Quectel EC200T Series Hardware Design
  1. Manuals
  2. Brands
  3. Quectel Manuals
  4. Control Unit
  5. EC200T Series
  6. Hardware design
Quectel EC200T Series Hardware Design

Quectel EC200T Series Hardware Design

Hide thumbs Also See for EC200T Series:
Table of Contents

Advertisement

Quick Links

EC200T-AU Series
Hardware Design
LTE Standard Module Series
Version: 1.1
Date: 2020-08-10
Status: Released
www.quectel.com

Advertisement

Table of Contents
loading
Need help?

Need help?

Do you have a question about the EC200T Series and is the answer not in the manual?

Questions and answers

Related Manuals for Quectel EC200T Series

Summary of Contents for Quectel EC200T Series

  • Page 1 EC200T-AU Series Hardware Design LTE Standard Module Series Version: 1.1 Date: 2020-08-10 Status: Released www.quectel.com...
  • Page 2 QUECTEL OFFERS THE INFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION PROVIDED IS BASED UPON CUSTOMERS’ REQUIREMENTS. QUECTEL MAKES EVERY EFFORT TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE. QUECTEL DOES NOT MAKE ANY WARRANTY AS TO THE INFORMATION CONTAINED HEREIN, AND DOES NOT ACCEPT ANY LIABILITY FOR ANY INJURY, LOSS OR DAMAGE OF ANY KIND INCURRED BY USE OF OR RELIANCE UPON THE INFORMATION.

  • Page 3: About The Document

    LTE Standard Module Series EC200T Series Hardware Design About the Document Revision History Version Date Author Description Jaye SANG/ 2019-09-12 Initial Niko WU 1. Added related information of EC200T-AU. 2. Deleted B5 of EC200T-EU. 3. Updated the storage of SMS (Table 2) 4.

  • Page 4: Table Of Contents

    LTE Standard Module Series EC200T Series Hardware Design Contents About the Document ..........................2  Contents ..............................3  Table Index ............................... 5  Figure Index .............................. 7  1  Introduction ............................9  1.1.  Safety Information ......................... 12  2  Product Concept ..........................14  2.1. ...
  • Page 5 LTE Standard Module Series EC200T Series Hardware Design 3.17.  Behaviors of the MAIN_RI ..................... 55  3.18.  FORCE_USB_BOOT Interface ..................... 55  4  Antenna Interfaces .......................... 58  4.1.  Main/Rx-diversity Antenna Interfaces ..................58  4.1.1.  Pin Definition ........................ 58  4.1.2.  Operating Frequency ....................
  • Page 6 Table 2: Frequency Bands of EC200T-EU Module .................. 14  Table 3: Frequency Bands of EC200T-AU* Module ................. 15  Table 4: Key Features of EC200T series Module ..................15  Table 5: I/O Parameters Definition ......................21  Table 6: Pin Description ...........................
  • Page 7 LTE Standard Module Series EC200T Series Hardware Design Table 40: EC200T-CN Conducted RF Receiving Sensitivity ..............81  Table 41: EC200T-EU Conducted RF Receiving Sensitivity ..............82  Table 42: EC200T-AU* Conducted RF Receiving Sensitivity ..............82  Table 43: Electrostatics Discharge Characteristics (25 ºC, 45% Relative Humidity) ........
  • Page 8 LTE Standard Module Series EC200T Series Hardware Design Figure Index Figure 2: EC200T Series Module Pin Assignment (Top View) ..............20  Figure 3: Sleep Mode Application via UART .................... 30  Figure 4: Sleep Mode Application with USB Remote Wakeup ..............
  • Page 9 LTE Standard Module Series EC200T Series Hardware Design Figure 43: Tape Specifications ......................... 92  Figure 44: Reel Specifications ......................... 92  Figure 45: Tape and Reel Directions ....................... 93  EC200T_Series_Hardware_Design 8 / 90...

  • Page 10: Introduction

    This document can help you quickly understand module interface specifications, electrical and mechanical details, as well as other related information of EC200T series module. Associated with application note and user guide, you can use EC200T series module to design and set up wireless applications easily.
  • Page 11 LTE Standard Module Series EC200T Series Hardware Design ❒ WCDMA Band II/LTE Band2/ LTE Band 7 :≤8.000dBi ❒ WCDMA Band IV/ LTE Band 4 / LTE Band 66:≤5.000dBi ❒ WCDMA Band V / LTE Band 5:≤9.541dBi 5. This module must not transmit simultaneously with any other antenna or transmitter 6.
  • Page 12 LTE Standard Module Series EC200T Series Hardware Design The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device.

