STMicroelectronics STM32F042F4 Manual

STMicroelectronics STM32F042F4 Manual

Arm-based 32-bit mcu, up to 32 kb flash, crystal-less usb fs 2.0, can, 9 timers, adc and comm. interfaces, 2.0 - 3.6 v
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®
ARM
-based 32-bit MCU, up to 32 KB Flash, crystal-less USB
FS 2.0, CAN, 9 timers, ADC and comm. interfaces, 2.0 - 3.6 V
Features
®
• Core: ARM
32-bit Cortex
frequency up to 48 MHz
• Memories
– 16 to 32 Kbytes of Flash memory
– 6 Kbytes of SRAM with HW parity
• CRC calculation unit
• Reset and power management
– Digital and I/Os supply: V
– Analog supply: V
– Selected I/Os: V
– Power-on/Power down reset (POR/PDR)
– Programmable voltage detector (PVD)
– Low power modes: Sleep, Stop, Standby
– V
supply for RTC and backup registers
BAT
• Clock management
– 4 to 32 MHz crystal oscillator
– 32 kHz oscillator for RTC with calibration
– Internal 8 MHz RC with x6 PLL option
– Internal 40 kHz RC oscillator
– Internal 48 MHz oscillator with automatic
trimming based on ext. synchronization
• Up to 38 fast I/Os
– All mappable on external interrupt vectors
– Up to 24 I/Os with 5 V tolerant capability
and 8 with independent supply V
• 5-channel DMA controller
• One 12-bit, 1.0 µs ADC (up to 10 channels)
– Conversion range: 0 to 3.6 V
– Separate analog supply: 2.4 V to 3.6 V
• Up to 14 capacitive sensing channels for
touchkey, linear and rotary touch sensors
• Calendar RTC with alarm and periodic wakeup
from Stop/Standby
January 2017
This is information on a product in full production.
®
-M0 CPU,
= 2 V to 3.6 V
DD
= from V
to 3.6 V
DDA
DD
= 1.65 V to 3.6 V
DDIO2
DDIO2
DocID025832 Rev 5
STM32F042x4 STM32F042x6
LQFP48 7x7 mm
LQFP32 7x7 mm
• Nine timers
– One 16-bit advanced-control timer for six
channel PWM output
– One 32-bit and four 16-bit timers, with up to
four IC/OC, OCN, usable for IR control
decoding
– Independent and system watchdog timers
– SysTick timer
• Communication interfaces
– One I
Plus (1 Mbit/s) with 20 mA current sink,
SMBus/PMBus and wakeup
– Two USARTs supporting master
synchronous SPI and modem control, one
with ISO7816 interface, LIN, IrDA, auto
baud rate detection and wakeup feature
– Two SPIs (18 Mbit/s) with 4 to 16
programmable bit frames, one with I
interface multiplexed
– CAN interface
– USB 2.0 full-speed interface, able to run
from internal 48 MHz oscillator and with
BCD and LPM support
• HDMI CEC, wakeup on header reception
• Serial wire debug (SWD)
• 96-bit unique ID
• All packages ECOPACK

Table 1. Device summary

Reference
STM32F042x4
STM32F042x6
-
Datasheet
UFQFPN48 7x7 mm WLCSP36
UFQFPN32 5x5 mm
2.6x2.7 mm
UFQFPN28 4x4 mm
2
C interface supporting Fast Mode
®
2
Part number
STM32F042F4, STM32F042G4,
STM32F042K4, STM32F042T4, STM32F042C4
STM32F042F6, STM32F042G6,
STM32F042K6, STM32F042T6, STM32F042C6
production data
TSSOP20
6.5x4.4 mm
2
S
1/117
www.st.com

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Summary of Contents for STMicroelectronics STM32F042F4

  • Page 1: Table 1. Device Summary

    Table 1. Device summary • Up to 14 capacitive sensing channels for touchkey, linear and rotary touch sensors Reference Part number • Calendar RTC with alarm and periodic wakeup STM32F042F4, STM32F042G4, STM32F042x4 STM32F042K4, STM32F042T4, STM32F042C4 from Stop/Standby STM32F042F6, STM32F042G6, STM32F042x6...
  • Page 2: Table Of Contents

    Contents STM32F042x4 STM32F042x6 Contents Introduction ..........9 Description .
  • Page 3 STM32F042x4 STM32F042x6 Contents 3.15 Universal synchronous/asynchronous receiver/transmitter (USART) . . . 25 3.16 Serial peripheral interface (SPI) / Inter-integrated sound interface (I S) . 26 3.17 High-definition multimedia interface (HDMI) - consumer electronics control (CEC) ........26 3.18 Controller area network (CAN) .
  • Page 4 Contents STM32F042x4 STM32F042x6 6.3.13 I/O current injection characteristics ......71 6.3.14 I/O port characteristics ........72 6.3.15 NRST pin characteristics .
  • Page 5 STM32F042x4 STM32F042x6 List of tables List of tables Table 1. Device summary ............1 Table 2.
  • Page 6 List of tables STM32F042x4 STM32F042x6 Table 48. Electrical sensitivities ........... . . 71 Table 49.
  • Page 7 STM32F042x4 STM32F042x6 List of figures List of figures Figure 1. Block diagram ............12 Figure 2.
  • Page 8 List of figures STM32F042x4 STM32F042x6 Figure 49. Recommended footprint for UFQFPN28 package ......106 Figure 50.
  • Page 9: Introduction

    Introduction This datasheet provides the ordering information and mechanical device characteristics of the STM32F042x4/x6 microcontrollers. This document should be read in conjunction with the STM32F0xxxx reference manual (RM0091). The reference manual is available from the STMicroelectronics website www.st.com. ® ®...
  • Page 10: Description

    Description STM32F042x4 STM32F042x6 Description The STM32F042x4/x6 microcontrollers incorporate the high-performance ® ® Cortex -M0 32-bit RISC core operating at up to 48 MHz frequency, high-speed embedded memories (up to 32 Kbytes of Flash memory and 6 Kbytes of SRAM), and an extensive range of enhanced peripherals and I/Os.
  • Page 11: Table 2. Stm32F042X4/X6 Device Features And Peripheral Counts

