STMicroelectronics STM32L151CB Manual

STMicroelectronics STM32L151CB Manual

Ultralow power arm-based 32-bit mcu with up to 128 kb flash,rtc, lcd, usb, usart, i2c, spi, timers, adc, dac, comparators
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Ultralow power ARM-based 32-bit MCU with up to 128 KB Flash,
RTC, LCD, USB, USART, I2C, SPI, timers, ADC, DAC, comparators
Features
Operating conditions
– Operating power supply range: 1.65 V to
3.6 V (without BOR) or 1.8 V to 3.6 V (with
BOR option)
– Temperature range: –40 to 85 °C
Low power features
– 4 modes: Sleep, Low-power run (9 µA at
32 kHz), Low-power sleep (4.4 µA),
Stop with RTC (1.45 µA), Stop (570 nA),
Standby (300 nA)
– Dynamic core voltage scaling down to
233 µA/MHz
– Ultralow leakage per I/O: 50 nA
– Fast wakeup from Stop: 8 µs
– Three wakeup pins
Core: ARM 32-bit Cortex
– 32 MHz maximum frequency,
33.3 DMIPS peak (Dhrystone 2.1)
– Memory protection unit
Reset and supply management
– Low power, ultrasafe BOR (brownout reset)
with 5 selectable thresholds
– Ultralow power POR/PDR
– Programmable voltage detector (PVD)
Clock management
– 1 to 24 MHz crystal oscillator
– 32 kHz oscillator for RTC with calibration
– Internal 16 MHz factory-trimmed RC
– Internal 37 kHz low consumption RC
– Internal multispeed low power RC, 65 kHz
to 4.2 MHz with consumption down to
1.5 µA
– PLL for CPU clock and USB (48 MHz)
Low power calendar RTC
– Alarm, periodic wakeup from Stop/Standby
Memories
– Up to 128 Kbyte of Flash memory with ECC
– 4 Kbyte of data EEPROM with ECC
January 2012
-M3 CPU
Doc ID 17659 Rev 6
STM32L151xx
STM32L152xx
LQFP100 14 × 14 mm
BGA100 7 × 7 mm
BGA64 5 × 5 mm
LQFP64 10 × 10 mm
LQFP48 7 × 7 mm
– Up to 16 Kbyte of RAM
Up to 83 fast I/Os (73 of which are 5 V-tolerant)
all mappable on 16 external interrupt vectors
Development support
– Serial wire debug, JTAG and trace
DMA: 7-channel DMA controller, supporting
timers, ADC, SPIs, I
LCD 8 × 40 or 4 × 44 with step-up converter
12-bit ADC up to 1 Msps/24 channels
– Temperature sensor and internal voltage
reference
– Operates down to 1.8 V
2 × 12-bit DACs with output buffers
2 ultralow power comparators
– Window mode and wakeup capability
10 timers:
– 6 × 16-bit general-purpose timers, each
with up to 4 IC/OC/PWM channels
– 2 × 16-bit basic timers
– 2 × watchdog timers (independent and
window)
Up to 8 communication interfaces
2
– Up to 2 × I
C interfaces (SMBus/PMBus)
– Up to 3 × USARTs (ISO 7816 interface,
LIN, IrDA capability, modem control)
– Up to 2 × SPIs (16 Mbit/s)
– USB 2.0 full speed interface
CRC calculation unit, 96-bit unique ID
Table 1.
Device summary
Reference
STM32L151CB, STM32L151C8, STM32L151C6,
STM32L151xx
STM32L151RB, STM32L151R8, STM32L151R6,
STM32L151VB, STM32L151V8
STM32L152CB, STM32L152C8, STM32L152C6,
STM32L152xx
STM32L152RB, STM32L152R8, STM32L152R6,
STM32L152VB, STM32L152V8
UFQFPN48
7 × 7 mm
2
Cs and USARTs
Part number
1/109
www.st.com
1

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Summary of Contents for STMicroelectronics STM32L151CB

  • Page 1 Table 1. Device summary ■ Low power calendar RTC Reference Part number – Alarm, periodic wakeup from Stop/Standby STM32L151CB, STM32L151C8, STM32L151C6, STM32L151xx STM32L151RB, STM32L151R8, STM32L151R6, ■ Memories STM32L151VB, STM32L151V8 STM32L152CB, STM32L152C8, STM32L152C6, – Up to 128 Kbyte of Flash memory with ECC...
  • Page 2: Table Of Contents

    Contents STM32L151xx, STM32L152xx Contents Introduction ..........8 Description .
  • Page 3 STM32L151xx, STM32L152xx Contents 3.14.5 Window watchdog (WWDG) ....... . . 23 3.15 Communication interfaces .
  • Page 4 Contents STM32L151xx, STM32L152xx 6.3.14 TIM timer characteristics ........77 6.3.15 Communications interfaces .
  • Page 5 STM32L151xx, STM32L152xx List of tables List of tables Table 1. Device summary ............1 Table 2.
  • Page 6 List of tables STM32L151xx, STM32L152xx Table 49. ADC clock frequency ........... . . 84 Table 50.
  • Page 7 STM32L151xx, STM32L152xx List of figures List of figures Figure 1. Ultralow power STM32L15xxx block diagram........12 Figure 2.
  • Page 8: Introduction

    Introduction STM32L151xx, STM32L152xx Introduction This datasheet provides the ordering information and mechanical device characteristics of the STM32L151xx and STM32L152xx ultralow power ARM Cortex™-based microcontrollers product line. The ultralow power STM32L15xxx family includes devices in 3 different package types: from 48 pins to 100 pins. Depending on the device chosen, different sets of peripherals are included, the description below gives an overview of the complete range of peripherals proposed in this family.
  • Page 9: Description

    STM32L151xx, STM32L152xx Description Description The ultralow power STM32L15xxx incorporates the connectivity power of the universal ™ serial bus (USB) with the high-performance ARM Cortex -M3 32-bit RISC core operating at a 32 MHz frequency, a memory protection unit (MPU), high-speed embedded memories (Flash memory up to 128 Kbytes and RAM up to 16 Kbytes), and an extensive range of enhanced I/Os and peripherals connected to two APB buses.
  • Page 10: Device Overview

