Figure 40. Third Tape Installation; Figure 41. Measuring Resistance Between Thermocouple And Ihs - Intel Q9450 - Core 2 Quad Quad-Core Processor Design Manual

Figure 40. Third Tape Installation

12. Place a 3
Figure 40. This tape will create a solder dam to prevent solder from flowing into
the larger IHS groove section during the melting process.
13. Measure resistance from thermocouple end wires (hold both wires to a DMM
probe) to the IHS surface. This should be the same value as measured during the
thermocouple conditioning step D.5.1.step 3 (see Figure 41)

Figure 41. Measuring Resistance between Thermocouple and IHS

88
rd
piece of tape at the end of the step in the groove as shown in
Case Temperature Reference Metrology
Thermal and Mechanical Design Guidelines