    STM32F042x4 STM32F042x6 Description Table 2. STM32F042x4/x6 device features and peripheral counts Peripheral STM32F042Fx STM32F042G STM32F042K STM32F042T STM32F042C Flash memory (Kbyte) SRAM (Kbyte) Advanced 1 (16-bit) control Timers 4 (16-bit) General purpose 1 (32-bit) SPI [I 1 [1] 2 [1] USART Comm.
  • Page 12: Figure 1. Block Diagram

    Description STM32F042x4 STM32F042x6 Figure 1. Block diagram 12/117 DocID025832 Rev 5...
  • Page 13: Functional Overview

    STM32F042x4 STM32F042x6 Functional overview Functional overview shows the general block diagram of the STM32F042x4/x6 devices. Figure 1 ® ® -Cortex -M0 core ® ® The ARM Cortex -M0 is a generation of ARM 32-bit RISC processors for embedded systems. It has been developed to provide a low-cost platform that meets the needs of MCU implementation, with a reduced pin count and low-power consumption, while delivering outstanding computational performance and an advanced system response to interrupts.
  • Page 14: Cyclic Redundancy Check Calculation Unit (Crc)

    Functional overview STM32F042x4 STM32F042x6 Cyclic redundancy check calculation unit (CRC) The CRC (cyclic redundancy check) calculation unit is used to get a CRC code from a 32-bit data word and a CRC-32 (Ethernet) polynomial. Among other applications, CRC-based techniques are used to verify data transmission or storage integrity.
  • Page 15: Voltage Regulator

    STM32F042x4 STM32F042x6 Functional overview threshold. The interrupt service routine can then generate a warning message and/or put the MCU into a safe state. The PVD is enabled by software. 3.5.3 Voltage regulator The regulator has two operating modes and it is always enabled after reset. •...
  • Page 16: Clocks And Startup

    Functional overview STM32F042x4 STM32F042x6 Clocks and startup System clock selection is performed on startup, however the internal RC 8 MHz oscillator is selected as default CPU clock on reset. An external 4-32 MHz clock can be selected, in which case it is monitored for failure. If failure is detected, the system automatically switches back to the internal RC oscillator.
  • Page 17: General-Purpose Inputs/Outputs (Gpios)

    STM32F042x4 STM32F042x6 Functional overview Figure 2. Clock tree General-purpose inputs/outputs (GPIOs) Each of the GPIO pins can be configured by software as output (push-pull or open-drain), as input (with or without pull-up or pull-down) or as peripheral alternate function. Most of the GPIO pins are shared with digital or analog alternate functions.
  • Page 18: Direct Memory Access Controller (Dma)

    Functional overview STM32F042x4 STM32F042x6 The I/O configuration can be locked if needed following a specific sequence in order to avoid spurious writing to the I/Os registers. Direct memory access controller (DMA) The 5-channel general-purpose DMAs manage memory-to-memory, peripheral-to-memory and memory-to-peripheral transfers. The DMA supports circular buffer management, removing the need for user code intervention when the controller reaches the end of the buffer.
  • Page 19: Temperature Sensor

    STM32F042x4 STM32F042x6 Functional overview sensor, voltage reference, VBAT voltage measurement) channels and performs conversions in single-shot or scan modes. In scan mode, automatic conversion is performed on a selected group of analog inputs. The ADC can be served by the DMA controller. An analog watchdog feature allows very precise monitoring of the converted voltage of one, some or all selected channels.
  • Page 20: Vbat

    Functional overview STM32F042x4 STM32F042x6 3.10.3 battery voltage monitoring This embedded hardware feature allows the application to measure the V battery voltage using the internal ADC channel ADC_IN18. As the V voltage may be higher than V and thus outside the ADC input range, the V pin is internally connected to a bridge divider by 2.
  • Page 21: Timers And Watchdogs

    STM32F042x4 STM32F042x6 Functional overview Table 6. No. of capacitive sensing channels available on STM32F042x devices Number of capacitive sensing channels STM32F042Cx STM32F042Kx Analog I/O group STM32F042Tx STM32F042Gx STM32F042Fx LQPF48 LQFP32 WLCSP36 UQFPN28 TSSOP20 UQFPN48 UQFPN32 Number of capacitive sensing channels 3.12 Timers and watchdogs The STM32F042x4/x6 devices include up to five general-purpose timers and an advanced...
  • Page 22: General-Purpose Timers (Tim2, 3, 14, 16, 17)

    Functional overview STM32F042x4 STM32F042x6 can also be seen as a complete general-purpose timer. The four independent channels can be used for: • input capture • output compare • PWM generation (edge or center-aligned modes) • one-pulse mode output If configured as a standard 16-bit timer, it has the same features as the TIMx timer. If configured as the 16-bit PWM generator, it has full modulation capability (0-100%).
  • Page 23: Independent Watchdog (Iwdg)

    STM32F042x4 STM32F042x6 Functional overview TIM16 and TIM17 have a complementary output with dead-time generation and independent DMA request generation. Their counters can be frozen in debug mode. 3.12.3 Independent watchdog (IWDG) The independent watchdog is based on an 8-bit prescaler and 12-bit downcounter with user-defined refresh window.
  • Page 24: Inter-Integrated Circuit Interface (I 2 C)

    Functional overview STM32F042x4 STM32F042x6 The RTC is an independent BCD timer/counter. Its main features are the following: • calendar with subseconds, seconds, minutes, hours (12 or 24 format), week day, date, month, year, in BCD (binary-coded decimal) format • automatic correction for 28, 29 (leap year), 30, and 31 day of the month •...
  • Page 25: Universal Synchronous/Asynchronous Receiver/Transmitter (Usart)

    STM32F042x4 STM32F042x6 Functional overview from the CPU clock, allowing the I2C1 to wake up the MCU from Stop mode on address match. The I2C peripheral can be served by the DMA controller. Table 9. STM32F042x4/x6 I C implementation C features I2C1 7-bit addressing mode 10-bit addressing mode...
  • Page 26: Serial Peripheral Interface (Spi) / Inter-Integrated Sound Interface (I 2 S)

    Functional overview STM32F042x4 STM32F042x6 Table 10. STM32F042x4/x6 USART implementation (continued) USART modes/features USART1 USART2 Modbus communication Auto baud rate detection Driver Enable 1. X = supported. 3.16 Serial peripheral interface (SPI) / Inter-integrated sound interface (I Up to two SPIs are able to communicate up to 18 Mbit/s in slave and master modes in full- duplex and half-duplex communication modes.
  • Page 27: Universal Serial Bus (Usb)

