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23 PACKAGE
SQFN5-32PIN (P-VQFN032-0505-0.50)
Top View
Bottom View
0.35
/0.45
min
* The potential of the EXPOSED DIE PAD is the same as that of the substrate potential (V
back of the IC.
23-2
5
INDEX
3.0
/3.2
min
9
8
C0.3
1
32
max
Figure 23.2 SQFN5-32PIN Package Dimensions
Seiko Epson Corporation
max
16
17
24
EXPOSED DIE PAD
25
0.25
0.5
S1C17W03/W04 TECHNICAL MANUAL
(Unit: mm)
) on the
SS
(Rev. 1.2)
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