    Description STM32L151xx, STM32L152xx Device overview Table 2. Ultralow power STM32L15xxx device features and peripheral counts Peripheral STM32L15xCx STM32L15xRx STM32L15xVx Flash - Kbytes RAM - Kbytes General- purpose Timers Basic Communication interfaces USART GPIOs 12-bit synchronized ADC 16 channels 20 channels 24 channels Number of channels 12-bit DAC...
  • Page 11: Ultralow Power Device Continuum

    STM8L101xx and STM8L15xx devices. The STM8L and STM32L families allow a continuum of performance, peripherals, system architecture and features. They are all based on STMicroelectronics 0.13 µm ultralow leakage process. Note: The ultralow power STM32L and general-purpose STM32Fxxxx families are pin-to-pin compatible.
  • Page 12: Functional Overview

    Functional overview STM32L151xx, STM32L152xx Functional overview Figure 1 shows the block diagrams. Figure 1. Ultralow power STM32L15xxx block diagram 1. AF = alternate function on I/O port pin. 12/109 Doc ID 17659 Rev 6...
  • Page 13: Low Power Modes

    STM32L151xx, STM32L152xx Functional overview Low power modes The ultralow power STM32L15xxx supports dynamic voltage scaling to optimize its power consumption in run mode. The voltage from the internal low-drop regulator that supplies the logic can be adjusted according to the system’s maximum operating frequency and the external voltage supply: ●...
  • Page 14: Arm® Cortex™-M3 Core With Mpu

    Functional overview STM32L151xx, STM32L152xx ● Standby mode (with or without RTC) The Standby mode is used to achieve the lowest power consumption. The internal voltage regulator is switched off so that the entire V domain is powered off. The CORE PLL, MSI RC, HSI RC and HSE crystal oscillators are also switched off.
  • Page 15: Reset And Supply Management

    STM32L151xx, STM32L152xx Functional overview Reset and supply management 3.3.1 Power supply schemes ● = 1.65 to 3.6 V: external power supply for I/Os and the internal regulator. Provided externally through V pins. ● = 1.65 to 3.6 V: external analog power supplies for ADC, reset blocks, RCs and PLL (minimum voltage to be applied to V is 1.8 V when the ADC is used).
  • Page 16: Boot Modes

    Functional overview STM32L151xx, STM32L152xx 3.3.4 Boot modes At startup, boot pins are used to select one of three boot options: ● Boot from Flash memory ● Boot from System Memory ● Boot from embedded RAM The boot loader is located in System Memory. It is used to reprogram the Flash memory by using USART1 or USART2.
  • Page 17: Figure 2. Clock Tree

    STM32L151xx, STM32L152xx Functional overview ● Clock security system (CSS): this feature can be enabled by software. If a HSE clock failure occurs, the master clock is automatically switched to HSI and a software interrupt is generated if enabled. ● Clock-out capability (MCO: microcontroller clock output): it outputs one of the internal clocks for external use by the application.
  • Page 18: Low Power Real-Time Clock And Backup Registers

    Functional overview STM32L151xx, STM32L152xx Low power real-time clock and backup registers The real-time clock (RTC) is an independent BCD timer/counter. Dedicated registers contain the second, minute, hour (12/24 hour), week day, date, month, year, in BCD (binary-coded decimal) format. Correction for 28, 29 (leap year), 30, and 31 day of the month are made automatically.
  • Page 19: Memories

    STM32L151xx, STM32L152xx Functional overview Memories The STM32L15xxx devices have the following features: ● Up to 16 Kbyte of embedded RAM accessed (read/write) at CPU clock speed with 0 wait states. With the enhanced bus matrix, operating the RAM does not lead to any performance penalty during accesses to the system bus (AHB and APB buses).
  • Page 20: Adc (Analog-To-Digital Converter)

    Functional overview STM32L151xx, STM32L152xx 3.10 ADC (analog-to-digital converter) A 12-bit analog-to-digital converters is embedded into STM32L15xxx devices with up to 24 external channels, performing conversions in single-shot or scan mode. In scan mode, automatic conversion is performed on a selected group of analog inputs. The ADC can be served by the DMA controller.
  • Page 21: Ultralow Power Comparators And Reference Voltage

    STM32L151xx, STM32L152xx Functional overview 3.12 Ultralow power comparators and reference voltage The STM32L15xxx embeds two comparators sharing the same current bias and reference voltage. The reference voltage can be internal or external (coming from an I/O). ● one comparator with fixed threshold ●...
  • Page 22: General-Purpose Timers (Tim2, Tim3, Tim4, Tim9, Tim10 And Tim11)

    Functional overview STM32L151xx, STM32L152xx 3.14.1 General-purpose timers (TIM2, TIM3, TIM4, TIM9, TIM10 and TIM11) There are six synchronizable general-purpose timers embedded in the STM32L15xxx devices (see Table 3 for differences). TIM2, TIM3, TIM4 These timers are based on a 16-bit auto-reload up/downcounter and a 16-bit prescaler. They feature 4 independent channels each for input capture/output compare, PWM or one- pulse mode output.
  • Page 23: Window Watchdog (Wwdg)

    STM32L151xx, STM32L152xx Functional overview 3.14.5 Window watchdog (WWDG) The window watchdog is based on a 7-bit downcounter that can be set as free-running. It can be used as a watchdog to reset the device when a problem occurs. It is clocked from the main clock.
  • Page 24: Crc (Cyclic Redundancy Check) Calculation Unit

    Functional overview STM32L151xx, STM32L152xx 3.16 CRC (cyclic redundancy check) calculation unit The CRC (cyclic redundancy check) calculation unit is used to get a CRC code from a 32-bit data word and a fixed generator polynomial. Among other applications, CRC-based techniques are used to verify data transmission or storage integrity.
  • Page 25: Pin Descriptions