  • Page 13: Safety Information

    The following safety precautions must be observed during all phases of operation, such as usage, service or repair of any cellular terminal or mobile incorporating EC200T series module. Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product.
  • Page 14 LTE Standard Module Series EC200T Series Hardware Design In locations with potentially explosive atmospheres, obey all posted signs to turn off wireless devices such as mobile phone or other cellular terminals. Areas with potentially explosive atmospheres include fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, areas where the air contains chemicals or particles such as grain, dust or metal powders.

  • Page 15: Product Concept

    WCDMA, EDGE and GPRS networks. It also provides voice functionality for your specific applications. EC200T series contains 3 variants: EC200T-CN, EC200T-EU and EC200T-AU*. You can choose a dedicated type based on the region or operator. The following table shows the frequency bands of EC200T series module.

  • Page 16: Key Features

    B1/B2/B4/B5/B8 850/900/1800/1900 MHz With a compact profile of 29.0 mm × 32.0 mm × 2.4 mm, EC200T series can meet almost all requirements for M2M applications such as automotive, metering, tracking system, security, router, wireless POS, mobile computing device, PDA phone, tablet PC, etc.
  • Page 17 LTE Standard Module Series EC200T Series Hardware Design Supports up to non-CA Cat 4 FDD and TDD Supports 1.4/3/5/10/15/20 MHz RF bandwidth LTE Features Supports MIMO in DL direction FDD: Max. 150 Mbps (DL), Max. 50 Mbps (UL) TDD: Max. 130 Mbps (DL), Max. 30 Mbps (UL)
  • Page 18 Supports SD 3.0 protocol WLAN Interface* Supports SDIO 3.0 interface for WLAN Rx-diversity Supports LTE Rx-diversity Compliant with 3GPP TS 27.007, 27.005 and Quectel enhanced AT AT Commands commands NET_MODE and NET_STATUS used to indicate the network connectivity Network Indication...

  • Page 19: Functional Diagram

    LTE Standard Module Series EC200T Series Hardware Design 2.3. Functional Diagram The following figure shows a block diagram of EC200T series and illustrates the major functional parts.  Power management  Baseband  Flash  Radio frequency  Peripheral interfaces 2.4.

  • Page 20: Application Interfaces

    EC200T Series Hardware Design Application Interfaces 3.1. General Description EC200T series is equipped with 80 LCC pins plus 64 LGA pins that can be connected to cellular application platform. The subsequent chapters will provide detailed descriptions of the following interfaces.

  • Page 21: Pin Assignment

    LTE Standard Module Series EC200T Series Hardware Design 3.2. Pin Assignment The following figure shows the pin assignment of EC200T series module. Figure 1: EC200T Series Module Pin Assignment (Top View) NOTES Pin FORCE_USB_BOOT cannot be pulled up before startup.

  • Page 22: Pin Description

    LTE Standard Module Series EC200T Series Hardware Design 3.3. Pin Description The following tables show the pin definition of EC200T series module. Table 5: I/O Parameters Definition Type Description Analog Input Analog Output Digital Input Digital Output Bidirectional Open Drain...
  • Page 23 LTE Standard Module Series EC200T Series Hardware Design Pin Name Pin No. Description Comment Characteristics Power supply for Provide 1.8 V for Vnorm = 1.8 V external GPIO’s pull-up VDD_EXT external circuit max = 50 mA circuits. If unused, keep it open.
  • Page 24 LTE Standard Module Series EC200T Series Hardware Design (U)SIM Interface Pin Name Pin No. Description DC Characteristics Comment Specified ground for Connect (U)SIM card USIM_GND (U)SIM connector GND. min = -0.3 V 1.8 V power domain. (U)SIM card hot-plug max = 0.6 V...
  • Page 25 LTE Standard Module Series EC200T Series Hardware Design Main UART Interface Pin Name Pin No. Description DC Characteristics Comment 1.8 V power domain. Main UART ring max = 0.45 V MAIN_RI If unused, keep it indication min = 1.35 V open.
  • Page 26 LTE Standard Module Series EC200T Series Hardware Design General-purpose ADC Voltage range: If unused, keep it ADC0 interface 0 V to VBAT_BB open. PCM & I2C Interfaces Pin Name Pin No. Description DC Characteristics Comment min = -0.3 V 1.8 V power domain.
  • Page 27 LTE Standard Module Series EC200T Series Hardware Design open. SD Card Interface Pin Name Pin No. Description DC Characteristics Comment 1.8/2.8 V power domain. SD_DET* SD card detect If unused, keep it open. 1.8/2.8 V power SD_SDIO_ SD card SDIO data bit domain.
  • Page 28 LTE Standard Module Series EC200T Series Hardware Design 1.8 V power domain. WLAN_PWR_ WLAN power supply max = 0.45 V If unused, keep it enable control min = 1.35 V open. max = 0.45 V min = 1.35 V 1.8 V power domain.
  • Page 29 LTE Standard Module Series EC200T Series Hardware Design RF Interface Pin Name Pin No. Description DC Characteristics Comment 50 Ω impedance. Diversity antenna ANT_DIV If unused, keep it interface open. Main antenna ANT_MAIN 50 Ω impedance. interface Other Interfaces Pin Name Pin No.

