Electrostatic Discharge; Thermal Consideration - Quectel EC25-AUX Hardware Design

LTE-FDD B28 (10MHz) -98.0dBm
LTE-TDD B40 (10MHz) -97.5dBm
NOTE
1)
SIMO is a smart antenna technology that uses a single antenna at the transmitter side and two
antennas at the receiver side, which can improve RX performance.

6.7. Electrostatic Discharge

The module is not protected against electrostatics discharge (ESD) in general. Consequently, it is subject
to ESD handling precautions that typically apply to ESD sensitive components. Proper ESD handling and
packaging procedures must be applied throughout the processing, handling and operation of any
application that incorporates the module.
The following table shows the module's electrostatics discharge characteristics.
Table 63: Electrostatics Discharge Characteristics (25ºC, 45% Relative Humidity)
Tested Interfaces
VBAT, GND
All Antenna Interfaces
Other Interfaces

6.8. Thermal Consideration

In order to achieve better performance of the module, it is recommended to comply with the following
principles for thermal consideration:
 On customers' PCB design, please keep placement of the module away from heating sources,
especially high power components such as ARM processor, audio power amplifier, power supply,
etc.
 Do not place components on the opposite side of the PCB area where the module is mounted, in
order to facilitate adding of heatsink when necessary.
EC25_Hardware_Design
-98.7dBm
-98.2dBm
Contact Discharge
±5
±4
±0.5
LTE Standard Module Series
EC25 Hardware Design
-101.5dBm
-101.2dBm
Air Discharge
±10
±8
±1
-94.8dBm
-96.3dBm
Unit
kV
kV
kV
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