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Quectel EC25-AUX Hardware Design

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Module : EC25-AUX
EC25
LTE Standard Module Series
Rev. EC25_Hardware_Design_V2.2
Date: 2019-08-19
Status: Released
Hardware Design
www.quectel.com

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Summary of Contents for Quectel EC25-AUX

  • Page 1 Module : EC25-AUX EC25 Hardware Design LTE Standard Module Series Rev. EC25_Hardware_Design_V2.2 Date: 2019-08-19 Status: Released www.quectel.com...
  • Page 2 QUECTEL OFFERS THE INFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION PROVIDED IS BASED UPON CUSTOMERS’ REQUIREMENTS. QUECTEL MAKES EVERY EFFORT TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE. QUECTEL DOES NOT MAKE ANY WARRANTY AS TO THE INFORMATION CONTAINED HEREIN, AND DOES NOT ACCEPT ANY LIABILITY FOR ANY INJURY, LOSS OR DAMAGE OF ANY KIND INCURRED BY USE OF OR RELIANCE UPON THE INFORMATION.

  • Page 3: About The Document

    LTE Standard Module Series EC25 Hardware Design About the Document History Revision Date Author Description 2016-04-01 Woody WU Initial Updated EC25 series frequency bands in Table 1. Updated transmitting power, supported maximum baud rate of main UART/internal protocols/USB drivers of USB interface, firmware upgrade and temperature range in Table 2.
  • Page 4 LTE Standard Module Series EC25 Hardware Design Added BT interface in Chapter 3.18.2. Updated GNSS performance in Table 24. Updated reference circuit of wireless connectivity interfaces with FC20 module in Figure 29. Updated current consumption of EC25-E module in Table 33. Updated EC25-A conducted RF receiving sensitivity in Table 38.
  • Page 5 LTE Standard Module Series EC25 Hardware Design Table 50. 1. Added new variants EC25-EU/-EC/-EUX/-MX and related information. 2. Updated functional diagram in Figure 1. 3. Updated star structure of the power supply in Figure 8. 4. Updated power-on scenario of module in Figure 12. 5.
  • Page 6 Table 39. 3. Updated EC25-EC current consumption in Table 43. 4. Updated EC25-EUX current consumption in Table 44. Ward WANG/ 5. Added EC25-AUX current consumption in Table 46. 2019-08-19 Owen WEI/ 6. Updated EC25-AU conducted RF receiving sensitivity Frank WANG in Table 53.

