STMicroelectronics STM32L162RC Manual

STMicroelectronics STM32L162RC Manual

Ultra-low-power 32-bit mcu arm-based cortex -m3, 256kb flash, 32kb sram, 8kb eeprom, lcd, usb, adc, dac, aes
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Ultra-low-power 32-bit MCU ARM
Flash, 32KB SRAM, 8KB EEPROM, LCD, USB, ADC, DAC, AES
Features
• Ultra-low-power platform
– 1.65 V to 3.6 V power supply
– -40°C to 105°C temperature range
– 0.29 µA Standby mode (3 wakeup pins)
– 1.15 µA Standby mode + RTC
– 0.44 µA Stop mode (16 wakeup lines)
– 1.4 µA Stop mode + RTC
– 8.6 µA Low-power run mode
– 185 µA/MHz Run mode
– 10 nA ultra-low I/O leakage
– 8 µs wakeup time
• AES-128 bit encryption hardware accelerator
®
• Core: ARM
Cortex
– From 32 kHz up to 32 MHz max
– 1.25 DMIPS/MHz (Dhrystone 2.1)
– Memory protection unit
• Reset and supply management
– Low-power, ultrasafe BOR (brownout reset)
with 5 selectable thresholds
– Ultra-low-power POR/PDR
– Programmable voltage detector (PVD)
• Clock sources
– 1 to 24 MHz crystal oscillator
– 32 kHz oscillator for RTC with calibration
– High Speed Internal 16 MHz factory-
trimmed RC (+/- 1%)
– Internal low-power 37 kHz RC
– Internal multispeed low-power 65 kHz to
4.2 MHz RC
– PLL for CPU clock and USB (48 MHz)
• Pre-programmed bootloader
– USB and USART supported
• Development support
– Serial wire debug supported
– JTAG and trace supported
March 2016
This is information on a product in full production.
STM32L162VC STM32L162RC
®
-M3 32-bit CPU
DocID022881 Rev 10
®
-based Cortex
LQFP100 (14 × 14 mm)
LQFP64 (10 × 10 mm)
• Up to 83 fast I/Os (70 I/Os 5V tolerant), all
mappable on 16 external interrupt vectors
• Memories: 256 KB Flash memory with ECC,
32-KB RAM, 8 KB of true EEPROM with ECC,
128-byte backup register
• LCD Driver for up to 8×40 segments
– Support contrast adjustment
– Support blinking mode
– Step-up converter on board
• Rich analog peripherals (down to 1.8V)
– 2x operational amplifiers
– 12-bit ADC 1 Msps up to 25 channels
– 12-bit DAC 2 ch with output buffers
– 2x Ultra-low-power-comparators
(window mode and wake up capability)
• DMA controller 12x channels
• 9x communication interfaces
– 1x USB 2.0 (internal 48MHz PLL)
– 3x USARTs
– Up to 8x SPIs (2x I2S, 3x 16 Mbit/s)
– 2x I2Cs (SMBus/PMBus)
• 11x timers: 1x 32-bit, 6x 16-bit with up to 4
IC/OC/PWM channels each, 2x 16-bit basic
timers and 2x watchdog timers (independent
and window)
• Up to 23 capacitive sensing channels
• CRC calculation unit, 96-bit unique ID

Table 1. Device summary

Reference
STM32L162RC
STM32L162VC
1. For sales types ending with "A" and STM32L162xC
products in WLCSP64 package, please refer to
STM32L162xC/C-A datasheet.
®
-M3, 256KB
-
Datasheet
production data
UFBGA100
(7 x 7 mm)
(1)
Part number
STM32L162RCT6
STM32L162VCT6
STM32L162VCH6
www.st.com
1/123

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Summary of Contents for STMicroelectronics STM32L162RC

  • Page 1: Table 1. Device Summary

    STM32L162VC STM32L162RC ® ® Ultra-low-power 32-bit MCU ARM -based Cortex -M3, 256KB Flash, 32KB SRAM, 8KB EEPROM, LCD, USB, ADC, DAC, AES Datasheet production data Features • Ultra-low-power platform UFBGA100 LQFP100 (14 × 14 mm) – 1.65 V to 3.6 V power supply (7 x 7 mm) LQFP64 (10 ×...
  • Page 2: Table Of Contents

    Contents STM32L162VC, STM32L162RC Contents Introduction ..........8 Description .
  • Page 3 STM32L162VC, STM32L162RC 3.16 AES ........... . . 27 3.17...
  • Page 4 Contents STM32L162VC, STM32L162RC 6.3.3 Embedded internal reference voltage ......54 6.3.4 Supply current characteristics ....... . 55 6.3.5...
  • Page 5 STM32L162VC, STM32L162RC List of tables Table 1. Device summary ............1 Table 2.
  • Page 6 List of tables STM32L162VC, STM32L162RC Table 48. C characteristics............85 Table 49.
  • Page 7 STM32L162RC LQFP64 pinout ........
  • Page 8: Introduction

    This STM32L162xC datasheet should be read in conjunction with the STM32L1xxxx reference manual (RM0038). The application note “Getting started with STM32L1xxxx hardware development” (AN3216) gives a hardware implementation overview. Both documents are available from the STMicroelectronics website www.st.com. ® ®...
  • Page 9: Description

    STM32L162VC, STM32L162RC Description The ultra-low-power STM32L162xC devices incorporate the connectivity power of the ® ® universal serial bus (USB) with the high-performance ARM Cortex -M3 32-bit RISC core operating at a frequency of 32 MHz (33.3 DMIPS), a memory protection unit (MPU), high- speed embedded memories (Flash memory up to 256 Kbytes and RAM up to 32 Kbytes) and an extensive range of enhanced I/Os and peripherals connected to two APB buses.
  • Page 10: Device Overview

    Description STM32L162VC, STM32L162RC Device overview Table 2. Ultra-low power STM32L162xC device features and peripheral counts Peripheral STM32L162RC STM32L162VC Flash (Kbytes) Data EEPROM (Kbytes) RAM (Kbytes) 32 bit General- Timers purpose Basic 8(3) Communicatio n interfaces USART GPIOs Operation amplifiers 12-bit synchronized ADC...
  • Page 11: Ultra-Low-Power Device Continuum

