6.6.
6.7.
Thermal Dissipation .............................................................................................................. 87
7
Mechanical Information .................................................................................................................... 89
7.1.
Mechanical Dimensions ....................................................................................................... 89
7.2.
Recommended Footprint ...................................................................................................... 91
7.3.
Top and Bottom Views .......................................................................................................... 92
8
8.1.
Storage Conditions ............................................................................................................... 93
8.2.
8.3.
Packaging Specifications ..................................................................................................... 95
8.3.1.
Carrier Tape ................................................................................................................... 96
8.3.2.
Plastic Reel ................................................................................................................... 96
8.3.3.
Mounting Direction ........................................................................................................ 97
8.3.4.
Packaging Process ....................................................................................................... 98
9
Appendix A References .................................................................................................................... 99
RG520N-AT_Hardware_Design
5G Module Series
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