  • Page 7: Table Of Contents

    LTE Standard Module Series EC25 Hardware Design Contents About the Document ..........................2  Contents ..............................6  Table Index ............................... 9  Figure Index ............................11  1  Introduction ............................. 13  1.1.  Safety Information ......................... 14  2  Product Concept ..........................16  2.1.  General Description ......................16 ...
  • Page 8 LTE Standard Module Series EC25 Hardware Design 3.13.  SD Card Interface ......................... 56  3.14.  Wireless Connectivity Interfaces ................... 58  3.14.1.  WLAN Interface ......................61  3.14.2.  BT Interface* ........................ 61  3.15.  ADC Interfaces ........................61  3.16.  SGMII Interface ........................62  3.17.  Network Status Indication .....................
  • Page 9 LTE Standard Module Series EC25 Hardware Design 9  Appendix A References ........................ 124  10  Appendix B GPRS Coding Schemes ................... 128  11  Appendix C GPRS Multi-slot Classes ..................129  12  Appendix D EDGE Modulation and Coding Schemes ..............131  EC25_Hardware_Design 8 / 130...
  • Page 10 LTE Standard Module Series EC25 Hardware Design Table Index TABLE 1: FREQUENCY BANDS OF EC25 SERIES MODULE ............... 16 TABLE 2: KEY FEATURES OF EC25 MODULE ....................17 TABLE 3: I/O PARAMETERS DEFINITION ...................... 24 TABLE 4: PIN DESCRIPTION ........................... 24 TABLE 5: OVERVIEW OF OPERATING MODES ....................
  • Page 11 TABLE 60: EC25-EUX CONDUCTED RF RECEIVING SENSITIVITY ............111 TABLE 61: EC25-MX CONDUCTED RF RECEIVING SENSITIVITY ............. 111 TABLE 62: EC25-AUX CONDUCTED RF RECEIVING SENSITIVITY ............112 TABLE 63: ELECTROSTATICS DISCHARGE CHARACTERISTICS (25ºC, 45% RELATIVE HUMIDITY) ... 113 TABLE 64: RECOMMENDED THERMAL PROFILE PARAMETERS ............121 TABLE 65: RELATED DOCUMENTS ......................
  • Page 12 LTE Standard Module Series EC25 Hardware Design Figure Index FIGURE 1: FUNCTIONAL DIAGRAM ....................... 21 FIGURE 2: PIN ASSIGNMENT (TOP VIEW) ....................23 FIGURE 3: SLEEP MODE APPLICATION VIA UART ..................37 FIGURE 4: SLEEP MODE APPLICATION WITH USB REMOTE WAKEUP ............ 38 FIGURE 5: SLEEP MODE APPLICATION WITH RI ..................
  • Page 13 LTE Standard Module Series EC25 Hardware Design FIGURE 38: REFERENCE CIRCUIT OF GNSS ANTENNA ................76 FIGURE 39: DIMENSIONS OF THE U.FL-R-SMT CONNECTOR (UNIT: MM) ..........78 FIGURE 40: MECHANICALS OF U.FL-LP CONNECTORS ................78 FIGURE 41: SPACE FACTOR OF MATED CONNECTOR (UNIT: MM) ............79 FIGURE 42: REFERENCED HEATSINK DESIGN (HEATSINK AT THE TOP OF THE MODULE) ....

  • Page 14: Introduction

    TYPE. DISPOSE OF USED BATTERIES ACCORDING To THE INSTRUCTIONS. 2. Operating temperature: -40 °C to 85° C 3. EC25-AUX, EC25-AUX MINIPCIEsupport frequency bands : GSM900/1800 , WCDMA I/V/VIII, LTE Band 1/3/5/7/8/20/28/40 ; 4. EC25-AUX, EC25-AUX MINIPCIE max output power : GSM900/1800 , WCDMA I/V/VIII, LTE Band 1/3/5/7/8/20/28/40 : 23dBm ;...

  • Page 15: Safety Information

    EC25 module. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel, and incorporate these guidelines into all manuals supplied with the product. If not so, Quectel assumes no liability for customers’ failure to comply with these precautions.
  • Page 16 LTE Standard Module Series EC25 Hardware Design In locations with potentially explosive atmospheres, obey all posted signs to turn off wireless devices such as your phone or other cellular terminals. Areas with potentially explosive atmospheres include fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, areas where the air contains chemicals or particles such as grain, dust or metal powders, etc.

  • Page 17: Product Concept

    EC25 contains 14 variants: EC25-E, EC25-A, EC25-V, EC25-J, EC25-AU, EC25-AUX, EC25-AUT, EC25-AF, EC25-AFX, EC25-EU, EC25-EUX, EC25-AUTL, EC25-EC and EC25-MX. Customers can choose a dedicated type based on the region or operator. The following table shows the frequency bands of EC25 series module.