    BOM. Note: STMicroelectronics as a reliable and long-term manufacturer ensures as much as possible the pin-to-pin compatibility between any STM8Lxxxxx and STM32Lxxxxx devices and between any of the STM32Lx and STM32Fx series. Thanks to this unprecedented scalability, the old applications can be upgraded to respond to the latest market features and efficiency demand.
  • Page 12: Functional Overview

    Functional overview STM32L162VC, STM32L162RC Functional overview Figure 1. Ultra-low-power STM32L162xC block diagram 12/123 DocID022881 Rev 10...
  • Page 13: Low-Power Modes

    STM32L162VC, STM32L162RC Low-power modes The ultra-low-power STM32L162xC devices support dynamic voltage scaling to optimize its power consumption in run mode. The voltage from the internal low-drop regulator that supplies the logic can be adjusted according to the system’s maximum operating frequency and the external voltage supply.
  • Page 14: Table 3. Functionalities Depending On The Operating Power Supply Range

    Functional overview STM32L162VC, STM32L162RC • Stop mode without RTC Stop mode achieves the lowest power consumption while retaining the RAM and register contents. All clocks are stopped, the PLL, MSI RC, HSI and LSI RC, LSE and HSE crystal oscillators are disabled. The voltage regulator is in the low-power mode.
  • Page 15: Table 4. Cpu Frequency Range Depending On Dynamic Voltage Scaling

    STM32L162VC, STM32L162RC Table 3. Functionalities depending on the operating power supply range (continued) Functionalities depending on the operating power supply range Operating power supply DAC and ADC Dynamic voltage I/O operation range operation scaling range Conversion time up Range 1, Range 2 = 2.0 to 2.4 V...
  • Page 16: Table 5. Functionalities Depending On The Working Mode

    Functional overview STM32L162VC, STM32L162RC Table 5. Functionalities depending on the working mode (from Run/active down to standby) Stop Standby Low- Low- Run/Active Sleep power power Wakeup Wakeup Sleep capability capability Flash Backup Registers EEPROM Brown-out rest (BOR) Programmable Voltage Detector...
  • Page 17: Arm ® Cortex ® -M3 Core With Mpu

    STM32L162VC, STM32L162RC Table 5. Functionalities depending on the working mode (from Run/active down to standby) (continued) Stop Standby Low- Low- Run/Active Sleep power power Wakeup Wakeup Sleep capability capability Tempsensor OP amp Comparators 16-bit and 32-bit Timers IWDG WWDG Touch sensing...
  • Page 18: Reset And Supply Management

    Functional overview STM32L162VC, STM32L162RC The memory protection unit (MPU) improves system reliability by defining the memory attributes (such as read/write access permissions) for different memory regions. It provides up to eight different regions and an optional predefined background region. Owing to its embedded ARM core, the STM32L162xC devices are compatible with all ARM tools and software.
  • Page 19: Voltage Regulator

    STM32L162VC, STM32L162RC power ramp-up should guarantee that 1.65 V is reached on V at least 1 ms after it exits the POR area. Five BOR thresholds are available through option bytes, starting from 1.8 V to 3 V. To reduce the power consumption in Stop mode, it is possible to automatically switch off the internal reference voltage (V ) in Stop mode.
  • Page 20: Clock Management

    Functional overview STM32L162VC, STM32L162RC Clock management The clock controller distributes the clocks coming from different oscillators to the core and the peripherals. It also manages clock gating for low-power modes and ensures clock robustness. It features: • Clock prescaler: to get the best trade-off between speed and current consumption, the clock frequency to the CPU and peripherals can be adjusted by a programmable prescaler.
  • Page 21: Figure 2. Clock Tree

    STM32L162VC, STM32L162RC Figure 2. Clock tree DocID022881 Rev 10 21/123...
  • Page 22: Low-Power Real-Time Clock And Backup Registers

    Functional overview STM32L162VC, STM32L162RC Low-power real-time clock and backup registers The real-time clock (RTC) is an independent BCD timer/counter. Dedicated registers contain the sub-second, second, minute, hour (12/24 hour), week day, date, month, year, in BCD (binary-coded decimal) format. Correction for 28, 29 (leap year), 30, and 31 day of the month are made automatically.
  • Page 23: Memories

    STM32L162VC, STM32L162RC Memories The STM32L162xC devices have the following features: • 32 Kbytes of embedded RAM accessed (read/write) at CPU clock speed with 0 wait states. With the enhanced bus matrix, operating the RAM does not lead to any performance penalty during accesses to the system bus (AHB and APB buses).
  • Page 24: Lcd (Liquid Crystal Display)

    Functional overview STM32L162VC, STM32L162RC LCD (liquid crystal display) The LCD drives up to 8 common terminals and 44 segment terminals to drive up to 320 pixels. • Internal step-up converter to guarantee functionality and contrast control irrespective of . This converter can be deactivated, in which case the V...
  • Page 25: Temperature Sensor

    STM32L162VC, STM32L162RC 3.10.1 Temperature sensor The temperature sensor (TS) generates a voltage V that varies linearly with SENSE temperature. The temperature sensor is internally connected to the ADC_IN16 input channel which is used to convert the sensor output voltage into a digital value.
  • Page 26: Operational Amplifier

    Functional overview STM32L162VC, STM32L162RC 3.12 Operational amplifier The STM32L162xC devices embed two operational amplifiers with external or internal follower routing capability (or even amplifier and filter capability with external components). When one operational amplifier is selected, one external ADC channel is used to enable output measurement.
  • Page 27: Aes

    STM32L162VC, STM32L162RC implementation based on a surface charge transfer acquisition principle. It consists of charging the sensor capacitance and then transferring a part of the accumulated charges into a sampling capacitor until the voltage across this capacitor has reached a specific threshold.
  • Page 28: General-Purpose Timers

    Functional overview STM32L162VC, STM32L162RC 3.17.1 General-purpose timers (TIM2, TIM3, TIM4, TIM5, TIM9, TIM10 and TIM11) There are seven synchronizable general-purpose timers embedded in the STM32L162xC devices (see Table 7 for differences). TIM2, TIM3, TIM4, TIM5 TIM2, TIM3, TIM4 are based on 16-bit auto-reload up/down counter. TIM5 is based on a 32- bit auto-reload up/down counter.
  • Page 29: Window Watchdog (Wwdg)

    STM32L162VC, STM32L162RC 3.17.5 Window watchdog (WWDG) The window watchdog is based on a 7-bit downcounter that can be set as free-running. It can be used as a watchdog to reset the device when a problem occurs. It is clocked from the main clock.
  • Page 30: Crc (Cyclic Redundancy Check) Calculation Unit

    Functional overview STM32L162VC, STM32L162RC 3.19 CRC (cyclic redundancy check) calculation unit The CRC (cyclic redundancy check) calculation unit is used to get a CRC code from a 32-bit data word and a fixed generator polynomial. Among other applications, CRC-based techniques are used to verify data transmission or storage integrity.
  • Page 31: Development Support

    STM32L162VC, STM32L162RC 3.20 Development support 3.20.1 Serial wire JTAG debug port (SWJ-DP) The ARM SWJ-DP interface is embedded, and is a combined JTAG and serial wire debug port that enables either a serial wire debug or a JTAG probe to be connected to the target.
  • Page 32: Pin Descriptions

    Pin descriptions STM32L162VC, STM32L162RC Pin descriptions Figure 3. STM32L162VC UFBGA100 ballout 1. This figure shows the package top view. 32/123 DocID022881 Rev 10...
  • Page 33: Figure 4. Stm32L162Vc Lqfp100 Pinout

    STM32L162VC, STM32L162RC Figure 4. STM32L162VC LQFP100 pinout 1. This figure shows the package top view. DocID022881 Rev 10 33/123...
  • Page 34: Figure 5. Stm32L162Rc Lqfp64 Pinout

    Pin descriptions STM32L162VC, STM32L162RC Figure 5. STM32L162RC LQFP64 pinout 1. This figure shows the package top view. 34/123 DocID022881 Rev 10...
  • Page 35: Table 8. Legend/Abbreviations Used In The Pinout Table

    STM32L162VC, STM32L162RC Table 8. Legend/abbreviations used in the pinout table Name Abbreviation Definition Unless otherwise specified in brackets below the pin name, the pin function Pin name during and after reset is the same as the actual pin name Supply pin...
  • Page 36 Pin descriptions STM32L162VC, STM32L162RC Table 9. STM32L162xC pin definitions (continued) Pins Pin functions Main Pin name function Alternate functions Additional functions (after reset) PC14- PC14 OSC32_IN OSC32_IN PC15- PC15 OSC32_OUT OSC32_OUT SS_5 SS_5 DD_5 DD_5 PH0- OSC_IN OSC_IN PH1- OSC_OUT...
  • Page 37 STM32L162VC, STM32L162RC Table 9. STM32L162xC pin definitions (continued) Pins Pin functions Main Pin name function Alternate functions Additional functions (after reset) SPI1_NSS/SPI3_NSS/ ADC_IN4/DAC_OUT1/ 29 20 I2S3_WS/USART2_CK/ COMP1_INP ADC_IN5/DAC_OUT2/ 30 21 TIM2_CH1_ETR/SPI1_SCK COMP1_INP TIM3_CH1/TIM10_CH1/ ADC_IN6/COMP1_INP/ 31 22 I/O FT SPI1_MISO/LCD_SEG3 OPAMP2_VINP...
  • Page 38 Pin descriptions STM32L162VC, STM32L162RC Table 9. STM32L162xC pin definitions (continued) Pins Pin functions Main Pin name function Alternate functions Additional functions (after reset) G12 50 32 DD_1 DD_1 TIM10_CH1/I2C2_SMBA/ ADC_IN18/COMP1_INP 51 33 PB12 I/O FT PB12 SPI2_NSS/I2S2_WS/ USART3_CK/LCD_SEG12 TIM9_CH1/SPI2_SCK/ ADC_IN19/COMP1_INP...
  • Page 39 STM32L162VC, STM32L162RC Table 9. STM32L162xC pin definitions (continued) Pins Pin functions Main Pin name function Alternate functions Additional functions (after reset) JTMS- 72 46 PA13 I/O FT JTMS-SWDIO SWDIO I/O FT 74 47 SS_2 SS_2 75 48 DD_2 DD_2 JTCK-...
  • Page 40 Pin descriptions STM32L162VC, STM32L162RC Table 9. STM32L162xC pin definitions (continued) Pins Pin functions Main Pin name function Alternate functions Additional functions (after reset) TIM3_CH1/SPI1_MISO/ 90 56 I/O FT NJTRST SPI3_MISO/LCD_SEG8/ COMP2_INP NJTRST TIM3_CH2/I2C1_SMBA/ 91 57 I/O FT SPI1_MOSI/SPI3_MOSI/ COMP2_INP I2S3_SD/LCD_SEG9...
  • Page 41: Table 10. Alternate Function Input/Output

