Xilinx MIcroBlaze Development Spartan-3E 1600E Kit User Manual page 105

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MicroBlaze Development Kit Spartan-3E 1600 Edition User Guide
UG257 (v1.1) December 5, 2007
Density migration between smaller- and larger-density SPI Flash PROMs. Not all
SPI Flash densities are available in all packages. The SPI Flash migration strategy
follows nicely with the pinout migration provided by Xilinx FPGAs.
Consistent configuration PROM layout when migrating between FPGA densities.
The Spartan-3E FPGA's FG320 package footprint supports the XC3S500E, the
XC3S1200E, and the XC3S1600E FPGA devices without modification. The SPI Flash
multi-package layout allows comparable flexibility in the associated configuration
PROM. Ship the optimally-sized SPI Flash memory for the FPGA mounted on the
board.
Supply security. If a certain SPI Flash density is not available in the desired package,
switch to a different package style or to a different density to secure availability.
Pin 1:
8-pin SOIC
8-lead MLP
S
Q
W
GND
Figure 12-19: Multi-Package Layout for the STMicroelectronics M25Pxx Family
(Do not connect)
(Do not connect)
Additional Design Details
Pin 1:
16-pin SOIC
VCC
HOLD
C
D
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