    STM32F042x4 STM32F042x6 Functional overview with 29-bit identifiers. It has three transmit mailboxes, two receive FIFOs with 3 stages and 14 scalable filter banks. 3.19 Universal serial bus (USB) The STM32F042x4/x6 embeds a full-speed USB device peripheral compliant with the USB specification version 2.0.
  • Page 28: Pinouts And Pin Descriptions

    Pinouts and pin descriptions STM32F042x4 STM32F042x6 Pinouts and pin descriptions Figure 3. LQFP48 package pinout Figure 4. UFQFPN48 package pinout 28/117 DocID025832 Rev 5...
  • Page 29: Figure 5. Wlcsp36 Package Pinout

    STM32F042x4 STM32F042x6 Pinouts and pin descriptions Figure 5. WLCSP36 package pinout 1. The above figure shows the package in top view, changing from bottom view in the previous document versions. Figure 6. LQFP32 package pinout DocID025832 Rev 5 29/117...
  • Page 30: Figure 7. Ufqfpn32 Package Pinout

    Pinouts and pin descriptions STM32F042x4 STM32F042x6 Figure 7. UFQFPN32 package pinout Figure 8. UFQFPN28 package 1. Pin pair PA11/12 can be remapped in place of pin pair PA9/10 using the SYSCFG_CFGR1 register. 30/117 DocID025832 Rev 5...
  • Page 31: Table 12. Legend/Abbreviations Used In The Pinout Table

    STM32F042x4 STM32F042x6 Pinouts and pin descriptions Figure 9. TSSOP20 package 1. Pin pair PA11/12 can be remapped in place of pin pair PA9/10 using the SYSCFG_CFGR1 register. Table 12. Legend/abbreviations used in the pinout table Name Abbreviation Definition Unless otherwise specified in brackets below the pin name, the pin function during and Pin name after reset is the same as the actual pin name Supply pin...
  • Page 32: Table 13. Stm32F042X Pin Definitions

    Pinouts and pin descriptions STM32F042x4 STM32F042x6 Table 13. STM32F042x pin definitions Pin numbers Pin functions Pin name (function upon Additional type Alternate function reset) functions VBAT Backup power supply WKUP2, RTC_TAMP1, PC13 RTC_TS, RTC_OUT PC14- OSC32_IN OSC32_IN (PC14) PC15- OSC32_OUT OSC32_OUT (PC15) CRS_ SYNC...
  • Page 33 STM32F042x4 STM32F042x6 Pinouts and pin descriptions Table 13. STM32F042x pin definitions (continued) Pin numbers Pin functions Pin name (function upon Additional type Alternate function reset) functions SPI1_NSS, I2S1_WS, TIM14_CH1, TSC_G2_IO1, ADC_IN4 USART2_CK USB_NOE SPI1_SCK, I2S1_CK, CEC, ADC_IN5 TIM2_CH1_ETR, TSC_G2_IO2 SPI1_MISO, I2S1_MCK, TIM3_CH1, TIM1_BKIN, TIM16_CH1, ADC_IN6...
  • Page 34 Pinouts and pin descriptions STM32F042x4 STM32F042x6 Table 13. STM32F042x pin definitions (continued) Pin numbers Pin functions Pin name (function upon Additional type Alternate function reset) functions SPI2_SCK, PB13 TIM1_CH1N, I2C1_SCL SPI2_MISO, PB14 TIM1_CH2N, I2C1_SDA SPI2_MOSI, WKUP7, PB15 TIM1_CH3N RTC_REFIN USART1_CK, TIM1_CH1, EVENTOUT, MCO, CRS_SYNC...
  • Page 35 STM32F042x4 STM32F042x6 Pinouts and pin descriptions Table 13. STM32F042x pin definitions (continued) Pin numbers Pin functions Pin name (function upon Additional type Alternate function reset) functions SPI1_NSS, I2S1_WS, USART2_RX, PA15 TIM2_CH1_ETR, EVENTOUT, USB_NOE SPI1_SCK, I2S1_CK, TIM2_CH2, TSC_G5_IO1, EVENTOUT SPI1_MISO, I2S1_MCK, TIM17_BKIN, TIM3_CH1, TSC_G5_IO2,...
  • Page 36 Pinouts and pin descriptions STM32F042x4 STM32F042x6 Table 13. STM32F042x pin definitions (continued) Pin numbers Pin functions Pin name (function upon Additional type Alternate function reset) functions SPI2_NSS, I2C1_SDA, IR_OUT, TIM17_CH1, EVENTOUT, CAN_TX Ground Digital power supply 1. PC13, PC14 and PC15 are supplied through the power switch. Since the switch only sinks a limited amount of current (3 mA), the use of GPIOs PC13 to PC15 in output mode is limited: - The speed should not exceed 2 MHz with a maximum load of 30 pF.
  • Page 37: Table 14. Alternate Functions Selected Through Gpioa_Afr Registers For Port A

    Table 14. Alternate functions selected through GPIOA_AFR registers for port A Pin name USART2_CTS TIM2_CH1_ETR TSC_G1_IO1 EVENTOUT USART2_RTS TIM2_CH2 TSC_G1_IO2 USART2_TX TIM2_CH3 TSC_G1_IO3 USART2_RX TIM2_CH4 TSC_G1_IO4 SPI1_NSS, I2S1_WS USART2_CK USB_NOE TSC_G2_IO1 TIM14_CH1 SPI1_SCK, I2S1_CK TIM2_CH1_ETR TSC_G2_IO2 SPI1_MISO, I2S1_MCK TIM3_CH1 TIM1_BKIN TSC_G2_IO3 TIM16_CH1 EVENTOUT...
  • Page 38: Table 15. Alternate Functions Selected Through Gpiob_Afr Registers For Port B

    Table 15. Alternate functions selected through GPIOB_AFR registers for port B Pin name EVENTOUT TIM3_CH3 TIM1_CH2N TSC_G3_IO2 TIM14_CH1 TIM3_CH4 TIM1_CH3N TSC_G3_IO3 TSC_G3_IO4 SPI1_SCK, I2S1_CK EVENTOUT TIM2_CH2 TSC_G5_IO1 SPI1_MISO, I2S1_MCK TIM3_CH1 EVENTOUT TSC_G5_IO2 TIM17_BKIN SPI1_MOSI, I2S1_SD TIM3_CH2 TIM16_BKIN I2C1_SMBA USART1_TX I2C1_SCL TIM16_CH1N TSC_G5_IO3 USART1_RX...
  • Page 39: Memory Mapping