    Alternate functions Table 10. Alternate function input/output Digital alternate function number AFIO0 AFIO1 AFIO2 AFIO3 AFIO4 AFIO5 AFIO6 AFIO7 AFIO11 AFIO14 AFIO15 Port name Alternate function TIM9/ SYSTEM TIM2 TIM3/4/5 I2C1/2 SPI1/2 SPI3 USART1/2/3 CPRI SYSTEM 10/11 BOOT0 BOOT0 EVENT OUT NRST NRST PA0-...
  • Page 42 Table 10. Alternate function input/output (continued) Digital alternate function number AFIO0 AFIO1 AFIO2 AFIO3 AFIO4 AFIO5 AFIO6 AFIO7 AFIO11 AFIO14 AFIO15 Port name Alternate function TIM9/ SYSTEM TIM2 TIM3/4/5 I2C1/2 SPI1/2 SPI3 USART1/2/3 CPRI SYSTEM 10/11 TIM3_CH3 SEG5 EVEN TOUT TIM3_CH4 SEG6 EVENT OUT...
  • Page 43 Table 10. Alternate function input/output (continued) Digital alternate function number AFIO0 AFIO1 AFIO2 AFIO3 AFIO4 AFIO5 AFIO6 AFIO7 AFIO11 AFIO14 AFIO15 Port name Alternate function TIM9/ SYSTEM TIM2 TIM3/4/5 I2C1/2 SPI1/2 SPI3 USART1/2/3 CPRI SYSTEM 10/11 SEG22 TIMx_IC1 EVENT OUT SEG23 TIMx_IC2 EVENT OUT...
  • Page 44 Table 10. Alternate function input/output (continued) Digital alternate function number AFIO0 AFIO1 AFIO2 AFIO3 AFIO4 AFIO5 AFIO6 AFIO7 AFIO11 AFIO14 AFIO15 Port name Alternate function TIM9/ SYSTEM TIM2 TIM3/4/5 I2C1/2 SPI1/2 SPI3 USART1/2/3 CPRI SYSTEM 10/11 SPI2_MISO USART2_CTS TIMx_IC4 EVENT OUT SPI2_MOSI USART2_RTS TIMx_IC1...
  • Page 45 Table 10. Alternate function input/output (continued) Digital alternate function number AFIO0 AFIO1 AFIO2 AFIO3 AFIO4 AFIO5 AFIO6 AFIO7 AFIO11 AFIO14 AFIO15 Port name Alternate function TIM9/ SYSTEM TIM2 TIM3/4/5 I2C1/2 SPI1/2 SPI3 USART1/2/3 CPRI SYSTEM 10/11 TIMx_IC1 EVENT OUT TIM2_CH1_ETR TIM5_ETR TIMx_IC2 EVENT OUT...
  • Page 46: Memory Mapping

    Memory mapping STM32L162VC, STM32L162RC Memory mapping Figure 6. Memory map 46/123 DocID022881 Rev 10...
  • Page 47: Electrical Characteristics

    STM32L162VC, STM32L162RC Electrical characteristics Parameter conditions Unless otherwise specified, all voltages are referenced to V 6.1.1 Minimum and maximum values Unless otherwise specified the minimum and maximum values are guaranteed in the worst conditions of ambient temperature, supply voltage and frequencies by tests in production on 100% of the devices with an ambient temperature at T = 25 °C and T...
  • Page 48: Power Supply Scheme

    Electrical characteristics STM32L162VC, STM32L162RC 6.1.6 Power supply scheme Figure 9. Power supply scheme 48/123 DocID022881 Rev 10...
  • Page 49: Optional Lcd Power Supply Scheme

    STM32L162VC, STM32L162RC 6.1.7 Optional LCD power supply scheme Figure 10. Optional LCD power supply scheme 1. Option 1: LCD power supply is provided by a dedicated VLCD supply source, VSEL switch is open. 2. Option 2: LCD power supply is provided by the internal step-up converter, VSEL switch is closed, an external capacitance is needed for correct behavior of this converter.
  • Page 50: Absolute Maximum Ratings

    Electrical characteristics STM32L162VC, STM32L162RC Absolute maximum ratings Stresses above the absolute maximum ratings listed in Table 11: Voltage characteristics, Table 12: Current characteristics, and Table 13: Thermal characteristics may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these conditions is not implied.
  • Page 51: Operating Conditions

    STM32L162VC, STM32L162RC 4. Positive current injection is not possible on these I/Os. A negative injection is induced by V <V must never be INJ(PIN) exceeded. Refer to Table 11 for maximum allowed input voltage values. 5. A positive injection is induced by V >...
  • Page 52: Embedded Reset And Power Control Block Characteristics

    Electrical characteristics STM32L162VC, STM32L162RC Table 14. General operating conditions (continued) Symbol Parameter Conditions Unit Ambient temperature for 6 suffix version Maximum power dissipation –40 °C Ambient temperature for 7 suffix version Maximum power dissipation –40 6 suffix version –40 Junction temperature range °C...
  • Page 53 STM32L162VC, STM32L162RC Table 15. Embedded reset and power control block characteristics (continued) Symbol Parameter Conditions Unit Falling edge 2.45 2.55 Brown-out reset threshold 3 BOR3 Rising edge 2.54 2.66 Falling edge 2.68 2.85 Brown-out reset threshold 4 BOR4 Rising edge 2.78...
  • Page 54: Embedded Internal Reference Voltage

    Electrical characteristics STM32L162VC, STM32L162RC 6.3.3 Embedded internal reference voltage The parameters given in Table 17 are based on characterization results, unless otherwise specified. Table 16. Embedded internal reference voltage calibration values Calibration value name Description Memory address Raw data acquired at VREFINT_CAL temperature of 30 °C ±5 °C...
  • Page 55: Supply Current Characteristics

    STM32L162VC, STM32L162RC 5. To guarantee less than 1% VREF_OUT deviation. 6.3.4 Supply current characteristics The current consumption is a function of several parameters and factors such as the operating voltage, temperature, I/O pin loading, device software configuration, operating frequencies, I/O pin switching rate, program location in memory and executed binary code.
  • Page 56: Table 18. Current Consumption In Run Mode, Code With Data Processing Running From Flash

    Electrical characteristics STM32L162VC, STM32L162RC Table 18. Current consumption in Run mode, code with data processing running from Flash Symbol Parameter Conditions Unit HCLK 1 MHz Range 3, V =1.2 V CORE 2 MHz µA VOS[1:0] = 11 4 MHz 4 MHz 0.915...
  • Page 57: Table 19. Current Consumption In Run Mode, Code With Data Processing Running From Ram

    STM32L162VC, STM32L162RC Table 19. Current consumption in Run mode, code with data processing running from RAM Symbol Parameter Conditions Unit HCLK 1 MHz Range 3, =1.2 V VOS[1:0] 2 MHz µA CORE = 11 4 MHz HCLK 0.755 4 MHz...
  • Page 58: Table 20. Current Consumption In Sleep Mode

    Electrical characteristics STM32L162VC, STM32L162RC Table 20. Current consumption in Sleep mode Symbol Parameter Conditions Unit HCLK 1 MHz Range 3, =1.2 V 2 MHz 78.5 CORE VOS[1:0] = 11 4 MHz up to HCLK 4 MHz 16 MHz included, Range 2, =1.5 V...
  • Page 59: Table 21. Current Consumption In Low-Power Run Mode

    STM32L162VC, STM32L162RC Table 21. Current consumption in Low-power run mode Symbol Parameter Conditions Unit = -40 °C to 25 °C MSI clock, 65 kHz = 85 °C = 32 kHz HCLK = 105 °C peripherals OFF, code =-40 °C to 25 °C...
  • Page 60: Table 22. Current Consumption In Low-Power Sleep Mode

    Electrical characteristics STM32L162VC, STM32L162RC Table 22. Current consumption in Low-power sleep mode Symbol Parameter Conditions Unit MSI clock, 65 kHz = 32 kHz = -40 °C to 25 °C HCLK Flash OFF = -40 °C to 25 °C MSI clock, 65 kHz = 32 kHz = 85 °C...
  • Page 61: Table 23. Typical And Maximum Current Consumptions In Stop Mode

    STM32L162VC, STM32L162RC Table 23. Typical and maximum current consumptions in Stop mode Symbol Parameter Conditions Unit = -40°C to 25°C 1.15 = 1.8 V = -40°C to 25°C = 55°C = 85°C RTC clocked by LSI = 105°C 6.35 or LSE external clock = -40°C to 25°C...
  • Page 62 Electrical characteristics STM32L162VC, STM32L162RC Table 23. Typical and maximum current consumptions in Stop mode (continued) Symbol Parameter Conditions Unit Regulator in LP mode, HSI and HSE OFF, independent = -40°C to 25°C watchdog and LSI enabled Supply current in = -40°C to 25°C 0.435...
  • Page 63: Table 24. Typical And Maximum Current Consumptions In Standby Mode

    STM32L162VC, STM32L162RC Table 24. Typical and maximum current consumptions in Standby mode Symbol Parameter Conditions Unit = -40 °C to 25 °C 0.905 = 1.8 V = -40 °C to 25 °C 1.15 RTC clocked by LSI (no independent watchdog) = 55 °C...
  • Page 64: Table 25. Peripheral Current Consumption

    Electrical characteristics STM32L162VC, STM32L162RC Table 25. Peripheral current consumption Typical consumption, V = 3.0 V, T = 25 °C Range 1, Range 2, Range 3, Low-power Peripheral Unit CORE CORE CORE 1.8 V 1.5 V 1.2 V sleep and VOS[1:0] =...
  • Page 65 STM32L162VC, STM32L162RC Table 25. Peripheral current consumption (continued) Typical consumption, V = 3.0 V, T = 25 °C Range 1, Range 2, Range 3, Low-power Peripheral Unit CORE CORE CORE 1.8 V 1.5 V 1.2 V sleep and VOS[1:0] =...
  • Page 66: Wakeup Time From Low-Power Mode

    Electrical characteristics STM32L162VC, STM32L162RC 2. HSI oscillator is OFF for this measure. 3. In Low-power sleep and run mode, the Flash memory must always be in power-down mode. 4. Data based on a differential I measurement between ADC in reset configuration and continuous ADC conversion (HSI consumption not included).
  • Page 67: External Clock Source Characteristics

    STM32L162VC, STM32L162RC 1. Guaranteed by characterization, unless otherwise specified 6.3.6 External clock source characteristics High-speed external user clock generated from an external source In bypass mode the HSE oscillator is switched off and the input pin is a standard GPIO.The...
  • Page 68: Table 28. Low-Speed External User Clock Characteristics

    Electrical characteristics STM32L162VC, STM32L162RC Low-speed external user clock generated from an external source The characteristics given in the following table result from tests performed using a low- speed external clock source, and under the conditions summarized in Table Table 28. Low-speed external user clock characteristics...
  • Page 69: Table 29. Hse Oscillator Characteristics

    STM32L162VC, STM32L162RC (1)(2) Table 29. HSE oscillator characteristics Symbol Parameter Conditions Min Typ Unit Oscillator frequency OSC_IN Feedback resistor kΩ Recommended load capacitance versus = 30 Ω equivalent serial resistance of the crystal = 3.3 V, HSE driving current with 30 pF load 2.5 (startup)
  • Page 70: Figure 14. Hse Oscillator Circuit Diagram

    Electrical characteristics STM32L162VC, STM32L162RC Figure 14. HSE oscillator circuit diagram 1. R value depends on the crystal characteristics. Low-speed external clock generated from a crystal/ceramic resonator The low-speed external (LSE) clock can be supplied with a 32.768 kHz crystal/ceramic resonator oscillator. All the information given in this paragraph are based on...
  • Page 71: Figure 15. Typical Application With A 32.768 Khz Crystal

    STM32L162VC, STM32L162RC is the startup time measured from the moment it is enabled (by software) to a stabilized SU(LSE) 32.768 kHz oscillation is reached. This value is measured for a standard crystal resonator and it can vary significantly with the crystal manufacturer.
  • Page 72: Internal Clock Source Characteristics

    Electrical characteristics STM32L162VC, STM32L162RC 6.3.7 Internal clock source characteristics The parameters given in Table 31 are derived from tests performed under the conditions summarized in Table High-speed internal (HSI) RC oscillator Table 31. HSI oscillator characteristics Symbol Parameter Conditions Unit Frequency = 3.0 V...
  • Page 73: Table 33. Msi Oscillator Characteristics

    STM32L162VC, STM32L162RC Multi-speed internal (MSI) RC oscillator Table 33. MSI oscillator characteristics Symbol Parameter Condition Max Unit MSI range 0 65.5 MSI range 1 MSI range 2 Frequency after factory calibration, done at MSI range 3 = 3.3 V and T = 25 °C...
  • Page 74 Electrical characteristics STM32L162VC, STM32L162RC Table 33. MSI oscillator characteristics (continued) Symbol Parameter Condition Max Unit MSI range 0 MSI range 1 MSI range 2 MSI range 3 MSI range 4 MSI oscillator stabilization time µs STAB(MSI) MSI range 5 MSI range 6,...
  • Page 75: Pll Characteristics