  • Page 18: Key Features

    EC25 series module contains Telematics version and Data-only version. Telematics version supports voice and data functions, while Data-only version only supports data function. B2 band on EC25-AU and EC25-AUX modules do not support Rx-diversity. EC25-AFX, EC25-EUX, EC25-AUX and EC25-MX are based on ThreadX OS.
  • Page 19 LTE Standard Module Series EC25 Hardware Design Class 4 (33dBm±2dB) for GSM850 Class 4 (33dBm±2dB) for EGSM900 Class 1 (30dBm±2dB) for DCS1800 Class 1 (30dBm±2dB) for PCS1900 Class E2 (27dBm±3dB) for GSM850 8-PSK Transmitting Power Class E2 (27dBm±3dB) for EGSM900 8-PSK Class E2 (26dBm±3dB) for DCS1800 8-PSK Class E2 (26dBm±3dB) for PCS1900 8-PSK Class 3 (24dBm+1/-3dB) for WCDMA bands...
  • Page 20 Bluetooth Rx-diversity Support LTE/WCDMA Rx-diversity Gen8C Lite of Qualcomm GNSS Features Protocol: NMEA 0183 Compliant with 3GPP TS 27.007, 27.005 and Quectel enhanced AT AT Commands commands Two pins including NET_MODE and NET_STATUS to indicate network Network Indication connectivity status...

  • Page 21: Functional Diagram

    LTE Standard Module Series EC25 Hardware Design Firmware Upgrade USB interface or DFOTA* RoHS All hardware components are fully compliant with EU RoHS directive NOTES SD card, wireless connectivity and SGMII interfaces are not supported on ThreadX modules. Within operation temperature range, the module is 3GPP compliant. Within extended temperature range, the module remains the ability to establish and maintain a voice, SMS, data transmission, emergency call* (emergency call is not supported on ThreadX modules), etc.

  • Page 22: Evaluation Board

    Figure 1: Functional Diagram 2.4. Evaluation Board In order to help customers develop applications with EC25, Quectel supplies an evaluation board (UMTS&LTE EVB), USB to RS-232 converter cable, earphone, antenna and other peripherals to control or test the module. For more details, please refer to document [8].

  • Page 23: Application Interfaces

    LTE Standard Module Series EC25 Hardware Design Application Interfaces 3.1. General Description EC25 is equipped with 80 LCC pads plus 64 LGA pads that can be connected to cellular application platform. The subsequent chapters will provide detailed descriptions of the following functions/pins/ interfaces.

  • Page 24: Pin Assignment

    LTE Standard Module Series EC25 Hardware Design 3.2. Pin Assignment The following figure shows the pin assignment of EC25 module. WAKEUP_IN AP_READY RESERVED W_DISABLE# NET_MODE NET_STATUS ANT_MAIN VDD_EXT RESERVED RESERVED RESERVED RESERVED ANT_GNSS USIM_GND ADC0 DBG_RXD ADC1 DBG_TXD RESERVED USIM_PRESENCE I2C_SDA USIM_VDD I2C_SCL...

