characteristics STM32L151xC STM32L152xC Table 71. WLCSP63, 0.400 mm pitch wafer level chip size package mechanical data millimeters inches Symbol 0.540 0.570 0.600 0.0213 0.0224 0.0236 0.190 0.0075 0.380 0.0150 0.025 0.0010 Øb 0.240 0.270 0.300 0.0094 0.0106 0.0118 3.193 3.228 3.263 0.1257...
  • Page 127: Figure 47. Wlcsp63 Device Marking Example

    STM32L151xC STM32L152xC Package characteristics Marking of engineering samples The following figure gives an example of topside marking orientation versus ball A1 identifier location. Figure 47. WLCSP63 device marking example 1. Parts marked as “ES”, “E” or accompanied by an Engineering Sample notification letter, are not yet qualified and therefore not yet ready to be used in production and any consequences deriving from such usage will not be at ST charge.
  • Page 128: Thermal Characteristics

    Package characteristics STM32L151xC STM32L152xC Thermal characteristics The maximum chip-junction temperature, T max, in degrees Celsius, may be calculated using the following equation: max = T max + (P max × Θ Where: • max is the maximum ambient temperature in ° C, •...
  • Page 129: Reference Document

    STM32L151xC STM32L152xC Package characteristics Figure 48. Thermal resistance suffix 6 Figure 49. Thermal resistance suffix 7 7.2.1 Reference document JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air). Available from www.jedec.org. DocID022799 Rev 10 129/135...
  • Page 130: Part Numbering

    Part numbering STM32L151xC STM32L152xC Part numbering Table 73. STM32L151xC and STM32L152xC ordering information scheme Example: STM32 L 151 R C Device family STM32 = ARM-based 32-bit microcontroller Product type L = Low-power Device subfamily 151: Devices without LCD 152: Devices with LCD Pin count C = 48 pins U = 63 pins...
  • Page 131: Revision History

    STM32L151xC STM32L152xC Revision History Revision History Table 74. Document revision history Date Revision Changes 21-Feb-2012 Initial release. Added WLCSP63 package. Updated Figure 1: Ultra-low-power STM32L162xC block diagram. Changed maximum number of touch sensing channels to 34, and updated Table 2: Ultralow power STM32L15xxC device features and peripheral counts.
  • Page 132 Revision History STM32L151xC STM32L152xC Table 74. Document revision history (continued) Date Revision Changes Removed AHB1/AHB2 and corrected typo on APB1/APB2 in:Figure 1: Ultra-low-power STM32L162xC block diagram-low-power STM32L162xC block diagram Updated “OP amp” line in Table 4: Functionalities depending on the working mode (from Run/active down to standby) Added IWDG and WWDG rows in Table 4: Functionalities depending...
  • Page 133 STM32L151xC STM32L152xC Revision History Table 74. Document revision history (continued) Date Revision Changes Updated Section 3.15: Touch sensing. Added V = 1.71 to 1.8 V operating power supply range in Table 4: Functionalities depending on the working mode (from Run/active down to standby) Renamed "I/O Level"...
  • Page 134 Revision History STM32L151xC STM32L152xC Table 74. Document revision history (continued) Date Revision Changes Apply footnote 1 also to VDD= 1.8 to 2.0 V in Table 2: Functionalities depending on the operating power supply range. Updated I pin in Table 11: Current characteristics.
  • Page 135 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders.

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