    STM32L162VC, STM32L162RC 6.3.8 PLL characteristics The parameters given in Table 34 are derived from tests performed under the conditions summarized in Table Table 34. PLL characteristics Value Symbol Parameter Unit PLL input clock PLL_IN PLL input clock duty cycle PLL output clock...
  • Page 76: Table 36. Flash Memory And Data Eeprom Characteristics

    Electrical characteristics STM32L162VC, STM32L162RC Flash memory and data EEPROM Table 36. Flash memory and data EEPROM characteristics Symbol Parameter Conditions Unit Operating voltage 1.65 Read / Write / Erase Programming/ erasing Erasing 3.28 3.94 time for byte / word /...
  • Page 77: Emc Characteristics

    STM32L162VC, STM32L162RC 6.3.10 EMC characteristics Susceptibility tests are performed on a sample basis during device characterization. Functional EMS (electromagnetic susceptibility) While a simple application is executed on the device (toggling 2 LEDs through I/O ports). the device is stressed by two electromagnetic events until a failure occurs. The failure is indicated by the LEDs: •...
  • Page 78: Electrical Sensitivity Characteristics

    Electrical characteristics STM32L162VC, STM32L162RC To complete these trials, ESD stress can be applied directly on the device, over the range of specification values. When unexpected behavior is detected, the software can be hardened to prevent unrecoverable errors occurring (see application note AN1015).
  • Page 79: I/O Current Injection Characteristics

    STM32L162VC, STM32L162RC Static latch-up Two complementary static tests are required on six parts to assess the latch-up performance: • A supply overvoltage is applied to each power supply pin • A current injection is applied to each input, output and configurable I/O pin These tests are compliant with EIA/JESD 78A IC latch-up standard.
  • Page 80: I/O Port Characteristics

    Electrical characteristics STM32L162VC, STM32L162RC 6.3.13 I/O port characteristics General input/output characteristics Unless otherwise specified, the parameters given in Table 49 are derived from tests performed under the conditions summarized in Table 14. All I/Os are CMOS and TTL compliant. Table 43. I/O static characteristics...
  • Page 81: Table 44. Output Voltage Characteristics

    STM32L162VC, STM32L162RC Output driving current The GPIOs (general purpose input/outputs) can sink or source up to ±8 mA, and sink or source up to ±20 mA with the non-standard V specifications given in Table In the user application, the number of I/O pins which can drive current must be limited to...
  • Page 82: Table 45. I/O Ac Characteristics

    Electrical characteristics STM32L162VC, STM32L162RC Input/output AC characteristics The definition and values of input/output AC characteristics are given in Figure 16 Table 45, respectively. Unless otherwise specified, the parameters given in Table 45 are derived from tests performed under the conditions summarized in Table Table 45.
  • Page 83: Nrst Pin Characteristics

    STM32L162VC, STM32L162RC Figure 16. I/O AC characteristics definition 6.3.14 NRST pin characteristics The NRST pin input driver uses CMOS technology. It is connected to a permanent pull-up resistor, R (see Table Unless otherwise specified, the parameters given in Table 46...
  • Page 84: Tim Timer Characteristics

    Electrical characteristics STM32L162VC, STM32L162RC Figure 17. Recommended NRST pin protection 1. The reset network protects the device against parasitic resets. 2. The user must ensure that the level on the NRST pin can go below the V max level specified in...
  • Page 85: Communications Interfaces

    STM32L162VC, STM32L162RC 6.3.16 Communications interfaces C interface characteristics The device I C interface meets the requirements of the standard I C communication protocol with the following restrictions: SDA and SCL are not “true” open-drain I/O pins. When configured as open-drain, the PMOS connected between the I/O pin and V disabled, but is still present.
  • Page 86: Table 49. Scl Frequency

    Electrical characteristics STM32L162VC, STM32L162RC Figure 18. I C bus AC waveforms and measurement circuit 1. R = series protection resistor. 2. R = external pull-up resistor. 3. V is the I2C bus power supply. DD_I2C 4. Measurement points are done at CMOS levels: 0.3V and 0.7V...
  • Page 87 STM32L162VC, STM32L162RC SPI characteristics Unless otherwise specified, the parameters given in the following table are derived from tests performed under the conditions summarized in Table Refer to Section 6.3.12: I/O current injection characteristics for more details on the input/output alternate function characteristics (NSS, SCK, MOSI, MISO).
  • Page 88: Figure 19. Spi Timing Diagram - Slave Mode And Cpha = 0

    Electrical characteristics STM32L162VC, STM32L162RC Figure 19. SPI timing diagram - slave mode and CPHA = 0 Figure 20. SPI timing diagram - slave mode and CPHA = 1 1. Measurement points are done at CMOS levels: 0.3V and 0.7V 88/123...
  • Page 89: Figure 21. Spi Timing Diagram - Master Mode (1)

    STM32L162VC, STM32L162RC Figure 21. SPI timing diagram - master mode 1. Measurement points are done at CMOS levels: 0.3V and 0.7V DocID022881 Rev 10 89/123...
  • Page 90: Table 51. Usb Startup Time

    Electrical characteristics STM32L162VC, STM32L162RC USB characteristics The USB interface is USB-IF certified (full speed). Table 51. USB startup time Symbol Parameter Unit USB transceiver startup time µs STARTUP 1. Guaranteed by design. Table 52. USB DC electrical characteristics Symbol Parameter Conditions Min.
  • Page 91: Table 54. I2S Characteristics

    STM32L162VC, STM32L162RC Table 53. USB: full speed electrical characteristics (continued) Driver characteristics Symbol Parameter Conditions Unit Rise/ fall time matching Output signal crossover voltage 1. Guaranteed by design. 2. Measured from 10% to 90% of the data signal. For more detailed informations, please refer to USB Specification - Chapter 7 (version 2.0).
  • Page 92: Figure 23. I 2 S Slave Timing Diagram (Philips Protocol)

    Electrical characteristics STM32L162VC, STM32L162RC ODD bit value, digital contribution leads to a min of (I2SDIV/(2*I2SDIV+ODD) and a max of (I2SDIV+ODD)/(2*I2SDIV+ODD). Fs max is supported for each mode/condition. Figure 23. I S slave timing diagram (Philips protocol) 1. Measurement points are done at CMOS levels: 0.3 × V and 0.7 ×...
  • Page 93: 12-Bit Adc Characteristics