  • Page 25: Pin Description

    LTE Standard Module Series EC25 Hardware Design Pins 119~126 and 128 are used for SGMII interface. Pins 24~27 for PCM function are multiplexing pins used for audio design on EC25 module and BT function on FC20 module. SD card, wireless connectivity and SGMII interfaces (pins 37~40, 118, 127, 129~139, 119~126, 128, 23, 28~34) are not supported on ThreadX modules.
  • Page 26 LTE Standard Module Series EC25 Hardware Design It must be provided with Vmax=4.3V Power supply for sufficient current up to VBAT_RF 57, 58 Vmin=3.3V module’s RF part 1.8A in a burst Vnorm=3.8V transmission. Power supply for Provide 1.8V for Vnorm=1.8V external GPIO’s pull-up VDD_EXT external circuit...
  • Page 27 LTE Standard Module Series EC25 Hardware Design USB power supply, Vmax=5.25V Typical: 5.0V USB_VBUS used for USB Vmin=3.0V If unused, keep it detection Vnorm=5.0V open. Require differential Compliant with USB USB differential data impedance of 90Ω. USB_DP 2.0 standard bus (+) If unused, keep it specification.
  • Page 28 LTE Standard Module Series EC25 Hardware Design For 3.0V (U)SIM: max=0.45V min=2.55V For 1.8V (U)SIM: max=0.45V min=1.35V Reset signal of USIM_RST (U)SIM card For 3.0V (U)SIM: max=0.45V min=2.55V Main UART Interface Pin Name Pin No. Description DC Characteristics Comment 1.8V power domain. max=0.45V Ring indicator If unused, keep it...
  • Page 29 LTE Standard Module Series EC25 Hardware Design 1.8V power domain. max=0.45V DBG_TXD Transmit data If unused, keep it min=1.35V open. min=-0.3V 1.8V power domain. max=0.6V DBG_RXD Receive data If unused, keep it min=1.2V open. max=2.0V ADC Interfaces Pin Name Pin No. Description DC Characteristics Comment...
  • Page 30 LTE Standard Module Series EC25 Hardware Design Pin Name Pin No. Description DC Characteristics Comment An external pull-up I2C serial clock. resistor is required. I2C_SCL Used for external 1.8V only. codec. If unused, keep it open. An external pull-up I2C serial data. resistor is required.
  • Page 31 LTE Standard Module Series EC25 Hardware Design max=3.34V 1.8V signaling: max=0.45V min=1.4V min=-0.3V max=0.58V SDIO signal level can min=1.27V be selected according max=2.0V to SD card supported SDC2_ SD card SDIO bus level, please refer to DATA1 DATA1 SD 3.0 protocol for 3.0V signaling: max=0.38V more details.
  • Page 32 LTE Standard Module Series EC25 Hardware Design max=0.58V SD 3.0 protocol for min=1.27V more details. max=2.0V If unused, keep it open. 3.0V signaling: max=0.38V min=2.01V min=-0.3V max=0.76V min=1.72V max=3.34V min=-0.3V 1.8V power domain. SD_INS_ SD card insertion max=0.6V If unused, keep it detect min=1.2V open.
  • Page 33 LTE Standard Module Series EC25 Hardware Design min=2.14V max=0.71V min=1.78V For 1.8V: max=0.45V 1.8V/2.85V power SGMII MDIO min=1.4V SGMII_ domain. (Management Data MCLK If unused, keep it Input/Output) clock For 2.85V: open. max=0.35V min=2.14V Configurable power source. 1.8V/2.85V power SGMII MDIO pull-up domain.
  • Page 34 LTE Standard Module Series EC25 Hardware Design max=0.45V min=1.35V 1.8V power domain. SDC1_ WLAN SDIO data min=-0.3V If unused, keep it DATA3 bus D3 max=0.6V open. min=1.2V max=2.0V max=0.45V min=1.35V 1.8V power domain. SDC1_ WLAN SDIO data min=-0.3V If unused, keep it DATA2 bus D2 max=0.6V...
  • Page 35 LTE Standard Module Series EC25 Hardware Design 1.8V power domain. min=-0.3V Cannot be pulled up COEX_UART LTE/WLAN&BT max=0.6V before startup. coexistence signal min=1.2V If unused, keep it max=2.0V open. 1.8V power domain. Cannot be pulled up COEX_UART LTE/WLAN&BT max=0.45V before startup. coexistence signal min=1.35V If unused, keep it...
  • Page 36 LTE Standard Module Series EC25 Hardware Design Other Interface Pins Pin Name Pin No. Description DC Characteristics Comment 1.8V power domain. Cannot be pulled up min=-0.3V before startup. max=0.6V WAKEUP_IN Sleep mode control Low level wakes up min=1.2V the module. max=2.0V If unused, keep it open.

  • Page 37: Operating Modes

    LTE Standard Module Series EC25 Hardware Design NOTES PCM interface pins are multiplexing pins used for audio design on EC25 module and BT function on FC20 module. 2. SD card, wireless connectivity and SGMII interfaces pins are not supported on ThreadX modules. 3.

  • Page 38: Uart Application

    LTE Standard Module Series EC25 Hardware Design 3.5.1.1. UART Application If the host communicates with module via UART interface, the following preconditions can let the module enter sleep mode.  Execute AT+QSCLK=1 command to enable sleep mode.  Drive DTR to high level. The following figure shows the connection between the module and the host.

