Environmental Conditions; Thermal Characteristics - Analog Devices TigerSHARC ADSP-TS201S Specifications

ADSP-TS201S

ENVIRONMENTAL CONDITIONS

The ADSP-TS201S processor is rated for performance under
T environmental conditions specified in the
CASE
ditions on Page 21.

Thermal Characteristics

The ADSP-TS201S processor is packaged in a 25 mm × 25 mm,
thermally enhanced ball grid array (BGA_ED). The
ADSP-TS201S processor is specified for a case temperature
(T ). To ensure that the T
CASE
exceeded, a heat sink and/or an air flow source may be required.
Table 34 shows the thermal characteristics of the 25 mm ×
25 mm BGA_ED package. All parameters are based on a
JESD51-9 four-layer 2s2p board. All data are based on 3 W
power dissipation.
Table 34. Thermal Characteristics for 25 mm × 25 mm
Package
Parameter Condition
θ
1
Airflow = 0 m/s
JA
Airflow = 1 m/s
Airflow = 2 m/s
Airflow = 3 m/s
θ
3
—
JB
θ
4
—
JC
θ
1
measured per JEDEC standard JESD51-6.
JA
θ
2
= 12.9°C/W for 0 m/s is for vertically mounted boards. For horizontally
JA
mounted boards, use 17.0°C/W for 0 m/s.
θ
3
measured per JEDEC standard JESD51-9.
JB
θ
4
measured by cold plate test method (no approved JEDEC standard).
JC
Operating Con-
data sheet specification is not
CASE
Typical Unit
2
12.9 °C/W
10.2 °C/W
9.0 °C/W
8.0 °C/W
7.7 °C/W
0.7 °C/W
Rev. C | Page 40 of 48 | December 2006