    STM32L162VC, STM32L162RC 6.3.17 12-bit ADC characteristics Unless otherwise specified, the parameters given in Table 56 are guaranteed by design. Table 55. ADC clock frequency Symbol Parameter Conditions Unit REF+ = < V REF+ 2.4 V ≤ V ≤ 3.6 V >...
  • Page 94 Electrical characteristics STM32L162VC, STM32L162RC Table 56. ADC characteristics (continued) Symbol Parameter Conditions Unit Direct channels 0.25 2.4 V ≤ V ≤ 3.6 V Multiplexed channels 0.56 2.4 V ≤ V ≤ 3.6 V µs Sampling time Direct channels 0.56 1.8 V ≤ V ≤...
  • Page 95: Table 57. Adc Accuracy

    STM32L162VC, STM32L162RC (1)(2) Table 57. ADC accuracy Symbol Parameter Test conditions Unit Total unadjusted error Offset error 2.4 V ≤ V ≤ 3.6 V 2.4 V ≤ V ≤ 3.6 V REF+ Gain error = 8 MHz, R = 50 Ω...
  • Page 96: Figure 25. Adc Accuracy Characteristics

    Electrical characteristics STM32L162VC, STM32L162RC Figure 25. ADC accuracy characteristics Figure 26. Typical connection diagram using the ADC 1. Refer to Table 58: Maximum source impedance RAIN max for the value of R Table 56: ADC characteristics for the value of C 2.
  • Page 97: Figure 27. Maximum Dynamic Current Consumption On V

    STM32L162VC, STM32L162RC Figure 27. Maximum dynamic current consumption on V supply pin during ADC REF+ conversion Sampling (n cycles) Conversion (12 cycles) ADC clock ref+ 700µA 300µA MS36686V1 Table 58. Maximum source impedance R max (kΩ) Ts (cycles) Multiplexed channels Direct channels (µs)
  • Page 98: Dac Electrical Specifications

    Electrical characteristics STM32L162VC, STM32L162RC 6.3.18 DAC electrical specifications Data guaranteed by design, unless otherwise specified. Table 59. DAC characteristics Symbol Parameter Conditions Unit Analog supply voltage Reference supply must always be below REF+ REF+ voltage Lower reference voltage REF- Current consumption on...
  • Page 99 STM32L162VC, STM32L162RC Table 59. DAC characteristics (continued) Symbol Parameter Conditions Unit = 3.3V = 3.0V REF+ = 0 to 50 ° C DAC output buffer OFF Offset error temperature dOffset/dT µV/°C coefficient (code 0x800) = 3.3V = 3.0V REF+ = 0 to 50 ° C DAC output buffer ON ≤...
  • Page 100: Operational Amplifier Characteristics

    Electrical characteristics STM32L162VC, STM32L162RC 4. Difference between measured value at Code i and the value at Code i on a line drawn between Code 0 and last Code 4095. 5. Difference between the value measured at Code (0x800) and the ideal value = V REF+ 6.
  • Page 101 STM32L162VC, STM32L162RC Table 60. Operational amplifier characteristics (continued) Symbol Parameter Condition Unit Normal mode Power supply PSRR rejection ratio Low-power mode Normal mode 1000 3000 >2.4 V Low-power mode Bandwidth Normal mode 2200 <2.4 V Low-power mode >2.4 V Normal mode (between 0.1 V and...
  • Page 102: Temperature Sensor Characteristics

    Electrical characteristics STM32L162VC, STM32L162RC 6.3.20 Temperature sensor characteristics Table 61. Temperature sensor calibration values Calibration value name Description Memory address TS ADC raw data acquired at temperature of 30 °C ±5 °C TS_CAL1 0x1FF8 00FA - 0x1FF8 00FB = 3 V ±10 mV TS ADC raw data acquired at temperature of 110 °C ±5 °C...
  • Page 103: Table 64. Comparator 2 Characteristics

    STM32L162VC, STM32L162RC 1. Guaranteed by characterization results. 2. The delay is characterized for 100 mV input step with 10 mV overdrive on the inverting input, the non- inverting input set to the reference. 3. Comparator consumption only. Internal reference voltage not included.
  • Page 104: Lcd Controller

    Electrical characteristics STM32L162VC, STM32L162RC 6.3.22 LCD controller The device embeds a built-in step-up converter to provide a constant LCD reference voltage independently from the V voltage. An external capacitor C must be connected to the pin to decouple this converter.
  • Page 105: Package Information

    STM32L162VC, STM32L162RC Package information In order to meet environmental requirements, ST offers these devices in different grades of ® ® ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com.
  • Page 106: Figure 30. Lqfp100, 14 X 14 Mm, 100-Pin Low-Profile Quad Flat Package

    Package information STM32L162VC, STM32L162RC Table 66. LQPF100, 14 x 14 mm, 100-pin low-profile quad flat package mechanical data (continued) millimeters inches Symbol 0.170 0.220 0.270 0.0067 0.0087 0.0106 0.090 0.200 0.0035 0.0079 15.800 16.000 16.200 0.6220 0.6299 0.6378 13.800 14.000 14.200...
  • Page 107: Figure 31. Lqfp100, 14 X 14 Mm, 100-Pin Low-Profile Quad Flat Package Top View Example

    STM32L162VC, STM32L162RC Marking of engineering samples The following figure gives an example of topside marking orientation versus pin 1 identifier location. Figure 31. LQFP100, 14 x 14 mm, 100-pin low-profile quad flat package top view example 1. Parts marked as “ES”, “E” or accompanied by an Engineering Sample notification letter, are not yet qualified and therefore not yet ready to be used in production and any consequences deriving from such usage will not be at ST charge.
  • Page 108: Lqfp64, 10 X 10 Mm, 64-Pin Low-Profile Quad Flat Package Information

