Chapter 25 Recommended Soldering Conditions; Surface Mounting Type Soldering Conditions - NEC PD789488 User Manual

Pd789489 subseries 8-bit single-chip microcontrollers
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CHAPTER 25 RECOMMENDED SOLDERING CONDITIONS

µ
The
PD789489 subseries should be soldered and mounted under the following recommended conditions.
For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales
representative.
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
µ
(1)
PD789488GC-×××-8BT: 80-pin plastic QFP (14x14)
µ
PD78F9488GC-8BT:
µ
PD789489GC-×××-8BT: 80-pin plastic QFP (14x14)
Soldering Method
Infrared reflow
Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or higher),
Count: Twice or less
VPS
Package peak temperature: 215°C, Time: 40 seconds max. (at 200°C or higher),
Count: Twice or less
Wave soldering
Solder bath temperature: 260°C max., Time: 10 seconds max., Count: Once,
Preheating temperature: 120°C max. (package surface temperature)
Partial heating
Pin temperature: 350°C max., Time: 3 seconds max. (per pin row)
Caution Do not use different soldering methods together (except for partial heating).
µ
(2)
PD789488GK-×××-9EU: 80-pin plastic TQFP (fine pitch) (12x12)
µ
PD78F9488GK-9EU:
µ
PD789489GK-×××-9EU: 80-pin plastic TQFP (fine pitch) (12x12)
Soldering Method
Interface reflow
Package peak temperature: 235°C, Time:30 seconds max. (at 210°C or higher),
Count: Twice or less, Exposure limit: 7 days
10 hours)
VPS
Package peak temperature: 215°C, Time:40 seconds max. (at 200°C or higher),
Count: Twice or less, Exposure limit: 7 days
10 hours)
Partial heating
Pin temperature: 350°C max., Time: 3 seconds max. (per pin row)
Note After opening the dry peak, store it at 25°C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
366
Table 25-1. Surface Mounting Type Soldering Conditions (1/3)
80-pin plastic QFP (14x14)
Soldering Conditions
80-pin plastic TQFP (fine pitch) (12x12)
Soldering Conditions
User's Manual U15331EJ4V1UD
Note
(after that, prebake at 125°C for
Note
(after that, prebake at 125°C for
Recommended
Condition Symbol
IR35-00-2
VP15-00-2
WS60-00-1
Recommended
Condition Symbol
IR35-107-2
VP15-107-2

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