3.7.1 PCU REMOVAL..............................................................................3-18
3.7.3 OPC DRUM ....................................................................................3-20
3.7.6 DEVELOPER..................................................................................3-23
3.8 TRANSFER UNIT....................................................................................3-28
3.9 FUSING/EXIT ..........................................................................................3-30
3.9.1 FUSING UNIT.................................................................................3-30
3.9.2 THERMISTORS..............................................................................3-30
3.9.3 THERMOSTATS.............................................................................3-31
3.10 PAPER FEED........................................................................................3-37
Upper Relay Sensor............................................................................3-46
Lower Relay Sensor............................................................................3-46
3.11.2 NVRAM.........................................................................................3-49
3.11.3 SBCU BOARD ..............................................................................3-50
3.11.4 POWER PACK .............................................................................3-51
3.11.5 MAIN MOTOR ..............................................................................3-52
3.11.6 PSU ..............................................................................................3-53
3.11.7 IPU................................................................................................3-54
3.11.8 HDD..............................................................................................3-55
iii