  • Page 30: Operating Modes

    VBAT_RF and VBAT_BB pins are still powered. 3.5. Power Saving 3.5.1. Sleep Mode EC200T series is able to reduce its current consumption to an ultra-low value in the sleep mode. The following section describes power saving procedures of EC200T series module. EC200T_Series_Hardware_Design...

  • Page 31: Uart Application

     Driving MAIN_DTR to low level by host will wake up the module. When EC200T series has a URC to report, the URC will trigger the behavior of MAIN_RI pin. Please  refer to Chapter 3.17 for details about MAIN_RI behavior.

  • Page 32: Usb Application With Usb Suspend/Resume And Main_Ri Wakeup Function

    Sending data to EC200T series through USB will wake up the module.  When EC200T series has a URC to report, the module will send remote wakeup signals via USB bus so as to wake up the host. 3.5.1.3. USB Application with USB Suspend/Resume and MAIN_RI Wakeup Function If the host supports USB Suspend/Resume, but does not support remote wakeup function, the MAIN_RI signal is needed to wake up the host.

  • Page 33: Usb Application Without Usb Suspend Function

    LTE Standard Module Series EC200T Series Hardware Design 3.5.1.4. USB Application without USB Suspend Function If the host does not support USB Suspend function, please disconnect USB_VBUS with additional control circuit to let the module enter into sleep mode. ...

  • Page 34: Power Supply

     AT+CFUN=4: Airplane mode. RF function is disabled. 3.6. Power Supply 3.6.1. Power Supply Pins EC200T series provides four VBAT pins dedicated to connecting with the external power supply. There are two separate voltage domains for VBAT.  Two VBAT_RF pins for module’s RF part Two VBAT_BB pins for module’s baseband part...

  • Page 35: Reference Design For Power Supply

    LTE Standard Module Series EC200T Series Hardware Design Figure 6: Power Supply Limits during Burst Transmission To decrease voltage drop, a bypass capacitor of about 100 µF with low ESR (ESR = 0.7 Ω) should be used, and a multi-layer ceramic chip (MLCC) capacitor array should also be reserved due to its ultra-low ESR.

  • Page 36: Power-On/Off/Reset Scenarios

    VBAT power domain When EC200T series is in power down mode, it can be turned on to normal mode by driving the PWRKEY pin to a low level for at least 500 ms. It is recommended to use an open drain/collector driver to control the PWRKEY.
  • Page 37 LTE Standard Module Series EC200T Series Hardware Design Figure 9: Reference Circuit of Turing on the Module Using Driving Circuit The other way to control the PWRKEY is using a button directly. When pressing the key, electrostatic strike may generate from finger. Therefore, a TVS component is indispensable to be placed nearby the button for ESD protection.

  • Page 38: Turn Off Module

    LTE Standard Module Series EC200T Series Hardware Design The timing of turning on the module is illustrated in the following figure. NOTE 1 VBAT ≥ 500 ms PWRKEY ≤ 0.5 V About 5 ms VDD_EXT ≥ 100 ms. After this time, the pin can be set high level by an external circuit.

  • Page 39: Turn Off Module Using The Pwrkey Pin

    LTE Standard Module Series EC200T Series Hardware Design 3.7.2.1. Turn off Module Using the PWRKEY Pin Driving the PWRKEY pin to a low level voltage for at least 650 ms, the module will execute power-down procedure after the PWRKEY is released. The timing of turning off the module is illustrated in the following figure.
  • Page 40 LTE Standard Module Series EC200T Series Hardware Design Table 10: Pin Description of RESET_N Pin Name Pin No. Description Comment RESET_N Reset the module 1.8 V power domain The recommended circuit is similar to the PWRKEY control circuit. An open drain/collector driver or button can be used to control the RESET_N.

