Operating Conditions; General Operating Conditions; Table 12. Thermal Characteristics; Table 13. General Operating Conditions - STMicroelectronics STM32L151CB Manual

STM32L151x6/8/B, STM32L152x6/8/B
Symbol
T
STG
T
6.3

Operating conditions

6.3.1

General operating conditions

Symbol
f Internal AHB clock frequency
HCLK
f Internal APB1 clock frequency
PCLK1
f Internal APB2 clock frequency
PCLK2
V Standard operating voltage
DD
Analog operating voltage
(ADC and DAC not used)
(1)
V
DDA
Analog operating voltage
(ADC or DAC used)
Input voltage on FT pins
V
IN
Input voltage on BOOT0 pin
Input voltage on any other pin
Power dissipation at
P
D
T = 85 °C
A
T Temperature range
A
T Junction temperature range
J
1. When the ADC is used, refer to
2. It is recommended to power V
V can be tolerated during power-up and operation.
DDA
3. To sustain a voltage higher than V
4. If T is lower, higher P
A D
on page 51).
5. In low power dissipation state, T
Thermal characteristics on page

Table 12. Thermal characteristics

Storage temperature range
Maximum junction temperature
J

Table 13. General operating conditions

Parameter
(3)
(4)
Table 54: ADC characteristics.
and V from the same source. A maximum difference of 300 mV between V
DD DDA
+0.3 V, the internal pull-up/pull-down resistors must be disabled.
DD
values are allowed as long as T
can be extended to this range as long as T
A
51).
DocID17659 Rev 10
Ratings
Conditions
-
-
-
BOR detector disabled
BOR detector enabled,
at power on
BOR detector disabled, after
power on
Must be the same voltage as
(2)
V
DD
2.0 V ≤V ≤ 3.6 V
DD
1.65 V ≤ V ≤ 2.0 V
DD
BGA100 package
Maximum power dissipation
(5)
Low power dissipation
-40 °C ≤ T ≤ 105°C
A
does not exceed T max (see
J J
does not exceed T
J
Electrical characteristics
Value
–65 to +150
150
Min Max
0 32
0 32
0 32
1.65 3.6
1.8 3.6
1.65 3.6
1.65 3.6
1.8 3.6
–0.3 5.5
–0.3 5.25
0 5.5
–0.3 V +0.3
DD
- 339
–40 85
–40 105
–40 105
DD
Table 12: Thermal characteristics
max (see Table 12:
J
Unit
°C
°C
Unit
MHz
V
V
V
mW
°C
°C
and
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