    Package information STM32L162VC, STM32L162RC LQFP64, 10 x 10 mm, 64-pin low-profile quad flat package information Figure 32. LQFP64, 10 x 10 mm, 64-pin low-profile quad flat package outline 1. Drawing is not to scale. Table 67. LQFP64, 10 x 10 mm 64-pin low-profile quad flat package mechanical...
  • Page 109: Figure 33. Lqfp64, 10 X 10 Mm, 64-Pin Low-Profile Quad Flat Package

    STM32L162VC, STM32L162RC Table 67. LQFP64, 10 x 10 mm 64-pin low-profile quad flat package mechanical data (continued) millimeters inches Symbol 7.500 0.2953 0.500 0.0197 0° 3.5° 7° 0° 3.5° 7° 0.450 0.600 0.750 0.0177 0.0236 0.0295 1.000 0.0394 0.080 0.0031 1.
  • Page 110: Figure 34. Lqfp64 10 X 10 Mm, 64-Pin Low-Profile Quad Flat Package Top View Example

    Package information STM32L162VC, STM32L162RC Marking of engineering samples The following figure gives an example of topside marking orientation versus pin 1 identifier location. Figure 34. LQFP64 10 x 10 mm, 64-pin low-profile quad flat package top view example 1. Parts marked as “ES”, “E” or accompanied by an Engineering Sample notification letter, are not yet qualified and therefore not yet ready to be used in production and any consequences deriving from such usage will not be at ST charge.
  • Page 111: Ufbga100, 7 X 7 Mm, 100-Ball Ultra Thin, Fine Pitch Ball Grid Array Package Information

    STM32L162VC, STM32L162RC UFBGA100, 7 x 7 mm, 100-ball ultra thin, fine pitch ball grid array package information Figure 35. UFBGA100, 7 x 7 mm, 0.5 mm pitch package outline 1. Drawing is not to scale. Table 68. UFBGA100, 7 x 7 mm, 0.5 mm pitch package mechanical data...
  • Page 112: Table 69. Ufbga100, 7 X 7 Mm, 0.50 Mm Pitch, Recommended Pcb Design Rules

    Package information STM32L162VC, STM32L162RC Table 68. UFBGA100, 7 x 7 mm, 0.5 mm pitch package mechanical data (continued) millimeters inches Symbol 0.150 0.0059 0.050 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. Figure 36. UFBGA100, 7 x 7 mm, 0.5 mm pitch, package recommended footprint Table 69.
  • Page 113: Figure 37. Ufbga100, 7 X 7 Mm, 0.5 Mm Pitch, Package Top View Example

    STM32L162VC, STM32L162RC Marking of engineering samples The following figure gives an example of topside marking orientation versus ball A1 identifier location. Figure 37. UFBGA100, 7 x 7 mm, 0.5 mm pitch, package top view example 1. Parts marked as “ES”, “E” or accompanied by an Engineering Sample notification letter, are not yet qualified and therefore not yet ready to be used in production and any consequences deriving from such usage will not be at ST charge.
  • Page 114: Thermal Characteristics

    Package information STM32L162VC, STM32L162RC Thermal characteristics The maximum chip-junction temperature, T max, in degrees Celsius, may be calculated using the following equation: max = T max + (P max × Θ Where: • max is the maximum ambient temperature in ° C, •...
  • Page 115: Reference Document

    STM32L162VC, STM32L162RC Figure 39. Thermal resistance suffix 7 7.4.1 Reference document JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air). Available from www.jedec.org. DocID022881 Rev 10 115/123...
  • Page 116: Part Numbering

    Part numbering STM32L162VC, STM32L162RC Part numbering Table 71. STM32L162xC ordering information scheme Example: STM32 L 162 V C D TR Device family STM32 = ARM-based 32-bit microcontroller Product type L = Low-power Device subfamily 162: Devices with LCD Pin count...
  • Page 117: Revision History

    STM32L162VC, STM32L162RC Revision History Table 72. Document revision history Date Revision Changes 04-Apr-2012 Initial release. Added Table 4: Functionalities depending on the working mode (from Run/active down to standby) Table 3: ange depending on dynamic voltage scaling. Updated Section 3.10: ADC (analog-to-digital converter) to add Section 3.10.1: Temperature sensor...
  • Page 118 Revision History STM32L162VC, STM32L162RC Table 72. Document revision history (continued) Date Revision Changes Removed AHB1/AHB2 and corrected typo on APB1/APB2 in Figure 1: Ultra-low-power STM32L162xC block diagram Updated “OP amp” line in Table 4: Functionalities depending on the working mode (from Run/active down to standby)
  • Page 119: Ain

    STM32L162VC, STM32L162RC Table 72. Document revision history (continued) Date Revision Changes Added the UGBGA100 package. Updated I (WU from Standby) unit in Table 23: Typical and maximum current consumptions in Standby mode. Updated Figure 6: Pin loading conditions. Updated Figure 7: Pin input voltage.
  • Page 120 Revision History STM32L162VC, STM32L162RC Table 72. Document revision history (continued) Date Revision Changes Updated Table 67: LQFP64, 10 x 10 mm 64-pin low-profile quad flat package mechanical data Table 68: UFBGA100, 7 x 7 mm, 0.5 mm pitch package mechanical data exchange Min and Typ values inside columns.
  • Page 121 STM32L162VC, STM32L162RC Table 72. Document revision history (continued) Date Revision Changes Updated Table 48: I2C characteristics. Removed minimum values for f Table 56: ADC characteristics. Updated Output impedance values in Table 59: DAC characteristics. Moved Table 61: Temperature sensor calibration values from Section 3.10.1: Temperature sensor...
  • Page 122 Revision History STM32L162VC, STM32L162RC Table 72. Document revision history (continued) Date Revision Changes Updated Table 9: STM32L162xC pin definitions ADC inputs. Updated Table 17: Embedded internal reference voltage temperature coefficient at 100ppm/°C. 20-Aug-2015 and table footnote 3: “guaranteed by design” changed by “guaranteed by characterization results”.
  • Page 123 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders.
  • Page 124 Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: STMicroelectronics STM32L162VCT6 STM32L162VCH6 STM32L162RCT6 STM32L162VCT6D STM32L162VCH6TR STM32L162RCT6TR...

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