  • Page 41: U)Sim Interface

    LTE Standard Module Series EC200T Series Hardware Design The timing of resetting module is illustrated in the following figure. Figure 15: Timing of Resetting Module NOTES Please ensure that there is no large capacitance with the max value exceeding 10 nF on PWRKEY and RESET_N pins.
  • Page 42 USIM_RST (U)SIM card reset EC200T series supports (U)SIM card hot-plug via the USIM_DET pin. The function supports low level and high level detections. By default, It is disabled, and can be configured via AT+QSIMDET command. Please refer to document [2] for details about the command.
  • Page 43 LTE Standard Module Series EC200T Series Hardware Design If (U)SIM card detection function is not needed, please keep USIM_DET unconnected. A reference circuit for (U)SIM interface with a 6-pin (U)SIM card connector is illustrated in the following figure. Figure 17: Reference Circuit of (U)SIM Interface with a 6-pin (U)SIM Card Connector...

  • Page 44: Usb Interface

    EC200T Series Hardware Design 3.9. USB Interface EC200T series provides one integrated Universal Serial Bus (USB) interface which complies with the USB 2.0 specification and supports full-speed (12 Mbps) and high-speed (480 Mbps) modes. The USB interface can only serves as a slave device and is used for AT command communication, data transmission, software debugging and firmware upgrade.

  • Page 45: Uart Interfaces

    LTE Standard Module Series EC200T Series Hardware Design A common mode choke L1 is recommended to be added in series between the module and customer’s MCU in order to suppress EMI spurious transmission. Meanwhile, the 0 Ω resistors (R3 and R4) should be added in series between the module and the test points so as to facilitate debugging, and the resistors are not mounted by default.
  • Page 46 LTE Standard Module Series EC200T Series Hardware Design Main UART request to MAIN_RTS send Main UART data MAIN_DTR terminal ready MAIN_TXD Main UART transmit MAIN_RXD Main UART receive Table 14: Pin Definition of Debug UART Interface Pin Name Pin No.
  • Page 47 LTE Standard Module Series EC200T Series Hardware Design Figure 19: Reference Circuit with Translator Chip Please visit http://www.ti.com for more information. Another example with transistor translation circuit is shown as below. For the design of circuits in dotted lines, see that of the circuits in solid lines, but please pay attention to the direction of connection.

  • Page 48: Pcm And I2C Interfaces

    3.11. PCM and I2C Interfaces EC200T series provides one Pulse Code Modulation (PCM) digital interface for audio design, which supports the primary mode (short frame synchronization) and EC200T series works as both master and slave. EC200T series works as a master device pertaining to I2C interface.
  • Page 49 LTE Standard Module Series EC200T Series Hardware Design Table 16: Pin Definition of PCM and I2C Interfaces Pin Name Pin No. Description Comment 1.8 V power domain. PCM_DIN PCM data input If unused, keep it open. 1.8 V power domain.

  • Page 50: Sd Card Interface

    It is recommended to reserve an RC (R=22 Ω, C=22 pF) circuit on the PCM lines, especially for PCM_CLK. 3.12. SD Card Interface EC200T series provides an SD card interface, which complies with SD 3.0 specification. The following table shows the pin definition of SD card interface. Table 17: Pin Definition of SD Card Interface Pin Name Pin No.
  • Page 51 LTE Standard Module Series EC200T Series Hardware Design Figure 23: Reference Circuit of SD Card Interface In SD card interface design, in order to ensure good communication performance with SD card, the following design principles should be complied with: ...

  • Page 52: Wlan Interface*①

    LTE Standard Module Series EC200T Series Hardware Design 3.13. WLAN Interface*① EC200T series supports a SDIO 3.0 interface for WLAN. The following table shows the pin definition of WLAN interface Table 18: Pin Definition of WLAN Interface Pin Name Pin No.

  • Page 53: Adc Interfaces

    LTE Standard Module Series EC200T Series Hardware Design  Make sure the adjacent trace spacing is 2 times of the trace width and bus capacitance is less than 15 pF. NOTE “*” means under development. “①”means only QuecOpen scheme support 3.14.

  • Page 54: Network Status Indication

    LTE Standard Module Series EC200T Series Hardware Design 3.15. Network Status Indication The network indication pins can be used to drive network status indication LEDs. The module provides two pins which are NET_MODE and NET_STATUS for network status indication. The following tables describe pin definition and logic level changes in different network status.