  • Page 39: Usb Application With Usb Suspend/Resume And Ri Function

    LTE Standard Module Series EC25 Hardware Design Figure 4: Sleep Mode Application with USB Remote Wakeup Sending data to EC25 via USB will wake up the module.  When EC25 has a URC to report, the module will send remote wake-up signals via USB bus so as to wake up the host.

  • Page 40: Usb Application Without Usb Suspend Function

    LTE Standard Module Series EC25 Hardware Design  Sending data to EC25 via USB will wake up the module.  When EC25 has a URC to report, RI signal will wake up the host. 3.5.1.4. USB Application without USB Suspend Function If the host does not support USB suspend function, USB_VBUS should be disconnected via an additional control circuit to let the module enter sleep mode.

  • Page 41: Power Supply

    LTE Standard Module Series EC25 Hardware Design Hardware: The W_DISABLE# pin is pulled up by default. Driving it to low level will let the module enter airplane mode. Software: AT+CFUN command provides the choice of the functionality level through setting <fun> into 0, 1 or 4. ...

  • Page 42: Decrease Voltage Drop

    LTE Standard Module Series EC25 Hardware Design 3.6.2. Decrease Voltage Drop The power supply range of the module is from 3.3V to 4.3V. Please make sure that the input voltage will never drop below 3.3V. The following figure shows the voltage drop during burst transmission in 2G network.

  • Page 43: Reference Design For Power Supply

    LTE Standard Module Series EC25 Hardware Design 3.6.3. Reference Design for Power Supply Power design for the module is very important, as the performance of the module largely depends on the power source. The power supply should be able to provide sufficient current up to 2.0A at least. If the voltage drop between the input and output is not too high, it is suggested that an LDO should be used to supply power for the module.

  • Page 44: Power-On/Off Scenarios

    LTE Standard Module Series EC25 Hardware Design 3.7. Power-on/off Scenarios 3.7.1. Turn on Module Using the PWRKEY The following table shows the pin definition of PWRKEY. Table 7: Pin Definition of PWRKEY Pin Name Pin No. Description Comment The output voltage is 0.8V because of PWRKEY Turn on/off the module the diode drop in the Qualcomm chipset.
  • Page 45 LTE Standard Module Series EC25 Hardware Design Figure 11: Turn on the Module by Using Keystroke The power-on scenario is illustrated in the following figure. NOTE 1 VBA T ≥500ms =0.8V PWRKEY ≤0.5V Abo ut 100ms VDD_EXT ≥100ms. Afte r this time, the BOOT_CONFIG pins ca n b e set to high level by external circuit.

  • Page 46: Turn Off Module

    LTE Standard Module Series EC25 Hardware Design NOTES 1. Please make sure that VBAT is stable before pulling down PWRKEY pin. It is recommended that the time between powering up VBAT and pulling down PWRKEY pin is no less than 30ms. 2.

  • Page 47: Reset Module

    LTE Standard Module Series EC25 Hardware Design NOTES 1. In order to avoid damaging internal flash, please do not switch off the power supply when the module works normally. Only after the module is shut down by PWRKEY or AT command, then the power supply can be cut off.

  • Page 48: U)Sim Interface

    LTE Standard Module Series EC25 Hardware Design Figure 15: Reference Circuit of RESET_N by Using Button The reset scenario is illustrated in the following figure. Figure 16: Timing of Resetting Module NOTES Use RESET_N only when failed to turn off the module by AT+QPOWD command and PWRKEY pin. Ensure that there is no large capacitance on PWRKEY and RESET_N pins.
  • Page 49 LTE Standard Module Series EC25 Hardware Design Table 9: Pin Definition of (U)SIM Interface Pin Name Pin No. Description Comment Either 1.8V or 3.0V is supported USIM_VDD Power supply for (U)SIM card by the module automatically. USIM_DATA Data signal of (U)SIM card USIM_CLK Clock signal of (U)SIM card USIM_RST...
  • Page 50 LTE Standard Module Series EC25 Hardware Design Figure 18: Reference Circuit of (U)SIM Interface with a 6-pin (U)SIM Card Connector In order to enhance the reliability and availability of the (U)SIM card in customers’ applications, please follow the criteria below in (U)SIM circuit design: ...

