Table 69. Ufbga100, 7 X 7 Mm, 0.50 Mm Pitch, Recommended Pcb Design Rules; Figure 36. Ufbga100, 7 X 7 Mm, 0.5 Mm Pitch, Package Recommended Footprint - STMicroelectronics STM32L162RC Manual

Package information
Table 68. UFBGA100, 7 x 7 mm, 0.5 mm pitch package mechanical data (continued)
Symbol
eee
fff
1. Values in inches are converted from mm and rounded to 4 decimal digits.

Figure 36. UFBGA100, 7 x 7 mm, 0.5 mm pitch, package recommended footprint

Table 69. UFBGA100, 7 x 7 mm, 0.50 mm pitch, recommended PCB design rules

Pitch
Dpad
Dsm
Stencil opening
Stencil thickness
112/123
millimeters
Min Typ
- -
- -
Dimension
DocID022881 Rev 10
STM32L162VC, STM32L162RC
Max Min
0.150 -
0.050 -
Recommended values
0.5
0.280 mm
0.370 mm typ. (depends on the soldermask
registration tolerance)
0.280 mm
Between 0.100 mm and 0.125 mm
(1)
inches
Typ Max
- 0.0059
- 0.0020