  • Page 55: Status

    LTE Standard Module Series EC200T Series Hardware Design Figure 24: Reference Circuit of Network Status Indication 3.16. STATUS The STATUS pin is an open drain output for module’s operation status indication. It can be connected to a GPIO of DTE with a pulled-up resistor, or as an LED indication circuit as below. When the module is turned on normally, the STATUS will present the low state.

  • Page 56: Behaviors Of The Main_Ri

    3.18. FORCE_USB_BOOT Interface EC200T series provides a FORCE_USB_BOOT pin. You can pull up FORCE_USB_BOOT to 1.8 V before VDD_EXT is powered up, and the module will enter emergency download mode when it is powered on. In this mode, the module supports firmware upgrade over USB interface.
  • Page 57 LTE Standard Module Series EC200T Series Hardware Design Table 25: Pin Definition of FORCE_USB_BOOT Interface Pin Name Pin No. Description Comment 1.8 V power domain. FORCE_ Force the module into Active high. USB_BOOT emergency download mode It is recommended to reserve test points.
  • Page 58 LTE Standard Module Series EC200T Series Hardware Design NOTES Please make sure that VBAT is stable before pulling down PWRKEY pin. It is recommended that the time between powering up VBAT and pulling down PWRKEY pin is no less than 30 ms.

  • Page 59: Antenna Interfaces

    EC200T Series Hardware Design Antenna Interfaces EC200T series antenna interfaces include a main antenna interface, an Rx-diversity antenna interface which is used to resist the fall of signals caused by high speed movement and multipath effect. The antenna ports have an impedance of 50 Ω.
  • Page 60 LTE Standard Module Series EC200T Series Hardware Design LTE-FDD B3 1710–1785 1805–1880 LTE-FDD B5 824–849 869–894 LTE-FDD B8 880–915 925–960 LTE-TDD B34 2010–2025 2010–2025 LTE-TDD B38 2570–2620 2570–2620 LTE-TDD B39 1880–1920 1880–1920 LTE-TDD B40 2300–2400 2300–2400 LTE-TDD B41 2555–2655 2555–2655...
  • Page 61 LTE Standard Module Series EC200T Series Hardware Design Table 29: EC200T-AU * Operating Frequencies 3GPP Band Transmit Receive Unit EGSM900 880–915 925–960 GSM850 824–849 869–894 DCS1800 1710–1785 1805–1880 PCS1900 1850–1910 1930–1990 WCDMA B1 1920–1980 2110–2170 WCDMA B2 1850–1910 1930–1990 WCDMA B4 1710–1755...

  • Page 62: Reference Design Of Rf Antenna Interface

    LTE Standard Module Series EC200T Series Hardware Design 4.1.3. Reference Design of RF Antenna Interface A reference design of ANT_MAIN and ANT_DIV antenna pads is shown as below. A π-type matching circuit should be reserved for better RF performance. The capacitors are not mounted by default.
  • Page 63 LTE Standard Module Series EC200T Series Hardware Design Figure 29: Microstrip Design on a 2-layer PCB Figure 30: Coplanar Waveguide Design on a 2-layer PCB Figure 31: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) EC200T_Series_Hardware_Design...

  • Page 64: Antenna Installation

    LTE Standard Module Series EC200T Series Hardware Design Figure 32: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) In order to ensure RF performance and reliability, the following principles should be complied with in RF layout design: ...

  • Page 65: Recommended Rf Connector For Antenna Installation

    LTE Standard Module Series EC200T Series Hardware Design Input impedance: 50 Ω Cable insertion loss: < 1 dB (EGSM900, WCDMA B5, WCDMA B8, LTE-FDD B5/B8/B20/B28) Cable insertion loss: < 1.5 dB (DCS1800, WCDMA B1, LTE B1/B3/B34/B39) Cable insertion loss: < 2 dB (LTE-TDD B7/B38/B40/B41) 4.2.2.
  • Page 66 LTE Standard Module Series EC200T Series Hardware Design U.FL-LP serial connectors listed in the following figure can be used to match the U.FL-R-SMT. Figure 34: Mechanicals of U.FL-LP Connectors The following figure describes the space factor of mated connector. Figure 35: Space Factor of Mated Connector (Unit: mm) For more details, please visit http://hirose.com.

  • Page 67: Electrical, Reliability And Radio Characteristics

    LTE Standard Module Series EC200T Series Hardware Design Electrical, Reliability and Radio Characteristics 5.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table. Table 31: Absolute Maximum Ratings Parameter Min.