    STM32F042x4 STM32F042x6 Memory mapping Memory mapping To the difference of STM32F042x6 memory map in 10, the two bottom code memory Figure spaces of STM32F042x4 end at 0x0000 3FFF and 0x0800 3FFF, respectively. Figure 10. STM32F042x6 memory map DocID025832 Rev 5 39/117...
  • Page 40: Table 17. Stm32F042X4/X6 Peripheral Register Boundary Addresses

    Memory mapping STM32F042x4 STM32F042x6 Table 17. STM32F042x4/x6 peripheral register boundary addresses Boundary address Size Peripheral 0x4800 1800 - 0x5FFF FFFF ~384 MB Reserved 0x4800 1400 - 0x4800 17FF 1 KB GPIOF 0x4800 0C00 - 0x4800 13FF 2 KB Reserved AHB2 0x4800 0800 - 0x4800 0BFF 1 KB GPIOC...
  • Page 41 STM32F042x4 STM32F042x6 Memory mapping Table 17. STM32F042x4/x6 peripheral register boundary addresses (continued) Boundary address Size Peripheral 0x4000 7C00 - 0x4000 7FFF 1 KB Reserved 0x4000 7800 - 0x4000 7BFF 1 KB 0x4000 7400 - 0x4000 77FF 1 KB Reserved 0x4000 7000 - 0x4000 73FF 1 KB 0x4000 6C00 - 0x4000 6FFF 1 KB...
  • Page 42: Electrical Characteristics

    Electrical characteristics STM32F042x4 STM32F042x6 Electrical characteristics Parameter conditions Unless otherwise specified, all voltages are referenced to V 6.1.1 Minimum and maximum values Unless otherwise specified, the minimum and maximum values are guaranteed in the worst conditions of ambient temperature, supply voltage and frequencies by tests in production on 100% of the devices with an ambient temperature at T = 25 °C and T max (given by...
  • Page 43: Power Supply Scheme

    STM32F042x4 STM32F042x6 Electrical characteristics 6.1.6 Power supply scheme Figure 13. Power supply scheme Each power supply pair (V etc.) must be decoupled with filtering ceramic Caution: capacitors as shown above. These capacitors must be placed as close as possible to, or below, the appropriate pins on the underside of the PCB to ensure the good functionality of the device.
  • Page 44: Current Consumption Measurement

    Electrical characteristics STM32F042x4 STM32F042x6 6.1.7 Current consumption measurement Figure 14. Current consumption measurement scheme 44/117 DocID025832 Rev 5...
  • Page 45: Absolute Maximum Ratings

    STM32F042x4 STM32F042x6 Electrical characteristics Absolute maximum ratings Stresses above the absolute maximum ratings listed in Table 18: Voltage characteristics, may cause Table 19: Current characteristics Table 20: Thermal characteristics permanent damage to the device. These are stress ratings only and functional operation of the device at these conditions is not implied.
  • Page 46 Electrical characteristics STM32F042x4 STM32F042x6 Table 19. Current characteristics Symbol Ratings Max. Unit ΣI Total current into sum of all VDD power lines (source) ΣI Total current out of sum of all VSS ground lines (sink) -120 Maximum current into each VDD power pin (source) VDD(PIN) Maximum current out of each VSS ground pin (sink) -100...
  • Page 47: Operating Conditions

    STM32F042x4 STM32F042x6 Electrical characteristics Operating conditions 6.3.1 General operating conditions Table 21. General operating conditions Symbol Parameter Conditions Unit Internal AHB clock frequency HCLK Internal APB clock frequency PCLK Standard operating voltage Must not be supplied if V I/O supply voltage 1.65 DDIO2 is not present...
  • Page 48: Embedded Reset And Power Control Block Characteristics

    Electrical characteristics STM32F042x4 STM32F042x6 Table 22. Operating conditions at power-up / power-down Symbol Parameter Conditions Unit ∞ rise time rate ∞ fall time rate µs/V ∞ rise time rate VDDA ∞ fall time rate 6.3.3 Embedded reset and power control block characteristics The parameters given in are derived from tests performed under the ambient Table 23...
  • Page 49: Embedded Reference Voltage

    STM32F042x4 STM32F042x6 Electrical characteristics Table 24. Programmable voltage detector characteristics (continued) Symbol Parameter Conditions Unit Rising edge 2.66 2.78 PVD threshold 6 PVD6 Falling edge 2.56 2.68 Rising edge 2.76 2.88 PVD threshold 7 PVD7 Falling edge 2.66 2.78 PVD hysteresis PVDhyst PVD current consumption 0.15...
  • Page 50: Table 26. Typical And Maximum Current Consumption From V

    Electrical characteristics STM32F042x4 STM32F042x6 Typical and maximum current consumption The MCU is placed under the following conditions: • All I/O pins are in analog input mode • All peripherals are disabled except when explicitly mentioned • The Flash memory access time is adjusted to the f frequency: HCLK –...
  • Page 51 STM32F042x4 STM32F042x6 Electrical characteristics Table 26. Typical and maximum current consumption from V supply at V = 3.6 V (continued) All peripherals enabled All peripherals disabled Max @ T Max @ T Conditions Unit HCLK 25 °C 85 °C 105 °C 25 °C 85 °C 105 °C HSI48...
  • Page 52: Table 27. Typical And Maximum Current Consumption From The V

    Electrical characteristics STM32F042x4 STM32F042x6 Table 27. Typical and maximum current consumption from the V supply = 2.4 V = 3.6 V Para- Conditions Symbol Unit Max @ T Max @ T HCLK meter 25 °C 85 °C 105 °C 25 °C 85 °C 105 °C HSI48 48 MHz 48 MHz...
  • Page 53: Table 28. Typical And Maximum Consumption In Stop And Standby Modes

    STM32F042x4 STM32F042x6 Electrical characteristics Table 28. Typical and maximum consumption in Stop and Standby modes Typ @V Conditions 2.0 V 2.4 V 2.7 V 3.0 V 3.3 V 3.6 V 25°C 85°C 105°C Regulator in run mode, all 14.3 14.5 14.6 14.7 14.8...
  • Page 54: Table 29. Typical And Maximum Current Consumption From The

