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Table 25-1. Surface Mounting Type Soldering Conditions (3/3)
µ
(5)
PD789488GC-×××-8BT-A: 80-pin plastic QFP (14x14)
µ
PD78F9488GC-8BT-A:
µ
PD789489GC-×××-8BT-A: 80-pin plastic QFP (14x14)
µ
PD78F9489GC-8BT-A:
µ
PD789488GK-×××-9EU-A: 80-pin plastic TQFP (fine pitch) (12x12)
µ
PD78F9488GK-9EU-A:
µ
PD789489GK-×××-9EU-A: 80-pin plastic TQFP (fine pitch) (12x12)
µ
PD78F9489GK-9EU-A:
Soldering Method
Infrared reflow
Wave soldering
Partial heating
Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
Remarks 1. Products that have the part numbers suffixed by "-A" are lead-free products.
2. For soldering methods and conditions other than those recommended above, contact an NEC
Electronics sales representative.
368
CHAPTER 25 RECOMMENDED SOLDERING CONDITIONS
80-pin plastic QFP (14x14)
80-pin plastic QFP (14x14)
80-pin plastic TQFP (fine pitch) (12x12)
80-pin plastic TQFP (fine pitch) (12x12)
Soldering Conditions
Package peak temperature: 260°C, Time: 60 seconds max. (at 220°C
or higher), Count: Three times or less, Exposure limit: 7 days
that, prebake at 125°C for 20 to 72 hours)
When the pin pitch of the package is 0.65 mm or more, wave soldering
can also be performed.
For details, contact an NEC Electronics sales representative.
Pin temperature: 350°C max., Time: 3 seconds max. (per pin row)
User's Manual U15331EJ4V1UD
Recommended Condition
Symbol
IR60-207-3
Note
(after
−
−
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