  • Page 68: Power Supply Ratings

    LTE Standard Module Series EC200T Series Hardware Design 5.2. Power Supply Ratings Table 32: The Module Power Supply Ratings Parameter Description Conditions Min. Typ. Max. Unit The actual input voltages VBAT_BB and must be kept between the VBAT_RF minimum and maximum VBAT values.

  • Page 69: Current Consumption

    LTE Standard Module Series EC200T Series Hardware Design NOTES Within operating temperature range, the module is 3GPP compliant. Within extended temperature range, the module remains the ability to establish and maintain a voice, SMS, data transmission, etc. There is no unrecoverable malfunction. There are also no effects on radio spectrum and no harm to radio network.
  • Page 70 LTE Standard Module Series EC200T Series Hardware Design WCDMA @ PF = 512 (USB disconnected) 1.75 LTE-FDD @ PF = 32 (USB disconnected) 4.21 LTE-FDD @ PF = 64 (USB disconnected) 2.59 LTE-FDD @ PF = 64 (USB suspend) 2.79 LTE-FDD @ PF = 128 (USB disconnected) 1.78...
  • Page 71 LTE Standard Module Series EC200T Series Hardware Design DCS1800 2DL/3UL @ 28.45 dBm 445.9 DCS1800 1DL/4UL @ 26.53 dBm 470.3 EGSM900 4DL/1UL @ 28.21 dBm 221.8 EGSM900 3DL/2UL @ 27.51 dBm 351.8 EGSM900 2DL/3UL @ 25.46 dBm 470.2 EGSM900 1DL/4UL @ 23.28 dBm 582.1...
  • Page 72 LTE Standard Module Series EC200T Series Hardware Design EGSM900 PCL = 5 @ 32.27 dBm 242.2 EGSM900 PCL = 12 @ 19.64 dBm 120.1 EGSM900 PCL = 19 @ 5.75 dBm 94.2 voice call DCS1800 PCL = 0 @ 29.95 dBm 223.6...
  • Page 73 LTE Standard Module Series EC200T Series Hardware Design 3.12 DCS1800 @ DRX = 5（USB suspend） 3.38 DCS1800 @ DRX = 9（USB disconnected） WCDMA @ PF = 64（USB disconnected） 4.18 3.89 WCDMA @ PF = 64（USB suspend） 2.64 WCDMA @ PF = 128（USB disconnected）...
  • Page 74 LTE Standard Module Series EC200T Series Hardware Design 30.20 LTE-FDD @ PF = 64（USB disconnected） LTE-FDD @ PF = 64（USB connected） LTE-TDD @ PF = 64（USB disconnected） 30.6 49.83 LTE-TDD @ PF = 64（USB connected） EGSM900 4DL/1UL @ 33.07 dBm EGSM900 3DL/2UL @ 33.04 dBm...
  • Page 75 LTE Standard Module Series EC200T Series Hardware Design LTE-FDD B1 @ 23.10 dBm LTE-FDD B3 @ 23.17 dBm LTE-FDD B7 @ 24.41 dBm LTE-FDD B8 @ 22.76 dBm LTE data LTE-FDD B20 @ 24.09 dBm transfer LTE-FDD B28 @ 23.9 dBm LTE-TDD B38 @ 23.13 dBm...
  • Page 76 LTE Standard Module Series EC200T Series Hardware Design Table 36：EC200T-AU Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down AT+CFUN=0（USB disconnected） 1.07 EGSM900 @ DRX = 2（USB disconnected） 3.55 EGSM900 @ DRX = 5（USB disconnected） 2.45 EGSM900 @ DRX = 5（USB suspend）...
  • Page 77 LTE Standard Module Series EC200T Series Hardware Design 2.34 LTE-FDD @ PF = 256（USB disconnected） 5.76 LTE-TDD @ PF = 32（USB disconnected） LTE-TDD @ PF = 64（USB disconnected） 3.72 3.92 LTE-TDD @ PF = 64（USB suspend） 2.76 LTE-TDD @ PF = 128（USB disconnected）...
  • Page 78 LTE Standard Module Series EC200T Series Hardware Design PCS1900 4DL/1UL @ 30.10 dBm 212.5 PCS1900 3DL/2UL @ 30.10 dBm 355.6 PCS1900 2DL/3UL @ 28.65 dBm 425.4 PCS1900 1DL/4UL @ 26.72 dBm 450.9 EGSM850 4DL/1UL @ 33.01 dBm 265.2 EGSM850 3DL/2UL @ 32.97 dBm 459.4...
  • Page 79 LTE Standard Module Series EC200T Series Hardware Design transfer WCDMA B1 HSUPA @ 23.10 dBm 729.1 WCDMA B2 HSDPA @ 23.73 dBm 835.1 WCDMA B2 HSUPA @ 22.24 dBm 761.2 WCDMA B4 HSDPA @ 24.29 dBm 767.6 WCDMA B4 HSUPA @ 22.59 dBm 689.6...