    Electrical characteristics STM32F042x4 STM32F042x6 Table 29. Typical and maximum current consumption from the V supply Typ @ V Symbol Parameter Conditions Unit 25 °C 85 °C 105 °C LSE & RTC ON; “Xtal mode”: lower driving capability; LSEDRV[1:0] = '00' domain µA VBAT...
  • Page 55: Table 30. Typical Current Consumption, Code Executing From Flash Memory, Running From Hse 8 Mhz Crystal

    STM32F042x4 STM32F042x6 Electrical characteristics Table 30. Typical current consumption, code executing from Flash memory, running from HSE 8 MHz crystal Typical consumption in Typical consumption in Run mode Sleep mode Symbol Parameter Unit HCLK Peripherals Peripherals Peripherals Peripherals enabled disabled enabled disabled 48 MHz...
  • Page 56: Table 32. Peripheral Current Consumption

    Electrical characteristics STM32F042x4 STM32F042x6 trigger circuits used to discriminate the input value. Unless this specific configuration is required by the application, this supply current consumption can be avoided by configuring these I/Os in analog mode. This is notably the case of ADC input pins which should be configured as analog inputs.
  • Page 57: Table 31. Switching Output I/O Current Consumption

    STM32F042x4 STM32F042x6 Electrical characteristics Table 31. Switching output I/O current consumption I/O toggling Symbol Parameter Conditions Unit frequency (f 4 MHz 0.07 8 MHz 0.15 = 3.3 V DDIOx 16 MHz 0.31 C =C 24 MHz 0.53 48 MHz 0.92 4 MHz 0.18 8 MHz...
  • Page 58 Electrical characteristics STM32F042x4 STM32F042x6 On-chip peripheral current consumption The current consumption of the on-chip peripherals is given in 32. The MCU is placed Table under the following conditions: • All I/O pins are in analog mode • All peripherals are disabled unless otherwise mentioned •...
  • Page 59 STM32F042x4 STM32F042x6 Electrical characteristics Table 32. Peripheral current consumption (continued) Peripheral Typical consumption at 25 °C Unit APB-Bridge 12.9 DBG (MCU Debug Support) I2C1 SPI1 SPI2 SYSCFG µA/MHz TIM1 15.1 TIM2 16.8 TIM3 11.7 TIM14 TIM16 TIM17 USART1 17.8 USART2 WWDG All APB peripherals 136.7...
  • Page 60: Wakeup Time From Low-Power Mode

    Electrical characteristics STM32F042x4 STM32F042x6 6.3.6 Wakeup time from low-power mode The wakeup times given in are the latency between the event and the execution of Table 33 the first user instruction. The device goes in low-power mode after the WFE (Wait For Event) instruction, in the case of a WFI (Wait For Interruption) instruction, 16 CPU cycles must be added to the following timings due to the interrupt latency in the Cortex M0 architecture.
  • Page 61: Table 35. Low-Speed External User Clock Characteristics

    STM32F042x4 STM32F042x6 Electrical characteristics 1. Guaranteed by design, not tested in production. Figure 15. High-speed external clock source AC timing diagram Low-speed external user clock generated from an external source In bypass mode the LSE oscillator is switched off and the input pin is a standard GPIO. The external clock signal has to respect the I/O characteristics in 6.3.14.
  • Page 62: Table 36. Hse Oscillator Characteristics

    Electrical characteristics STM32F042x4 STM32F042x6 High-speed external clock generated from a crystal/ceramic resonator The high-speed external (HSE) clock can be supplied with a 4 to 32 MHz crystal/ceramic resonator oscillator. All the information given in this paragraph are based on design simulation results obtained with typical external components specified in 36.
  • Page 63: Table 37. Lse Oscillator Characteristics

    STM32F042x4 STM32F042x6 Electrical characteristics Figure 17. Typical application with an 8 MHz crystal 1. R value depends on the crystal characteristics. Low-speed external clock generated from a crystal resonator The low-speed external (LSE) clock can be supplied with a 32.768 kHz crystal resonator oscillator.
  • Page 64: Internal Clock Source Characteristics

    Electrical characteristics STM32F042x4 STM32F042x6 Note: For information on selecting the crystal, refer to the application note AN2867 “Oscillator design guide for ST microcontrollers” available from the ST website www.st.com. Figure 18. Typical application with a 32.768 kHz crystal Note: An external resistor is not required between OSC32_IN and OSC32_OUT and it is forbidden to add one.
  • Page 65: Figure 19. Hsi Oscillator Accuracy Characterization Results For Soldered Parts

    STM32F042x4 STM32F042x6 Electrical characteristics High-speed internal (HSI) RC oscillator Table 38. HSI oscillator characteristics Symbol Parameter Conditions Unit Frequency TRIM HSI user trimming step DuCy Duty cycle (HSI) = -40 to 105°C -2.8 = -10 to 85°C -1.9 = 0 to 85°C -1.9 Accuracy of the HSI oscillator...
  • Page 66: Table 39. Hsi14 Oscillator Characteristics

    Electrical characteristics STM32F042x4 STM32F042x6 High-speed internal 14 MHz (HSI14) RC oscillator (dedicated to ADC) Table 39. HSI14 oscillator characteristics Symbol Parameter Conditions Unit Frequency HSI14 TRIM HSI14 user-trimming step DuCy Duty cycle (HSI14) = –40 to 105 °C –4.2 = –10 to 85 °C –3.2 Accuracy of the HSI14 HSI14...
  • Page 67: Table 40. Hsi48 Oscillator Characteristics

    STM32F042x4 STM32F042x6 Electrical characteristics High-speed internal 48 MHz (HSI48) RC oscillator Table 40. HSI48 oscillator characteristics Symbol Parameter Conditions Unit Frequency HSI48 TRIM HSI48 user-trimming step 0.09 0.14 DuCy Duty cycle (HSI48) = –40 to 105 °C -4.9 = –10 to 85 °C -4.1 Accuracy of the HSI48 HSI48...
  • Page 68: Pll Characteristics

    Electrical characteristics STM32F042x4 STM32F042x6 Low-speed internal (LSI) RC oscillator Table 41. LSI oscillator characteristics Symbol Parameter Unit Frequency LSI oscillator startup time µs su(LSI) LSI oscillator power consumption 0.75 µA DDA(LSI) 1. V = 3.3 V, T = –40 to 105 °C unless otherwise specified. 2.
  • Page 69: Emc Characteristics