    STM32L151xx, STM32L152xx Pin descriptions Pin descriptions Figure 3. STM32L15xxx UFBGA100 ballout BOOT0 PA12 PA15 PA13 PA14 PA11 PC12 PC10 VDD_3 PA10 PC13 PC11 RTC_AF1 WKUP2 VSS_3 PC14 WUKP3 OSC32_IN VSS_4 PC15 VLCD OSC32_OUT VSS_2 VSS_1 VSS_5 OSC_IN VDD_2 VDD_1 VDD_5 OSC_OUT PD14 PD13...
  • Page 26: Figure 4. Stm32L15Xxx Tfbga64 Ballout

    Pin descriptions STM32L151xx, STM32L152xx Figure 4. STM32L15xxx TFBGA64 ballout PC14- PC13- PA15 PA14 PA13 OSC32_IN RTC_AF1 WKUP2 PC15- VLCD BOOT0 PC11 PC10 PA12 OSC32_OUT PH0- OSC_IN V SS_4 PC12 PA10 PA11 PH1- OSC_OUT V DD_4 V SS_3 V SS_2 V SS_1 NRST V DD_3 V DD_2...
  • Page 27: Figure 5. Stm32L15Xxx Lqfp100 Pinout

    STM32L151xx, STM32L152xx Pin descriptions Figure 5. STM32L15xxx LQFP100 pinout VDD_2 VSS_2 PA 13 PE6-WKUP3 PA 12 PA 11 PC13-RTC_AF1-WKUP2 PA 10 PC14-OSC32_IN PA 9 PC15-OSC32_OUT PA 8 VSS_5 VDD_5 PH0-OSC_IN LQFP100 PH1-OSC_OUT NRST PD15 PD14 PD13 PD12 PD11 VSSA PD10 VREF- VREF+ VDDA...
  • Page 28: Figure 6. Stm32L15Xxx Lqfp64 Pinout

    Pin descriptions STM32L151xx, STM32L152xx Figure 6. STM32L15xxx LQFP64 pinout 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 VDD_2 PC13-RTC_AF1-WKUP2 VSS_2 PC14-OSC32_IN PA13 PC15-OSC32_OUT PA12 PH0 -OSC_IN PA11 PH1- OSC_OUT PA10 NRST LQFP64 VSSA PB15 VDDA...
  • Page 29: Figure 8. Stm32L15Xxx Ufqfpn48 Pinout

    STM32L151xx, STM32L152xx Pin descriptions Figure 8. STM32L15xxx UFQFPN48 pinout Doc ID 17659 Rev 6 29/109...
  • Page 30: Table 4. Stm32L15Xxx Pin Definitions

    Pin descriptions STM32L151xx, STM32L152xx Table 4. STM32L15xxx pin definitions Pins Main Pin name function Alternate functions (after reset) I/O FT TRACECK/LCD_SEG38/TIM3_ETR I/O FT TRACED0/LCD_SEG39/TIM3_CH1 I/O FT TRACED1/TIM3_CH2 I/O FT TRACED2/TIM9_CH1 I/O FT TRACED3/WKUP3/TIM9_CH2 6 1 B2 E2 PC13- 7 2 A2 C1 I/O FT PC13 RTC_AF1/WKUP2...
  • Page 31 STM32L151xx, STM32L152xx Pin descriptions Table 4. STM32L15xxx pin definitions (continued) Pins Main Pin name function Alternate functions (after reset) USART2_RTS/ADC_IN1/ TIM2_CH2/LCD_SEG0/ 24 15 H2 M2 11 I/O FT COMP1_INP USART2_TX/ADC_IN2/ TIM2_CH3/TIM9_CH1/ 25 16 F3 K3 I/O FT LCD_SEG1/COMP1_INP USART2_RX/ADC_IN3/TIM2_CH4/TIM9_CH2/ 26 17 G3 L3 LCD_SEG2/COMP1_INP 27 18 C2 E3 SS_4...
  • Page 32 Pin descriptions STM32L151xx, STM32L152xx Table 4. STM32L15xxx pin definitions (continued) Pins Main Pin name function Alternate functions (after reset) 47 29 G7 L10 21 PB10 I/O FT PB10 I2C2_SCL/USART3_TX/TIM2_CH3/LCD_SEG10 48 30 H7 L11 22 PB11 I/O FT PB11 I2C2_SDA/ USART3_RX/TIM2_CH4/LCD_SEG11 49 31 D6 F12 23 SS_1 SS_1...
  • Page 33 STM32L151xx, STM32L152xx Pin descriptions Table 4. STM32L15xxx pin definitions (continued) Pins Main Pin name function Alternate functions (after reset) 73 - - C11 I/O FT I2C2_SMBA 74 47 D5 F11 35 SS_2 SS_2 75 48 E5 G11 36 DD_2 DD_2 76 49 A7 A10 37 PA14 I/O FT JTCK/SWCLK...
  • Page 34 Pin descriptions STM32L151xx, STM32L152xx Table 4. STM32L15xxx pin definitions (continued) Pins Main Pin name function Alternate functions (after reset) 98 - I/O FT LCD_SEG37/TIM11_CH1 99 63 D4 D3 SS_3 SS_3 64 E4 C4 DD_3 DD_3 1. I = input, O = output, S = supply. 2.
  • Page 35: Table 5. Alternate Function Input/Output

