Packaging Specifications - Quectel RG520N-AT Hardware Design

Table 54: Recommended Thermal Profile Parameters
Factor
Soak Zone
Ramp-to-soak slope
Soak time (between A and B: 150 ° C and 200 ° C)
Reflow Zone
Ramp-up slope
Reflow time (D: over 217° C)
Max. temperature
Cool-down slope
Reflow Cycle
Max. reflow cycle
NOTE
1. The above profile parameter requirements are for the measured temperature of the solder joints.
Both the hottest and coldest spots of solder joints on the PCB should meet the above requirements.
2. If a conformal coating is necessary for the module, do NOT use any coating material that may
chemically react with the PCB or shielding cover, and prevent the coating material from flowing into
the module.
3. Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the
module.
4. Due to the complexity of the SMT process, contact Quectel Technical Support in advance for any
situation that you are not sure about, or any process (e.g. selective soldering, ultrasonic soldering)
that is not mentioned in document [6].

8.3. Packaging Specifications

This chapter describes only the key parameters and process of packaging. All figures below are for
reference only. The appearance and structure of the packaging materials are subject to the actual
delivery.
The module adopts carrier tape packaging and details are as follow:
RG520N-AT_Hardware_Design
Recommended Value
0–3 ° C/s
70–120 s
0–3 ° C/s
40–70 s
235–246 ° C
-3–0 ° C/s
1
5G Module Series
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