Figure 7-22. Third Tape Installation; Figure 7-23. Measuring Resistance Between Thermocouple And Ihs - Intel CELERON PROCESSOR E3000 - THERMAL AND MECHANICAL DESIGN Design Manual
Thermal and mechanical design guidelines
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Also See for CELERON PROCESSOR E3000 - THERMAL AND MECHANICAL DESIGN:
- Datasheet (100 pages) ,
- Design manual (126 pages)
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Case Temperature Reference Metrology
Figure 7-22. Third Tape Installation
12. Place a 3
Figure 7-22. This tape will create a solder dam to prevent solder from flowing into
the larger IHS groove section during the melting process.
13. Measure resistance from thermocouple end wires (hold both wires to a DMM
probe) to the IHS surface. This should be the same value as measured during the
thermocouple conditioning Section D.5.1.step 3 (Figure 7-23).
Figure 7-23. Measuring Resistance between Thermocouple and IHS
Thermal and Mechanical Design Guidelines
rd
piece of tape at the end of the step in the groove as shown in
93
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