    Table 5. Alternate function input/output Digital alternate function number AFIO0 AFIO1 AFIO2 AFIO3 AFIO4 AFIO5 AFOI6 AFIO7 AFIO8 AFIO9 AFIO10 AFIO11 AFIO12 AFIO13 AFIO14 AFIO15 Port name Alternate function USART SYSTEM TIM2 TIM3/4 TIM9/10/11 I2C1/2 SPI1/2 USBFS SYSTEM 1/2/3 BOOT0 BOOT0 NRST NRST...
  • Page 36 Table 5. Alternate function input/output (continued) Digital alternate function number AFIO0 AFIO1 AFIO2 AFIO3 AFIO4 AFIO5 AFOI6 AFIO7 AFIO8 AFIO9 AFIO10 AFIO11 AFIO12 AFIO13 AFIO14 AFIO15 Port name Alternate function USART SYSTEM TIM2 TIM3/4 TIM9/10/11 I2C1/2 SPI1/2 USBFS SYSTEM 1/2/3 TIM2_CH1_ PA15 JTDI...
  • Page 37 Table 5. Alternate function input/output (continued) Digital alternate function number AFIO0 AFIO1 AFIO2 AFIO3 AFIO4 AFIO5 AFOI6 AFIO7 AFIO8 AFIO9 AFIO10 AFIO11 AFIO12 AFIO13 AFIO14 AFIO15 Port name Alternate function USART SYSTEM TIM2 TIM3/4 TIM9/10/11 I2C1/2 SPI1/2 USBFS SYSTEM 1/2/3 SEG19 TIMx_IC2 EVENTOUT SEG20...
  • Page 38 Table 5. Alternate function input/output (continued) Digital alternate function number AFIO0 AFIO1 AFIO2 AFIO3 AFIO4 AFIO5 AFOI6 AFIO7 AFIO8 AFIO9 AFIO10 AFIO11 AFIO12 AFIO13 AFIO14 AFIO15 Port name Alternate function USART SYSTEM TIM2 TIM3/4 TIM9/10/11 I2C1/2 SPI1/2 USBFS SYSTEM 1/2/3 COM7 / TIM3_ETR SEG31 /...
  • Page 39 Table 5. Alternate function input/output (continued) Digital alternate function number AFIO0 AFIO1 AFIO2 AFIO3 AFIO4 AFIO5 AFOI6 AFIO7 AFIO8 AFIO9 AFIO10 AFIO11 AFIO12 AFIO13 AFIO14 AFIO15 Port name Alternate function USART SYSTEM TIM2 TIM3/4 TIM9/10/11 I2C1/2 SPI1/2 USBFS SYSTEM 1/2/3 TRACED1 TIM3_CH2 TIMx_IC1 EVENTOUT...
  • Page 40: Memory Mapping

    Memory mapping STM32L151xx, STM32L152xx Memory mapping The memory map is shown in the following figure.Figure 9.Memory map APB memory space 0xFFFF FFFF reserved 0xE010 0000 reserved 0x6000 0000 reserved 0x4002 6400 0x4002 6000 reserved 0xFFFF FFFF 0x4002 4000 Flash Interface 0x4002 3C00 0x4002 3800 reserved...
  • Page 41: Electrical Characteristics

    STM32L151xx, STM32L152xx Electrical characteristics Electrical characteristics Parameter conditions Unless otherwise specified, all voltages are referenced to V 6.1.1 Minimum and maximum values Unless otherwise specified the minimum and maximum values are guaranteed in the worst conditions of ambient temperature, supply voltage and frequencies by tests in production on 100% of the devices with an ambient temperature at T = 25 °C and T max (given by...
  • Page 42: Power Supply Scheme

    Electrical characteristics STM32L151xx, STM32L152xx 6.1.6 Power supply scheme Figure 12. Power supply scheme Standby-power circuitry (OSC32K,RTC, Wake-up logic RTC backup registers) GP I/Os Logic Kernel logic (CPU, Digital V DD & Memories) V DD1/2/.../5 Regulator 11 × 100 nF + 1 × 4.7 µF V SS1/2/.../5 V DD V DDA...
  • Page 43: Absolute Maximum Ratings

    STM32L151xx, STM32L152xx Electrical characteristics Absolute maximum ratings Stresses above the absolute maximum ratings listed in Table 6: Voltage characteristics, Table 7: Current characteristics, and Table 8: Thermal characteristics may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these conditions is not implied.
  • Page 44: Operating Conditions

    Electrical characteristics STM32L151xx, STM32L152xx Table 8. Thermal characteristics Symbol Ratings Value Unit Storage temperature range –65 to +150 °C Maximum junction temperature °C Operating conditions 6.3.1 General operating conditions Table 9. General operating conditions Symbol Parameter Conditions Unit Internal AHB clock frequency HCLK Internal APB1 clock frequency PCLK1...
  • Page 45: Table 10. Functionalities Depending On The Operating Power Supply Range

    STM32L151xx, STM32L152xx Electrical characteristics Table 10. Functionalities depending on the operating power supply range Functionalities depending on the operating power supply range Maximum Operating power DAC and ADC I/O operation CORE supply range operation frequency max) 16 MHz (1ws) Range 2 or - Degraded speed = 1.65 to 1.8 V Not functional...
  • Page 46: Embedded Reset And Power Control Block Characteristics

    Electrical characteristics STM32L151xx, STM32L152xx 6.3.2 Embedded reset and power control block characteristics The parameters given in the following table are derived from the tests performed under the ambient temperature condition summarized in Table Table 11. Embedded reset and power control block characteristics Symbol Parameter Conditions...
  • Page 47 STM32L151xx, STM32L152xx Electrical characteristics Table 11. Embedded reset and power control block characteristics (continued) Symbol Parameter Conditions Unit Falling edge 2.97 3.05 3.09 PVD threshold 6 PVD6 Rising edge 3.08 3.15 3.20 BOR0 threshold Hysteresis voltage All BOR and PVD thresholds hyst excepting BOR0 1.
  • Page 48: Embedded Internal Reference Voltage

    Electrical characteristics STM32L151xx, STM32L152xx 6.3.3 Embedded internal reference voltage The parameters given in Table 12 are based on characterization results, unless otherwise specified. Table 12. Embedded internal reference voltage Symbol Parameter Conditions Unit Internal reference voltage – 40 °C < T <...
  • Page 49: Supply Current Characteristics

    STM32L151xx, STM32L152xx Electrical characteristics 6.3.4 Supply current characteristics The current consumption is a function of several parameters and factors such as the operating voltage, ambient temperature, I/O pin loading, device software configuration, operating frequencies, I/O pin switching rate, program location in memory and executed binary code.
  • Page 50: Table 14. Current Consumption In Run Mode, Code With Data Processing Running From Ram