    STM32F042x4 STM32F042x6 Electrical characteristics Table 44. Flash memory endurance and data retention Symbol Parameter Conditions Unit Endurance = –40 to +105 °C kcycle 1 kcycle at T = 85 °C Data retention 1 kcycle at T = 105 °C Year 10 kcycle at T = 55 °C...
  • Page 70: Electrical Sensitivity Characteristics

    Electrical characteristics STM32F042x4 STM32F042x6 Software recommendations The software flowchart must include the management of runaway conditions such as: • Corrupted program counter • Unexpected reset • Critical Data corruption (for example control registers) Prequalification trials Most of the common failures (unexpected reset and program counter corruption) can be reproduced by manually forcing a low state on the NRST pin or the Oscillator pins for 1 second.
  • Page 71: I/O Current Injection Characteristics

    STM32F042x4 STM32F042x6 Electrical characteristics Table 47. ESD absolute maximum ratings Maximum Symbol Ratings Conditions Packages Class Unit value Electrostatic discharge voltage = +25 °C, conforming 2000 ESD(HBM) (human body model) to JESD22-A114 Electrostatic discharge voltage = +25 °C, conforming ESD(CDM) (charge device model) to ANSI/ESD STM5.3.1 1.
  • Page 72: I/O Port Characteristics

    Electrical characteristics STM32F042x4 STM32F042x6 Table 49. I/O current injection susceptibility Functional susceptibility Symbol Description Unit Negative Positive injection injection Injected current on PA12 pin Injected current on PA9, PB3, PB13, PF11 pins with induced leakage current on adjacent pins less than 50 µA Injected current on PB0, PB1 and all other FT and FTf pins Injected current on all other TC, TTa and RST pins 6.3.14...
  • Page 73 STM32F042x4 STM32F042x6 Electrical characteristics Table 50. I/O static characteristics (continued) Symbol Parameter Conditions Unit Weak pull-down equivalent = - V kΩ DDIOx resistor I/O pin capacitance 1. Data based on design simulation only. Not tested in production. 2. The leakage could be higher than the maximum value, if negative current is injected on adjacent pins. Refer to Table 49: I/O current injection susceptibility.
  • Page 74: Figure 22. Tc And Tta I/O Input Characteristics

    Electrical characteristics STM32F042x4 STM32F042x6 Figure 22. TC and TTa I/O input characteristics Figure 23. Five volt tolerant (FT and FTf) I/O input characteristics 74/117 DocID025832 Rev 5...
  • Page 75: Table 51. Output Voltage Characteristics

    STM32F042x4 STM32F042x6 Electrical characteristics Output driving current The GPIOs (general purpose input/outputs) can sink or source up to +/-8 mA, and sink or source up to +/- 20 mA (with a relaxed V In the user application, the number of I/O pins which can drive current must be limited to respect the absolute maximum rating specified in Section 6.2:...
  • Page 76: Table 52. I/O Ac Characteristics

    Electrical characteristics STM32F042x4 STM32F042x6 Input/output AC characteristics The definition and values of input/output AC characteristics are given in Figure 24 52, respectively. Unless otherwise specified, the parameters given are derived from Table tests performed under the ambient temperature and supply voltage conditions summarized Table 21: General operating conditions.
  • Page 77: Nrst Pin Characteristics

    STM32F042x4 STM32F042x6 Electrical characteristics (1)(2) Table 52. I/O AC characteristics (continued) OSPEEDRy Symbol Parameter Conditions Unit [1:0] value Maximum frequency max(IO)out Output fall time = 50 pF, V ≥ 2 V f(IO)out DDIOx Output rise time r(IO)out configuration Maximum frequency max(IO)out Output fall time = 50 pF, V...
  • Page 78: 12-Bit Adc Characteristics

    Electrical characteristics STM32F042x4 STM32F042x6 Table 53. NRST pin characteristics (continued) Symbol Parameter Conditions Unit NRST Schmitt trigger voltage hys(NRST) hysteresis Weak pull-up equivalent kΩ resistor NRST input filtered pulse F(NRST) 2.7 < V < 3.6 NRST input not filtered pulse NF(NRST) 2.0 <...
  • Page 79: Table 55. Table

    STM32F042x4 STM32F042x6 Electrical characteristics Table 54. ADC characteristics (continued) Symbol Parameter Conditions Unit = 14 MHz, 12-bit resolution External trigger frequency TRIG 12-bit resolution Conversion voltage range Equation 1 External input impedance kΩ for details Table 55 Sampling switch kΩ resistance Internal sample and hold capacitor...
  • Page 80 Electrical characteristics STM32F042x4 STM32F042x6 Equation 1: R max formula < --------------------------------------------------------------- - R – × × The formula above (Equation 1) is used to determine the maximum external impedance allowed for an error below 1/4 of LSB. Here N = 12 (from 12-bit resolution). Table 55.
  • Page 81: Figure 26. Adc Accuracy Characteristics

    STM32F042x4 STM32F042x6 Electrical characteristics 2. ADC Accuracy vs. Negative Injection Current: Injecting negative current on any of the standard (non-robust) analog input pins should be avoided as this significantly reduces the accuracy of the conversion being performed on another analog input.
  • Page 82: Temperature Sensor Characteristics

    Electrical characteristics STM32F042x4 STM32F042x6 6.3.17 Temperature sensor characteristics Table 57. TS characteristics Symbol Parameter Unit linearity with temperature ± 1 ± 2 °C SENSE Avg_Slope Average slope mV/°C Voltage at 30 °C (± 5 °C) 1.34 1.43 1.52 ADC_IN16 buffer startup time µs START ADC sampling time when reading the...
  • Page 83: Communication Interfaces

    STM32F042x4 STM32F042x6 Electrical characteristics Table 60. IWDG min/max timeout period at 40 kHz (LSI) Min timeout RL[11:0]= Max timeout RL[11:0]= Prescaler divider PR[2:0] bits Unit 0x000 0xFFF 409.6 819.2 1638.4 3276.8 6553.6 /128 13107.2 /256 6 or 7 26214.4 1. These timings are given for a 40 kHz clock but the microcontroller internal RC frequency can vary from 30 to 60 kHz.
  • Page 84: Table 62. I 2 C Analog Filter Characteristics

    Electrical characteristics STM32F042x4 STM32F042x6 Table 62. I C analog filter characteristics Symbol Parameter Unit Maximum width of spikes that are suppressed by the analog filter 1. Guaranteed by design, not tested in production. 2. Spikes with widths below t are filtered. AF(min) 3.
  • Page 85: Figure 28. Spi Timing Diagram - Slave Mode And Cpha = 0

    STM32F042x4 STM32F042x6 Electrical characteristics Figure 28. SPI timing diagram - slave mode and CPHA = 0 Figure 29. SPI timing diagram - slave mode and CPHA = 1 1. Measurement points are done at CMOS levels: 0.3 V and 0.7 V DocID025832 Rev 5 85/117...
  • Page 86: Table 64. I 2 S Characteristics

    Electrical characteristics STM32F042x4 STM32F042x6 Figure 30. SPI timing diagram - master mode 1. Measurement points are done at CMOS levels: 0.3 V and 0.7 V Table 64. I S characteristics Symbol Parameter Conditions Unit Master mode (data: 16 bits, Audio 1.597 1.601 frequency = 48 kHz)
  • Page 87: Figure 31. I 2 S Slave Timing Diagram (Philips Protocol)

    STM32F042x4 STM32F042x6 Electrical characteristics Table 64. I S characteristics (continued) Symbol Parameter Conditions Unit Master receiver su(SD_MR) Data input setup time Slave receiver su(SD_SR) Master receiver h(SD_MR) Data input hold time Slave receiver h(SD_SR) Master transmitter v(SD_MT) Data output valid time Slave transmitter v(SD_ST) Master transmitter...
  • Page 88: Figure 32. I 2 S Master Timing Diagram (Philips Protocol)

    Electrical characteristics STM32F042x4 STM32F042x6 Figure 32. I S master timing diagram (Philips protocol) 1. Data based on characterization results, not tested in production. 2. LSB transmit/receive of the previously transmitted byte. No LSB transmit/receive is sent before the first byte. 88/117 DocID025832 Rev 5...
  • Page 89: Table 65. Usb Electrical Characteristics

    STM32F042x4 STM32F042x6 Electrical characteristics USB characteristics The STM32F042x4/x6 USB interface is fully compliant with the USB specification version 2.0 and is USB-IF certified (for Full-speed device operation). Table 65. USB electrical characteristics Symbol Parameter Conditions Min. Max. Unit USB transceiver operating DDIO2 voltage USB transceiver startup time...
  • Page 90: Package Information

    Package information STM32F042x4 STM32F042x6 Package information In order to meet environmental requirements, ST offers these devices in different grades of ® ® ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ®...
  • Page 91: Table 66. Lqfp48 Package Mechanical Data

    STM32F042x4 STM32F042x6 Package information Table 66. LQFP48 package mechanical data millimeters inches Symbol 1.600 0.0630 0.050 0.150 0.0020 0.0059 1.350 1.400 1.450 0.0531 0.0551 0.0571 0.170 0.220 0.270 0.0067 0.0087 0.0106 0.090 0.200 0.0035 0.0079 8.800 9.000 9.200 0.3465 0.3543 0.3622 6.800 7.000...
  • Page 92: Figure 35. Lqfp48 Package Marking Example

    Package information STM32F042x4 STM32F042x6 Device marking The following figure gives an example of topside marking orientation versus pin 1 identifier location. Other optional marking or inset/upset marks, which identify the parts throughout supply chain operations, are not indicated below. Figure 35. LQFP48 package marking example 1.
  • Page 93: Ufqfpn48 Package Information

    STM32F042x4 STM32F042x6 Package information UFQFPN48 package information UFQFPN48 is a 48-lead, 7x7 mm, 0.5 mm pitch, ultra-thin fine-pitch quad flat package. Figure 36. UFQFPN48 package outline 1. Drawing is not to scale. 2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life. 3.
  • Page 94: Table 67. Ufqfpn48 Package Mechanical Data

    Package information STM32F042x4 STM32F042x6 Table 67. UFQFPN48 package mechanical data millimeters inches Symbol 0.500 0.550 0.600 0.0197 0.0217 0.0236 0.000 0.020 0.050 0.0000 0.0008 0.0020 6.900 7.000 7.100 0.2717 0.2756 0.2795 6.900 7.000 7.100 0.2717 0.2756 0.2795 5.500 5.600 5.700 0.2165 0.2205 0.2244...
  • Page 95: Figure 38. Ufqfpn48 Package Marking Example

    STM32F042x4 STM32F042x6 Package information Device marking The following figure gives an example of topside marking orientation versus pin 1 identifier location. Other optional marking or inset/upset marks, which identify the parts throughout supply chain operations, are not indicated below. Figure 38. UFQFPN48 package marking example 1.
  • Page 96: Wlcsp36 Package Information

    Package information STM32F042x4 STM32F042x6 WLCSP36 package information WLCSP36 is a 36-ball, 2.605 x 2.703 mm, 0.4 mm pitch wafer-level chip-scale package. Figure 39. WLCSP36 package outline 1. Drawing is not to scale. Table 68. WLCSP36 package mechanical data millimeters inches Symbol 0.525 0.555...
  • Page 97: Table 69. Wlcsp36 Recommended Pcb Design Rules

    STM32F042x4 STM32F042x6 Package information Table 68. WLCSP36 package mechanical data (continued) millimeters inches Symbol 0.3025 0.0119 0.3515 0.0138 0.100 0.0039 0.100 0.0039 0.100 0.0039 0.050 0.0020 0.050 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. 2.
  • Page 98: Figure 41. Wlcsp36 Package Marking Example

    Package information STM32F042x4 STM32F042x6 Device marking The following figure gives an example of topside marking orientation versus ball A1 identifier location. Other optional marking or inset/upset marks, which identify the parts throughout supply chain operations, are not indicated below. Figure 41. WLCSP36 package marking example 1.
  • Page 99: Lqfp32 Package Information

    STM32F042x4 STM32F042x6 Package information LQFP32 package information LQFP32 is a 32-pin, 7 x 7 mm low-profile quad flat package. Figure 42. LQFP32 package outline 1. Drawing is not to scale. DocID025832 Rev 5 99/117...
  • Page 100: Table 70. Lqfp32 Package Mechanical Data

