Table of Contents
Advertisement
Case Temperature Reference Metrology
Figure 7-22. Third Tape Installation
12. Place a 3
Figure 7-22. This tape will create a solder dam to prevent solder from flowing into
the larger IHS groove section during the melting process.
13. Measure resistance from thermocouple end wires (hold both wires to a DMM
probe) to the IHS surface. This should be the same value as measured during the
thermocouple conditioning Section D.5.1.step 3 (Figure 7-23).
Figure 7-23. Measuring Resistance between Thermocouple and IHS
Thermal and Mechanical Design Guidelines
rd
piece of tape at the end of the step in the groove as shown in
93
Advertisement
Table of Contents
Need help?
Do you have a question about the E6700 - Core 2 Duo Dual-Core Processor and is the answer not in the manual?
Questions and answers