Packaging Specifications; Blister Tray - Quectel EM160R-GL Hardware Design

LTE-A Module Series

6.5. Packaging Specifications

This chapter describes only the key parameters and process of packaging. All figures below are for
reference only. The appearance and structure of the packaging materials are subject to the actual
delivery.
The module adopts blister tray packaging and details are as follow:

6.5.1. Blister Tray

Dimension details are as follow:
Figure 32: Blister Tray Dimension Drawing
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