    Electrical characteristics STM32L151xx, STM32L152xx Table 14. Current consumption in Run mode, code with data processing running from RAM Symbol Parameter Conditions Unit HCLK 55 °C 85 °C 105 °C 1 MHz Range 3, =1.2 V 2 MHz µA CORE VOS[1:0] = 11 4 MHz HCLK up to 8 MHz,...
  • Page 51: Table 15. Current Consumption In Sleep Mode

    STM32L151xx, STM32L152xx Electrical characteristics Table 15. Current consumption in Sleep mode Symbol Parameter Conditions Unit HCLK 55 °C 85 °C 105 °C 1 MHz Range 3, =1.2 V 2 MHz CORE VOS[1:0] = 11 4 MHz 4 MHz HSE = 16 MHz Range 2, (PLL ON for f =1.5 V...
  • Page 52 Electrical characteristics STM32L151xx, STM32L152xx 1. Based on characterization, not tested in production, unless otherwise specified. 2. Oscillator bypassed (HSEBYP = 1 in RCC_CR register) 3. Tested in production Table 16. Current consumption in Low power run mode Symbol Parameter Conditions Unit = -40 °C to 25 °C MSI clock, 65 kHz...
  • Page 53 STM32L151xx, STM32L152xx Electrical characteristics Table 17. Current consumption in Low power sleep mode Symbol Parameter Conditions Unit MSI clock, 65 kHz = 32 kHz = -40 °C to 25 °C HCLK Flash OFF = -40 °C to 25 °C 17.5 MSI clock, 65 kHz = 32 kHz = 85 °C...
  • Page 54 Electrical characteristics STM32L151xx, STM32L152xx Table 18. Typical and maximum current consumptions in Stop mode Symbol Parameter Conditions Typ Max Unit = -40°C to 25°C = 55°C LCD OFF = 85°C = 105°C = -40°C to 25°C RTC clocked by LSI, regulator in LP mode, LCD ON = 55°C...
  • Page 55 STM32L151xx, STM32L152xx Electrical characteristics Table 18. Typical and maximum current consumptions in Stop mode Symbol Parameter Conditions Typ Max Unit RMS (root mean MSI = 4.2 MHz square) supply MSI = 1.05 MHz 1.45 current during = 3.0 V DD (WU wakeup time = -40°C to 25°C from Stop)
  • Page 56 Electrical characteristics STM32L151xx, STM32L152xx Wakeup time from Low power mode The wakeup times given in the following table are measured with the MSI RC oscillator. The clock source used to wake up the device depends on the current operating mode: ●...
  • Page 57: Table 21. Peripheral Current Consumption

    STM32L151xx, STM32L152xx Electrical characteristics On-chip peripheral current consumption The current consumption of the on-chip peripherals is given in the following table. The MCU is placed under the following conditions: ● all I/O pins are in input mode with a static value at V or V (no load) ●...
  • Page 58 Electrical characteristics STM32L151xx, STM32L152xx Table 21. Peripheral current consumption (continued) Typical consumption, V = 3.0 V, T = 25 °C Range 1, Range 2, Range 3, Low power Peripheral Unit CORE CORE CORE 1.8 V 1.5 V 1.2 V sleep and VOS[1:0] = VOS[1:0] = VOS[1:0] =...
  • Page 59: External Clock Source Characteristics

    STM32L151xx, STM32L152xx Electrical characteristics 4. Data based on a differential I measurement between DAC in reset configuration and continuous DAC conversion of V /2. DAC is in buffered mode, output is left floating. 5. Including supply current of internal reference voltage. 6.3.5 External clock source characteristics High-speed external user clock generated from an external source...
  • Page 60: Figure 14. Low-Speed External Clock Source Ac Timing Diagram

    Electrical characteristics STM32L151xx, STM32L152xx Low-speed external user clock generated from an external source The characteristics given in the following table result from tests performed using a low- speed external clock source, and under ambient temperature and supply voltage conditions summarized in Table Table 23.
  • Page 61: Figure 15. High-Speed External Clock Source Ac Timing Diagram

    STM32L151xx, STM32L152xx Electrical characteristics Figure 15. High-speed external clock source AC timing diagram High-speed external clock generated from a crystal/ceramic resonator The high-speed external (HSE) clock can be supplied with a 1 to 24 MHz crystal/ceramic resonator oscillator. All the information given in this paragraph are based on characterization results obtained with typical external components specified in Table 24.
  • Page 62: Table 24. Hse 1-24 Mhz Oscillator Characteristics

    Electrical characteristics STM32L151xx, STM32L152xx (1)(2) Table 24. HSE 1-24 MHz oscillator characteristics Symbol Parameter Conditions Min Typ Unit Oscillator frequency OSC_IN Feedback resistor kΩ Recommended load capacitance versus = 30 Ω equivalent serial resistance of the crystal (R = 3.3 V, V HSE driving current with 30 pF load C = 20 pF...
  • Page 63: Table 25. Lse Oscillator Characteristics (F Lse = 32.768 Khz)

    STM32L151xx, STM32L152xx Electrical characteristics Figure 16. HSE oscillator circuit diagram 1. R value depends on the crystal characteristics. Low-speed external clock generated from a crystal/ceramic resonator The low-speed external (LSE) clock can be supplied with a 32.768 kHz crystal/ceramic resonator oscillator. All the information given in this paragraph are based on characterization results obtained with typical external components specified in Table 25.
  • Page 64: Figure 17. Typical Application With A 32.768 Khz Crystal

    Electrical characteristics STM32L151xx, STM32L152xx Note: For C and C , it is recommended to use high-quality ceramic capacitors in the 5 pF to 15 pF range selected to match the requirements of the crystal or resonator (see Figure 17). and C are usually the same size.
  • Page 65: Internal Clock Source Characteristics