  • Page 51: Usb Interface

    LTE Standard Module Series EC25 Hardware Design 3.10. USB Interface EC25 contains one integrated Universal Serial Bus (USB) interface which complies with the USB 2.0 specification and supports high-speed (480Mbps) and full-speed (12Mbps) modes. The USB interface can only serves as a slave device and is used for AT command communication, data transmission, GNSS NMEA sentences output, software debugging, firmware upgrade and voice over USB.

  • Page 52: Uart Interfaces

    LTE Standard Module Series EC25 Hardware Design A common mode choke L1 is recommended to be added in series between the module and customer’s MCU in order to suppress EMI spurious transmission. Meanwhile, the 0Ω resistors (R3 and R4) should be added in series between the module and the test points so as to facilitate debugging, and the resistors are not mounted by default.
  • Page 53 LTE Standard Module Series EC25 Hardware Design Request to send Data terminal ready, sleep mode control Transmit data Receive data Table 12: Pin Definition of Debug UART Interface Pin Name Pin No. Description Comment DBG_TXD Transmit data 1.8V power domain DBG_RXD Receive data The logic levels are described in the following table.
  • Page 54 LTE Standard Module Series EC25 Hardware Design VDD_EXT VCCA VCCB VDD_MCU 0.1uF 0.1uF 120K RI_MCU DCD_MCU Translator CTS_MCU RTS_MCU DTR_MCU TXD_MCU RXD_MCU Figure 20: Reference Circuit with Translator Chip Please visit http://www.ti.com for more information. Another example with transistor translation circuit is shown as below. The circuit design of dotted line section can refer to the design of solid line section, in terms of both module’s input and output circuit designs, but please pay attention to the direction of connection.

  • Page 55: Pcm And I2C Interfaces

    LTE Standard Module Series EC25 Hardware Design 3.12. PCM and I2C Interfaces EC25 provides one Pulse Code Modulation (PCM) digital interface for audio design, which supports the following modes and one I2C interface: Primary mode (short frame synchronization, works as both master and slave) ...
  • Page 56 LTE Standard Module Series EC25 Hardware Design Figure 23: Auxiliary Mode Timing The following table shows the pin definition of PCM and I2C interfaces which can be applied on audio codec design. Table 14: Pin Definition of PCM and I2C Interfaces Pin Name Pin No.

  • Page 57: Sd Card Interface

    LTE Standard Module Series EC25 Hardware Design Figure 24: Reference Circuit of PCM Application with Audio Codec NOTES It is recommended to reserve an RC (R=22Ω, C=22pF) circuits on the PCM lines, especially for PCM_CLK. EC25 works as a master device pertaining to I2C interface. 3.13.
  • Page 58 LTE Standard Module Series EC25 Hardware Design SDC2_CMD SD card SDIO bus command 1.8V/2.85V configurable. Cannot be used for SD VDD_SDIO SD card SDIO bus pull up power card power. If unused, keep it open. 1.8V power domain. SD_INS_DET SD card insertion detection If unused, keep it open.

  • Page 59: Wireless Connectivity Interfaces

    LTE Standard Module Series EC25 Hardware Design  It is important to route the SDIO signal traces with total grounding. The impedance of SDIO data trace is 50Ω (±10%).  Make sure the adjacent trace spacing is two times of the trace width and the load capacitance of SDIO bus should be less than 15pF.
  • Page 60 PCM_CLK PCM data bit clock 1.8V power domain BT function control via FC20 1.8V power domain BT_EN module. Active high. The following figure shows a reference design of wireless connectivity interfaces with Quectel FC20 module. EC25_Hardware_Design 59 / 130...
  • Page 61 LTE Standard Module Series EC25 Hardware Design Module FC20 Module DCDC/LDO PM_ENABL E VDD_3V3 POWER VDD_EXT SDC1_DATA3 SDIO_D3 SDC1_DATA2 SDIO_D2 SDC1_DATA1 SDIO_D1 SDC1_DATA0 SDIO_D0 WLAN SDC1_CLK SDIO_CLK SDC1_CMD SDIO_CMD WLAN_EN WLAN_EN WLAN_SLP_CLK 32KHZ_IN WAKE_ON_WIREL ESS WAKE_ON_WIREL ESS COEX_UART_RX LTE_UART_TXD COEX COEX_UART_TX LTE_UART_RXD BT_EN...