    Package information STM32F042x4 STM32F042x6 Table 70. LQFP32 package mechanical data millimeters inches Symbol 1.600 0.0630 0.050 0.150 0.0020 0.0059 1.350 1.400 1.450 0.0531 0.0551 0.0571 0.300 0.370 0.450 0.0118 0.0146 0.0177 0.090 0.200 0.0035 0.0079 8.800 9.000 9.200 0.3465 0.3543 0.3622 6.800 7.000...
  • Page 101: Ufqfpn32 Package Information

    STM32F042x4 STM32F042x6 Package information Device marking The following figure gives an example of topside marking orientation versus pin 1 identifier location. Other optional marking or inset/upset marks, which identify the parts throughout supply chain operations, are not indicated below. Figure 44. LQFP32 package marking example 1.
  • Page 102: Figure 45. Ufqfpn32 Package Outline

    Package information STM32F042x4 STM32F042x6 Figure 45. UFQFPN32 package outline 1. Drawing is not to scale. 2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life. 3. There is an exposed die pad on the underside of the UFQFPN package. This pad is used for the device ground and must be connected.
  • Page 103: Table 71. Ufqfpn32 Package Mechanical Data

    STM32F042x4 STM32F042x6 Package information Table 71. UFQFPN32 package mechanical data millimeters inches Symbol 0.500 0.550 0.600 0.0197 0.0217 0.0236 0.000 0.020 0.050 0.0000 0.0008 0.0020 0.152 0.0060 0.180 0.230 0.280 0.0071 0.0091 0.0110 4.900 5.000 5.100 0.1929 0.1969 0.2008 3.400 3.500 3.600 0.1339...
  • Page 104: Figure 47. Ufqfpn32 Package Marking Example

    Package information STM32F042x4 STM32F042x6 Device marking The following figure gives an example of topside marking orientation versus pin 1 identifier location. Other optional marking or inset/upset marks, which identify the parts throughout supply chain operations, are not indicated below. Figure 47. UFQFPN32 package marking example 1.
  • Page 105: Ufqfpn28 Package Information

    STM32F042x4 STM32F042x6 Package information UFQFPN28 package information UFQFPN28 is a 28-lead, 4x4 mm, 0.5 mm pitch, ultra-thin fine-pitch quad flat package. Figure 48. UFQFPN28 package outline 1. Drawing is not to scale. Table 72. UFQFPN28 package mechanical data millimeters inches Symbol 0.500 0.550...
  • Page 106: Figure 49. Recommended Footprint For Ufqfpn28 Package

    Package information STM32F042x4 STM32F042x6 1. Values in inches are converted from mm and rounded to 4 decimal digits. Figure 49. Recommended footprint for UFQFPN28 package 1. Dimensions are expressed in millimeters. 106/117 DocID025832 Rev 5...
  • Page 107: Figure 50. Ufqfpn28 Package Marking Example

    STM32F042x4 STM32F042x6 Package information Device marking The following figure gives an example of topside marking orientation versus pin 1 identifier location. Other optional marking or inset/upset marks, which identify the parts throughout supply chain operations, are not indicated below. Figure 50. UFQFPN28 package marking example 1.
  • Page 108: Tssop20 Package Information

    Package information STM32F042x4 STM32F042x6 TSSOP20 package information TSSOP20 is a 20-lead thin shrink small-outline, 6.5 x 4.4 mm, 0.65 mm pitch, package. Figure 51.TSSOP20 package outline 1. Drawing is not to scale. Table 73. TSSOP20 package mechanical data millimeters inches Symbol Min.
  • Page 109: Figure 52. Recommended Footprint For Tssop20 Package

    STM32F042x4 STM32F042x6 Package information Table 73. TSSOP20 package mechanical data (continued) millimeters inches Symbol Min. Typ. Max. Min. Typ. Max. 1.000 0.0394 0° 8° 0° 8° 0.100 0.0039 1. Values in inches are converted from mm and rounded to four decimal digits. 2.
  • Page 110: Figure 53. Tssop20 Package Marking Example

    Package information STM32F042x4 STM32F042x6 Device marking The following figure gives an example of topside marking orientation versus pin 1 identifier location. Other optional marking or inset/upset marks, which identify the parts throughout supply chain operations, are not indicated below. Figure 53. TSSOP20 package marking example 1.
  • Page 111: Thermal Characteristics

    STM32F042x4 STM32F042x6 Package information Thermal characteristics The maximum chip junction temperature (T max) must never exceed the values given in Table 21: General operating conditions. The maximum chip-junction temperature, T max, in degrees Celsius, may be calculated using the following equation: max = T max + (P max x Θ...
  • Page 112 Package information STM32F042x4 STM32F042x6 Each temperature range suffix corresponds to a specific guaranteed ambient temperature at maximum dissipation and, to a specific maximum junction temperature. As applications do not commonly use the STM32F042x4/x6 at maximum dissipation, it is useful to calculate the exact power consumption and junction temperature to determine which temperature range will be best suited to the application.
  • Page 113: Ordering Information

    STM32F042x4 STM32F042x6 Ordering information Ordering information For a list of available options (memory, package, and so on) or for further information on any aspect of this device, please contact your nearest ST sales office. Table 75. Ordering information scheme STM32 F Example: Device family STM32 = ARM-based 32-bit microcontroller...
  • Page 114: Revision History

    Revision history STM32F042x4 STM32F042x6 Revision history Table 76. Document revision history Date Revision Changes 25-Feb-2014 Initial release. Added the sample engineering sections for all the packages in the chapter Package information: Updated tables: – STM32F042x4/x6 USART implementation: added one table footnote.
  • Page 115 STM32F042x4 STM32F042x6 Revision history Table 76. Document revision history (continued) Date Revision Changes – Table 9: STM32F042x4/x6 I C implementation - adding 20 mA Updates in Section 4: Pinouts and pin descriptions – Table 12: Legend/abbreviations used in the pinout table - removing “I”...
  • Page 116 Revision history STM32F042x4 STM32F042x6 Table 76. Document revision history (continued) Date Revision Changes Section 3: Functional overview: – modified Figure 2: Clock tree Section 4: Pinouts and pin descriptions: – Package pinout figures updated (look and feel) – Figure 5: WLCSP36 package pinout- now presented in top view –...
  • Page 117 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders.
  • Page 118 Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: STMicroelectronics STM32F042K4T6 STM32F042G6U7 STM32F042C4U6...

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