  • Page 80: Rf Output Power

    625.6 WCDMA B8 @ 23.57 dBm 658.3 备注 “*” means under development. 5.5. RF Output Power The following table shows the RF output power of EC200T series module. Table 37: EC200T-CN RF Output Power Frequency Max. Min. EGSM900 33 dBm ±2 dB 5 dBm ±5 dB...
  • Page 81 LTE Standard Module Series EC200T Series Hardware Design WCDMA B1/B5/B8 24 dBm +1/-3 dB < -49 dBm LTE-FDD B1/B3/B5/B8 23 dBm ±2 dB < -39 dBm LTE-TDD B34/B38/B39/B40/B41 23 dBm ±2 dB < -39 dBm Table 38: EC200T-EU RF Output Power Frequency Max.

  • Page 82: Rf Receiving Sensitivity

    LTE Standard Module Series EC200T Series Hardware Design LTE-FDD B1/B2/B3/B4/B5/B7/B8/B28 23 dBm ±2 dB < -39 dBm LTE-TDD B40 23 dBm ±2 dB < -39 dBm NOTES In GPRS 4 slots Tx mode, the maximum output power is reduced by 2.5 dB. The design conforms to the GSM specification as described in Chapter 13.16 of 3GPP TS 51.010-1.
  • Page 83 LTE Standard Module Series EC200T Series Hardware Design LTE-TDD B39 (10 MHz) -97 dBm -97.5 dBm -100 dBm -96.3 dBm LTE-TDD B40 (10 MHz) -97 dBm -97 dBm -100 dBm -96.3 dBm LTE-TDD B41 (10 MHz) -96 dBm -97 dBm -99 dBm -94.3 dBm...

  • Page 84: Electrostatic Discharge

    LTE Standard Module Series EC200T Series Hardware Design DCS1800 -102 dBm DCS1900 -102 dBm WCDMA B1 -106.7 dBm WCDMA B2 -104.7 dBm WCDMA B4 -106.7 dBm WCDMA B5 -104.7 dBm WCDMA B8 -103.7 dBm LTE-FDD B1 (10 MHz) -96.3 dBm LTE-FDD B2 (10 MHz) -94.3 dBm...
  • Page 85 LTE Standard Module Series EC200T Series Hardware Design The following table shows the module electrostatics discharge characteristics. Table 43: Electrostatics Discharge Characteristics (25 ºC, 45% Relative Humidity) Tested Interfaces Contact Discharge Air Discharge Unit VBAT, GND ±8 ±10 All Antenna Interfaces ±8...

  • Page 86: Mechanical Dimensions

    LTE Standard Module Series EC200T Series Hardware Design Mechanical Dimensions This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter (mm), and the dimensional tolerances are ±0.05 mm unless otherwise specified. 6.1. Mechanical Dimensions of the Module...
  • Page 87 LTE Standard Module Series EC200T Series Hardware Design 32.0 ＋ /-0.15 1.90 1.30 3.85 Pin 1 1.30 5.96 0.87 1.15 2.15 4.82 1.05 4.37 2.49 3.45 Figure 37: Module Bottom Dimensions (Bottom View) NOTE The package warpage level of the module conforms to JEITA ED-7306 standard.

  • Page 88: Recommended Footprint

    LTE Standard Module Series EC200T Series Hardware Design 6.2. Recommended Footprint Figure 38: Recommended Footprint (Top View) NOTES The keepout area should not be designed. For easy maintenance of the module, please keep about 3 mm between the module and other components in the host PCB.

  • Page 89: Design Effect Drawings Of The Module

    6.3. Design Effect Drawings of the Module Figure 39: Top View of the Module Figure 40: Bottom View of the Module NOTE These are renderings of EC200T series module. For authentic appearance, please refer to the module that you receive from Quectel. EC200T_Series_Hardware_Design 88 / 90...

  • Page 90: Storage, Manufacturing And Packaging

    LTE Standard Module Series EC200T Series Hardware Design Storage, Manufacturing and Packaging 7.1. Storage The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below. 1. Recommended Storage Condition: The temperature should be 23 ±5 °C and the relative humidity should be 35%–60%.

  • Page 91: Manufacturing And Soldering

    LTE Standard Module Series EC200T Series Hardware Design NOTES This floor life is only applicable when the environment conforms to IPC/JEDEC J-STD-033. 2. To avoid blistering, layer separation and other soldering issues, it is forbidden to expose the modules to the air for a long time. If the temperature and moisture do not conform to IPC/JEDEC J-STD-033 or the relative moisture is over 60%, It is recommended to start the solder reflow process within 24 hours after the package is removed.
  • Page 92 LTE Standard Module Series EC200T Series Hardware Design Table 44: Recommended Thermal Profile Parameters Factor Recommendation Soak Zone Max slope 1–3 °C/s Soak time (between A and B: 150 °C and 200 °C) 70–120 s Reflow Zone Max slope 2–3 °C/s Reflow time (D: over 220°C)

  • Page 93: Packaging

    LTE Standard Module Series EC200T Series Hardware Design 7.3. Packaging EC200T series is packaged in tape and reel carriers. One reel is 11.88 m long and contains 250 modules. The figure below shows the package details, measured in mm. 44.00 ±...
  • Page 94 LTE Standard Module Series EC200T Series Hardware Design 1083 Carrier tape Carrier tape unfolding packing module Figure 44: Tape and Reel Directions EC200T_Series_Hardware_Design 93 / 90...

  • Page 95: Appendix A References

    LTE Standard Module Series EC200T Series Hardware Design Appendix A References Table 45: Related Documents Document Name Remark Quectel_Module_Secondary_SMT_User_Guide Module Secondary SMT User Guide Quectel_EC200T-CN_AT_Commands_Manual EC200T-CN AT Commands Manual Quectel_RF_Layout_Application_Note RF Layout Application Note UMTS&LTE EVB user guide for Quectel_UMTS&LTE_EVB_User_Guide UMTS&LTE modules...
  • Page 96 LTE Standard Module Series EC200T Series Hardware Design Electrostatic Discharge Frequency Division Duplex Full Rate File Transfer Protocol FTPS FTP over SSL GMSK Gaussian Minimum Shift Keying Global System for Mobile Communications Half Rate HSDPA High Speed Downlink Packet Access...
  • Page 97 LTE Standard Module Series EC200T Series Hardware Design Point-to-Point Protocol Phase Shift Keying Quadrature Amplitude Modulation QPSK Quadrature Phase Shift Keying Radio Frequency SIMO Single Input Multiple Output Smart Media Short Message Service SMTP Simple Mail Transfer Protocol SMTPS Simple Mail Transfer Protocol Secure...
  • Page 98 LTE Standard Module Series EC200T Series Hardware Design Minimum Input Low Level Voltage Value Absolute Maximum Input Voltage Value Maximum Output High Level Voltage Value Minimum Output High Level Voltage Value Maximum Output Low Level Voltage Value Minimum Output Low Level Voltage Value...

  • Page 99: Appendix B Gprs Coding Schemes

    LTE Standard Module Series EC200T Series Hardware Design Appendix B GPRS Coding Schemes Table 47: Description of Different Coding Schemes CS-1 CS-2 CS-3 CS-4 Scheme Code Rate Pre-coded USF Radio Block excl.USF and BCS Tail Coded Bits Punctured Bits 9.05 13.4...

  • Page 100: Appendix C Gprs Multi-Slot Classes

    LTE Standard Module Series EC200T Series Hardware Design Appendix C GPRS Multi-slot Classes Twenty-nine classes of GPRS multi-slot modes are defined for MS in GPRS specification. Multi-slot classes are product dependent, and determine the maximum achievable data rates in both the uplink and downlink directions.
  • Page 101 LTE Standard Module Series EC200T Series Hardware Design EC200T_Series_Hardware_Design 100 /...

  • Page 102: Appendix D Edge Modulation And Coding Schemes

    LTE Standard Module Sires EC200T Hardware Design Appendix D EDGE Modulation and Coding Schemes Table 49: EDGE Modulation and Coding Schemes Coding Scheme Modulation Coding Family Timeslot 1 Timeslot 2 Timeslot 4 MCS-1 GMSK 8.80 kbps 17.60 kbps 35.20 kbps MCS-2 GMSK 11.2 kbps...

This manual is also suitable for:

Ec200t-cnEc200t-euEc200t-au

Table of Contents