  • Page 62: Wlan Interface

    LTE Standard Module Series EC25 Hardware Design 3.14.1. WLAN Interface EC25 provides a low-power SDIO 3.0 interface and control interface for WLAN design. SDIO interface supports SDR mode (up to 50MHz). As SDIO signals are very high-speed, in order to ensure the SDIO interface design corresponds with the SDIO 3.0 specification, please comply with the following principles: ...

  • Page 63: Sgmii Interface

    LTE Standard Module Series EC25 Hardware Design Table 17: Pin Definition of ADC Interfaces Pin Name Pin No. Description ADC0 General purpose analog to digital converter ADC1 General purpose analog to digital converter The following table describes the characteristic of ADC function. Table 18: Characteristic of ADC Parameter Min.
  • Page 64 LTE Standard Module Series EC25 Hardware Design Table 19: Pin Definition of SGMII Interface Pin Name Pin No. Description Comment Control Signal Part EPHY_RST_N 119 Ethernet PHY reset 1.8V/2.85V power domain EPHY_INT_N Ethernet PHY interrupt 1.8V power domain SGMII MDIO (Management Data SGMII_MDATA 121 1.8V/2.85V power domain Input/Output) data...

  • Page 65: Network Status Indication

    LTE Standard Module Series EC25 Hardware Design Figure 28: Reference Circuit of SGMII Interface with PHY AR8033 Application In order to enhance the reliability and availability in customers’ applications, please follow the criteria below in the Ethernet PHY circuit design: ...
  • Page 66 LTE Standard Module Series EC25 Hardware Design Table 20: Pin Definition of Network Connection Status/Activity Indicator Pin Name Pin No. Description Comment 1.8V power domain Indicate the module’s network NET_MODE Cannot be pulled up registration mode before startup Indicate the module’s network activity NET_STATUS 1.8V power domain status...

  • Page 67: Status

    LTE Standard Module Series EC25 Hardware Design 3.18. STATUS The STATUS pin is an open drain output for indicating the module’s operation status. It can be connected to a GPIO of DTE with a pull-up resistor, or as LED indication circuit as below. When the module is turned on normally, the STATUS will present the low state.

  • Page 68: Usb_Boot Interface

    LTE Standard Module Series EC25 Hardware Design NOTE URC can be outputted from UART port, USB AT port and USB modem port through configuration via AT+QURCCFG command. The default port is USB AT port. In addition, RI behavior can be configured flexibly. The default behaviors of the RI is shown as below. Table 23: Behaviors of RI State Response...
  • Page 69 LTE Standard Module Series EC25 Hardware Design Module VDD_EXT Test point 4.7K USB_BOOT Close to test point Figure 31: Reference Circuit of USB_BOOT Interface NOTE 1 VBAT ≥500ms V H =0.8V PWRKEY V IL ≤0.5V About 100ms USB_BOOT can be pul led up to 1.8V before VDD_EXT VDD_EXT Is powered up, and the module will enter emerge ncy download mode wh en i t is...

  • Page 70: Gnss Receiver

    LTE Standard Module Series EC25 Hardware Design GNSS Receiver 4.1. General Description EC25 includes a fully integrated global navigation satellite system solution that supports Gen8C-Lite of Qualcomm (GPS, GLONASS, BeiDou, Galileo and QZSS). EC25 supports standard NMEA-0183 protocol, and outputs NMEA sentences at 1Hz data update rate via USB interface by default.