    STM32L151xx, STM32L152xx Electrical characteristics 6.3.6 Internal clock source characteristics The parameters given in Table 26 are derived from tests performed under ambient temperature and V supply voltage conditions summarized in Table High-speed internal (HSI) RC oscillator Table 26. HSI oscillator characteristics Symbol Parameter Conditions...
  • Page 66: Table 28. Msi Oscillator Characteristics

    Electrical characteristics STM32L151xx, STM32L152xx Multi-speed internal (MSI) RC oscillator Table 28. MSI oscillator characteristics Symbol Parameter Condition Unit MSI range 0 65.5 MSI range 1 MSI range 2 Frequency after factory calibration, done at MSI range 3 = 3.3 V and T = 25 °C MSI range 4 1.05...
  • Page 67: Pll Characteristics

    STM32L151xx, STM32L152xx Electrical characteristics Table 28. MSI oscillator characteristics (continued) Symbol Parameter Condition Unit MSI range 0 MSI range 1 MSI range 2 MSI range 3 MSI range 4 MSI oscillator stabilization time µs STAB(MSI) MSI range 5 MSI range 6, Voltage range 1 and 2 MSI range 3,...
  • Page 68: Memory Characteristics

    Electrical characteristics STM32L151xx, STM32L152xx 6.3.8 Memory characteristics The characteristics are given at T = -40 to 105 °C unless otherwise specified. RAM memory Table 30. RAM and hardware registers Symbol Parameter Conditions Unit Data retention mode STOP mode (or RESET) 1.65 1.
  • Page 69: Emc Characteristics

    STM32L151xx, STM32L152xx Electrical characteristics Table 32. Flash memory endurance and data retention Value Symbol Parameter Conditions Unit Typ Max Cycling (erase / write ) Program memory = -40°C to kcycles 105 °C Cycling (erase / write ) EEPROM data memory Data retention (program memory) after 10 kcycles at T = 85 °C...
  • Page 70 Electrical characteristics STM32L151xx, STM32L152xx Designing hardened software to avoid noise problems EMC characterization and optimization are performed at component level with a typical application environment and simplified MCU software. It should be noted that good EMC performance is highly dependent on the user application and the software in particular. Therefore it is recommended that the user applies EMC software optimization and prequalification tests in relation with the EMC level requested for his application.
  • Page 71: Absolute Maximum Ratings (Electrical Sensitivity)

    STM32L151xx, STM32L152xx Electrical characteristics 6.3.10 Absolute maximum ratings (electrical sensitivity) Based on three different tests (ESD, LU) using specific measurement methods, the device is stressed in order to determine its performance in terms of electrical sensitivity. Electrostatic discharge (ESD) Electrostatic discharges (a positive then a negative pulse separated by 1 second) are applied to the pins of each sample according to each pin combination.
  • Page 72 Electrical characteristics STM32L151xx, STM32L152xx Functional susceptibility to I/O current injection While a simple application is executed on the device, the device is stressed by injecting current into the I/O pins programmed in floating input mode. While current is injected into the I/O pin, one at a time, the device is checked for functional failures.
  • Page 73: I/O Port Characteristics

    STM32L151xx, STM32L152xx Electrical characteristics 6.3.12 I/O port characteristics General input/output characteristics Unless otherwise specified, the parameters given in Table 38 are derived from tests performed under conditions summarized in Table 9. All I/Os are CMOS and TTL compliant. Table 38. I/O static characteristics Symbol Parameter...
  • Page 74 Electrical characteristics STM32L151xx, STM32L152xx 9. Pull-up and pull-down resistors are designed with a true resistance in series with a switchable PMOS/NMOS. This MOS/NMOS contribution to the series resistance is minimum (~10% order) Output driving current The GPIOs (general purpose input/outputs) can sink or source up to ±8 mA, and sink or source up to ±20 mA (with the non-standard V specifications given in Table...
  • Page 75: Table 40. I/O Ac Characteristics

    STM32L151xx, STM32L152xx Electrical characteristics Input/output AC characteristics The definition and values of input/output AC characteristics are given in Figure 18 Table 40, respectively. Unless otherwise specified, the parameters given in Table 40 are derived from tests performed under ambient temperature and V supply voltage conditions summarized in Table Table 40.
  • Page 76: Nrst Pin Characteristics

    Electrical characteristics STM32L151xx, STM32L152xx Figure 18. I/O AC characteristics definition 6.3.13 NRST pin characteristics The NRST pin input driver uses CMOS technology. Unless otherwise specified, the parameters given in Table 41 are derived from tests performed under ambient temperature and V supply voltage conditions summarized in Table Table 41.
  • Page 77: Tim Timer Characteristics

    STM32L151xx, STM32L152xx Electrical characteristics Figure 19. Recommended NRST pin protection 1. The reset network protects the device against parasitic resets. 2. The user must ensure that the level on the NRST pin can go below the V max level specified in IL(NRST) Table 41.
  • Page 78: Communications Interfaces

    Electrical characteristics STM32L151xx, STM32L152xx 6.3.15 Communications interfaces C interface characteristics Unless otherwise specified, the parameters given in Table 43 are derived from tests performed under ambient temperature, f frequency and V supply voltage conditions PCLK1 summarized in Table The line I C interface meets the requirements of the standard I C communication protocol with the following restrictions: SDA and SCL are not “true”...
  • Page 79: Table 44. Scl Frequency

    STM32L151xx, STM32L152xx Electrical characteristics Figure 20. I C bus AC waveforms and measurement circuit 1. Measurement points are done at CMOS levels: 0.3V and 0.7V (1)(2) Table 44. SCL frequency (f = 32 MHz, V = 3.3 V) PCLK1 I2C_CCR value (kHz) = 4.7 kΩ...
  • Page 80: Table 45. Spi Characteristics

    Electrical characteristics STM32L151xx, STM32L152xx SPI characteristics Unless otherwise specified, the parameters given in the following table are derived from tests performed under ambient temperature, f frequency and V supply voltage PCLKx conditions summarized in Table Refer to Section 6.3.11: I/O current injection characteristics for more details on the input/output alternate function characteristics (NSS, SCK, MOSI, MISO).
  • Page 81: Figure 21. Spi Timing Diagram - Slave Mode And Cpha = 0

