Outline Dimensions; Surface Mount Design; Top View; Bottom View - Analog Devices TigerSHARC ADSP-TS201S Specifications

OUTLINE DIMENSIONS

The ADSP-TS201S processor is available in a 25 mm × 25 mm,
576-ball metric thermally enhanced ball grid array (BGA_ED)
package with 24 rows of balls (BP-576).
1.25
1.00
0.75
3.10
2.94
2.78
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS.
2. THE ACTUAL POSITION OF THE BALL GR ID IS W ITHIN 0.25 m m OF ITS
IDEAL POSITION RELATIVE TO THE PACKAGE EDGES.
3. CENTER DIMENSIONS ARE N OMINAL.
4. THIS PACKAGE C ONFORMS TO JEDEC MS-034 SPECIFICATION.

SURFACE MOUNT DESIGN

Table 36 is provided as an aid to PCB design. For industry-
standard design recommendations, refer to IPC-7351, Generic
Requirements for Surface Mount Design and Land Pattern
Standard.
Table 36. BGA Data for Use with Surface Mount Design
Package Ball Attach Type
576-Ball BGA_ED Nonsolder Mask Defined (NSMD)
(BP-576)
25.20
25.00
24.80
A1 BALL
INDICATOR
1.25
1.00
0.75

TOP VIEW

Figure 47. 576-Ball BGA_ED (BP-576)
Rev. C | Page 45 of 48 | December 2006
24 22
23
1.00
BSC
23.00
BSC
25.20
SQ
25.00
24.80
1.00
BSC
(BALL
PITCH)
1.00
BSC
DETAIL A
0.97 BSC
SEATING PLANE
Solder Mask Opening
0.69 mm diameter
ADSP-TS201S
20 18 16 14 12 10
8 6 4 2
21 19 17 13 11
15 9 7 5 3 1

BOTTOM VIEW

1.60 MAX
0.60
0.50
0.40
0.75
0.65
0.20 MAX
0.55
(BALL
DIAMETER)
DETAIL A
Ball Pad Size
0.56 mm diameter
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD