1.4
ERTEC 400 Package
The ERTEC 400 is supplied in an FBGA package with 304 pins. The distance between the pins is 0.8 mm. The
package dimensions are 19 mm x 19 mm.
Figure 2: ERTEC 400 Package Description
The following documents contain the soldering instructions for the ERTEC 400:
/10/
Soldering instructions for lead-based block.
/11/
Soldering instructions for lead-free block.
/12/
Code description for soldering.
When working with modules, always take precautionary measures against electrostatic charge
(ESD – Electrostatic Sensitive Devices).
Copyright © Siemens AG 2010. All rights reserved.
Technical data subject to change
Page 11
ERTEC 400 Manual
Version 1.2.2