    STM32L151xx, STM32L152xx Electrical characteristics Figure 21. SPI timing diagram - slave mode and CPHA = 0 NSS input t c(SCK) t h(NSS) t SU(NSS) CPHA= 0 CPOL=0 t w(SCKH) CPHA= 0 t w(SCKL) CPOL=1 t r(SCK) t v(SO) t a(SO) t h(SO) t dis(SO) t f(SCK)
  • Page 82: Table 46. Usb Startup Time

    Electrical characteristics STM32L151xx, STM32L152xx Figure 23. SPI timing diagram - master mode High NSS input t c(SCK) CPHA= 0 CPOL=0 CPHA= 0 CPOL=1 CPHA=1 CPOL=0 CPHA=1 CPOL=1 t w(SCKH) t r(SCK) t su(MI) t w(SCKL) t f(SCK) MISO MS BIN BI T6 IN LSB IN INP UT...
  • Page 83: Figure 24. Usb Timings: Definition Of Data Signal Rise And Fall Time

    STM32L151xx, STM32L152xx Electrical characteristics Table 47. USB DC electrical characteristics Symbol Parameter Conditions Min. Max. Unit Input levels USB operating voltage Differential input sensitivity I(USBDP, USBDM) Differential common mode range Includes V range Single ended receiver threshold Output levels Static output level low of 1.5 kΩ...
  • Page 84: 12-Bit Adc Characteristics

    Electrical characteristics STM32L151xx, STM32L152xx 6.3.16 12-bit ADC characteristics Unless otherwise specified, the parameters given in Table 50 are guaranteed by design. Table 49. ADC clock frequency Symbol Parameter Conditions Unit REF+ = < V REF+ 2.4 V ≤ V ≤ 3.6 V >...
  • Page 85 STM32L151xx, STM32L152xx Electrical characteristics Table 50. ADC characteristics (continued) Symbol Parameter Conditions Unit Direct channels 0.25 2.4 V ≤ V ≤ 3.6 V Multiplexed channels 0.56 2.4 V ≤ V ≤ 3.6 V µs Sampling time Direct channels 0.56 1.8 V ≤ V ≤...
  • Page 86 Electrical characteristics STM32L151xx, STM32L152xx (1)(2) Table 51. ADC accuracy Symbol Parameter Test conditions Unit Total unadjusted error 2.4 V ≤ V ≤ 3.6 V Offset error 2.4 V ≤ V ≤ 3.6 V REF+ Gain error = 50 Ω = 8 MHz, R Differential linearity error = -40 to 105 °...
  • Page 87: Figure 25. Adc Accuracy Characteristics

    STM32L151xx, STM32L152xx Electrical characteristics Figure 25. ADC accuracy characteristics REF+ [1LSB depending on package)] IDEAL 4096 4096 (1) Example of an actual transfer curve 4095 (2) The ideal transfer curve 4094 (3) End point correlation line 4093 =Total Unadjusted Error: maximum deviation between the actual and the ideal transfer curves.
  • Page 88: Table 52. Rain Max For F Adc = 16 Mhz

    Electrical characteristics STM32L151xx, STM32L152xx Figure 27. Maximum dynamic current consumption on V supply pin during ADC REF+ conversion Sampling (n cycles) Conversion (12 cycles) ADC clock ref+ 700µA 300µA Table 52. max for f = 16 MHz max (kohm) Multiplexed channels Direct channels (cycles) (µs)
  • Page 89: Figure 28. Power Supply And Reference Decoupling

    STM32L151xx, STM32L152xx Electrical characteristics Figure 28. Power supply and reference decoupling (V not connected to REF+ 1. V and V inputs are available only on 100-pin packages. REF+ REF– Figure 29. Power supply and reference decoupling (V connected to REF+ 1.
  • Page 90: Dac Electrical Specifications

    Electrical characteristics STM32L151xx, STM32L152xx 6.3.17 DAC electrical specifications Data guaranteed by design, not tested in production, unless otherwise specified. Table 53. DAC characteristics Symbol Parameter Conditions Unit Analog supply voltage must always be below REF+ Reference supply voltage REF+ Lower reference voltage REF- Current consumption on No load, middle code (0x800)
  • Page 91 STM32L151xx, STM32L152xx Electrical characteristics Table 53. DAC characteristics (continued) Symbol Parameter Conditions Unit = 3.3V = 3.0V REF+ = 0 to 50 ° C DAC output buffer OFF Offset error temperature dOffset/dT µV/°C coefficient (code 0x800) = 3.3V = 3.0V REF+ = 0 to 50 °...
  • Page 92: Temperature Sensor Characteristics

    Electrical characteristics STM32L151xx, STM32L152xx 4. Difference between measured value at Code i and the value at Code i on a line drawn between Code 0 and last Code 4095. 5. Difference between the value measured at Code (0x800) and the ideal value = V REF+ 6.
  • Page 93: Comparator

    STM32L151xx, STM32L152xx Electrical characteristics 6.3.19 Comparator Table 55. Comparator 1 characteristics Symbol Parameter Conditions Unit Analog supply voltage 1.65 value 400K 400K kΩ value Comparator 1 input voltage range Comparator startup time START µs Propagation delay ±3 ±10 Voffset Comparator offset = 3.6 V Comparator offset = 0 V...
  • Page 94 Electrical characteristics STM32L151xx, STM32L152xx Table 56. Comparator 2 characteristics Symbol Parameter Conditions Min Typ Max Unit Analog supply voltage 1.65 Comparator 2 input voltage range Fast mode Comparator startup time START Slow mode 1.65 V ≤ V ≤ 2.7 V Propagation delay in slow mode µs...
  • Page 95: Lcd Controller (Stm32L152Xx Only)

    STM32L151xx, STM32L152xx Electrical characteristics 6.3.20 LCD controller (STM32L152xx only) The STM32L152xx embeds a built-in step-up converter to provide a constant LCD reference voltage independently from the V voltage. An external capacitor C must be connected to the V pin to decouple this converter. Table 57.
  • Page 96: Package Characteristics

