Packaging Specifications; Carrier Tape - Quectel BG95 A-GL Series Hardware Design

Table 60: Recommended Thermal Profile Parameters
Factor
Soak Zone
Max slope
Soak time (between A and B: 150 °C and 200 °C)
Reflow Zone
Max slope
Reflow time (D: over 217 °C)
Max temperature
Cooling down slope
Reflow Cycle
Max reflow cycle
NOTE
1. If the module requires conformal coating, DO NOT use any coating material that may chemically
react with the PCB or shielding cover, and prevent the coating material from flowing into the module.
2. Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the
module.
3. Due to the SMT process complexity, please contact Quectel Technical Support in advance regarding
any situation that you are not sure about, or any process (e.g., selective soldering, ultrasonic
soldering) that is not mentioned in document [6].

9.3. Packaging Specifications

The module is delivered in a tape carrier packaging and details are as follows:

9.3.1. Carrier Tape

Dimension details:
BG95xA-GL_Hardware_Design
LPWA Module Series
Recommendation
1–3 °C/s
70–120 s
1–3 °C/s
40–70 s
235–246 °C
-1.5 to 3 °C/s
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