    Package characteristics STM32L151xx, STM32L152xx Package characteristics Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ® ® ECOPACK packages, depending on their level of environmental compliance. ECOPACK specification s, grade definitions and product status are available at: www.st.com. ®...
  • Page 97: Figure 31. Ufqfpn48 7 X 7 Mm, 0.5 Mm Pitch, Package Outline

    STM32L151xx, STM32L152xx Package characteristics Figure 31. UFQFPN48 7 x 7 mm, 0.5 mm pitch, package Figure 32. Recommended footprint (1)(2)(3) outline (dimensions in mm) 7.30 6.20 0.20 7.30 6.20 5.60 5.80 5.60 0.30 0.75 0.50 5.80 0.55 ai15697 1. Drawing is not to scale. 2.
  • Page 98: Figure 33. Tfbga64 - 8 X 8 Active Ball Array, 5 X 5 Mm, 0.5 Mm Pitch, Package Outline

    Package characteristics STM32L151xx, STM32L152xx Figure 33. TFBGA64 - 8 x 8 active ball array, 5 x 5 mm, 0.5 mm pitch, package outline A1 ball pad corner Øb (64 balls) Seating Bottom view plane ME_R8 1. Drawing is not to scale. Table 59.
  • Page 99: Figure 34. Recommended Pcb Design Rules For Pads (0.5 Mm Pitch Bga)

    STM32L151xx, STM32L152xx Package characteristics Figure 34. Recommended PCB design rules for pads (0.5 mm pitch BGA) Pitch 0.5 mm D pad 0.27 mm 0.35 mm typ (depends on the soldermask registration tolerance) Solder paste 0.27 mm aperture diameter Dpad ai15495 1.
  • Page 100: Table 60. Ufbga100 - Ultra Fine Pitch Ball Grid Array, 7 X 7 Mm, 0.50 Mm Pitch, Package

    Package characteristics STM32L151xx, STM32L152xx Figure 35. UFBGA100 - ultra fine pitch ball grid array, 7 x 7 mm, 0.50 mm pitch, package outline 0.10 A1 ball A1 ball 0.50 pad corner pad corner 1.75 1.75 0.10 Top view Side view Bottom view A0C2_ME 1.
  • Page 101: Table 61. Lqpf100, 14 X 14 Mm, 100-Pin Low-Profile Quad Flat Package Mechanical Data

    STM32L151xx, STM32L152xx Package characteristics (1)(2) Figure 36. LQFP100, 14 x 14 mm, 100-pin low-profile Figure 37. Recommended footprint quad flat package outline 0.25 mm 0.10 inch GAGE PLANE 16.7 14.3 E3 E1 E 12.3 Pin 1 identification 16.7 ai14906 SEATING PLANE 1L_ME 1.
  • Page 102: Table 62. Lqfp64, 10 X 10 Mm, 64-Pin Low-Profile Quad Flat Package Mechanical Data

    Package characteristics STM32L151xx, STM32L152xx Figure 38. LQFP64, 10 x 10 mm, 64-pin low-profile quad Figure 39. Recommended (1)(2) flat package outline footprint 12.7 10.3 10.3 12.7 ai14909 ai14398b 1. Drawing is not to scale. 2. Dimensions are in millimeters. Table 62. LQFP64, 10 x 10 mm, 64-pin low-profile quad flat package mechanical data millimeters inches...
  • Page 103: Table 63. Lqfp48, 7 X 7 Mm, 48-Pin Low-Profile Quad Flat Package Mechanical Data

    STM32L151xx, STM32L152xx Package characteristics Figure 40. LQFP48, 7 x 7 mm, 48-pin low-profile quad flat Figure 41. Recommended (1)(2) package outline footprint Seating plane 0.50 0.25 mm 1.20 Gage plane 0.30 0.20 7.30 5.80 9.70 7.30 1.20 5.80 E3 E1 9.70 ai14911b Pin 1...
  • Page 104: Thermal Characteristics

    Package characteristics STM32L151xx, STM32L152xx Thermal characteristics The maximum chip-junction temperature, T max, in degrees Celsius, may be calculated using the following equation: max × Θ max = T max + (P Where: max is the maximum ambient temperature in ° C, ●...
  • Page 105: Ordering Information Scheme

    STM32L151xx, STM32L152xx Ordering information scheme Ordering information scheme Table 65. Ordering information scheme Example: STM32 L 151 C 8 D xxx Device family STM32 = ARM-based 32-bit microcontroller Product type L = Low power Device subfamily 151: Devices without LCD 152: Devices with LCD Pin count C = 48 pins...
  • Page 106: Revision History

    Revision history STM32L151xx, STM32L152xx Revision history Table 66. Document revision history Date Revision Changes 02-Jul-2010 Initial release. Removed 5 V tolerance (FT) from PA3, PB0 and PC3 in Table 4: STM32L15xxx pin definitions on page 30 Updated Table 11: Embedded reset and power control block characteristics on page 46 01-Oct-2010 Updated...
  • Page 107: Table 19. Typical And Maximum Current Consumptions In Standby Mode

    STM32L151xx, STM32L152xx Revision history Table 66. Document revision history (continued) Date Revision Changes Updated Table 19: Typical and maximum current consumptions in Standby mode on page 55 (WU from Standby) instead of (I from Stop). Table 20: Typical and maximum timings in Low power modes on page 56: updated condition for Wakeup from Stop mode, regulator in Run mode;...
  • Page 108: Table 16. Current Consumption In Low Power Run Mode

    Revision history STM32L151xx, STM32L152xx Table 66. Document revision history (continued) Date Revision Changes Modified 1st page (low power features) Added STM32L15xC6 and STM32L15xR6 devices (32 Kbytes of Flash memory). Modified Section 3.6: GPIOs (general-purpose inputs/outputs) on 17-June-2011 page 18 Modified Section 6.3: Operating conditions on page 44 Modified Table 51: ADC accuracy on page...
  • Page 109 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice.

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