  • Page 71: Layout Guidelines

    LTE Standard Module Series EC25 Hardware Design Autonomous Hot start @open sky XTRA enabled Accuracy Autonomous CEP-50 <2.5 (GNSS) @open sky NOTES Tracking sensitivity: the lowest GNSS signal value at the antenna port on which the module can keep on positioning for 3 minutes. Reacquisition sensitivity: the lowest GNSS signal value at the antenna port on which the module can fix position again within 3 minutes after loss of lock.

  • Page 72: Antenna Interfaces

    LTE Standard Module Series EC25 Hardware Design Antenna Interfaces EC25 antenna interfaces include a main antenna interface, an Rx-diversity antenna interface which is used to resist the fall of signals caused by high speed movement and multipath effect, and a GNSS antenna interface.
  • Page 73 LTE Standard Module Series EC25 Hardware Design WCDMA B2 1850~1910 1930~1990 WCDMA B4 1710~1755 2110~2155 WCDMA B5 824~849 869~894 WCDMA B6 830~840 875~885 WCDMA B8 880~915 925~960 WCDMA B19 830~845 875~890 LTE-FDD B1 1920~1980 2110~2170 LTE-FDD B2 1850~1910 1930~1990 LTE-FDD B3 1710~1785 1805~1880 LTE-FDD B4...

  • Page 74: Reference Design Of Rf Antenna Interface

    LTE Standard Module Series EC25 Hardware Design LTE-FDD B71 663~698 617~652 5.1.3. Reference Design of RF Antenna Interface A reference design of ANT_MAIN and ANT_DIV antenna pads is shown as below. A π-type matching circuit should be reserved for better RF performance. The capacitors are not mounted by default. Figure 33: Reference Circuit of RF Antenna Interface NOTES Keep a proper distance between the main antenna and the Rx-diversity antenna to improve the...
  • Page 75 LTE Standard Module Series EC25 Hardware Design Figure 34: Microstrip Design on a 2-layer PCB Figure 35: Coplanar Waveguide Design on a 2-layer PCB Figure 36: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) EC25_Hardware_Design 74 / 130...

  • Page 76: Gnss Antenna Interface

    LTE Standard Module Series EC25 Hardware Design Figure 37: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) In order to ensure RF performance and reliability, the following principles should be complied with in RF layout design: ...
  • Page 77 LTE Standard Module Series EC25 Hardware Design Table 29: GNSS Frequency Type Frequency Unit 1575.42±1.023 GLONASS 1597.5~1605.8 Galileo 1575.42±2.046 BeiDou 1561.098±2.046 QZSS 1575.42 A reference design of GNSS antenna is shown as below. Figure 38: Reference Circuit of GNSS Antenna NOTES An external LDO can be selected to supply power according to the active antenna requirement.

  • Page 78: Antenna Installation

    LTE Standard Module Series EC25 Hardware Design 5.3. Antenna Installation 5.3.1. Antenna Requirement The following table shows the requirements on main antenna, Rx-diversity antenna and GNSS antenna. Table 30: Antenna Requirements Type Requirements Frequency range: 1559MHz~1609MHz Polarization: RHCP or linear VSWR: <...

  • Page 79: Recommended Rf Connector For Antenna Installation

    LTE Standard Module Series EC25 Hardware Design 5.3.2. Recommended RF Connector for Antenna Installation If RF connector is used for antenna connection, it is recommended to use U.FL-R-SMT connector provided by Hirose. Figure 39: Dimensions of the U.FL-R-SMT Connector (Unit: mm) U.FL-LP serial connectors listed in the following figure can be used to match the U.FL-R-SMT.
  • Page 80 LTE Standard Module Series EC25 Hardware Design The following figure describes the space factor of mated connector. Figure 41: Space Factor of Mated Connector (Unit: mm) For more details, please visit http://www.hirose.com. EC25_Hardware_Design 79 / 130...

  • Page 81: Electrical, Reliability And Radio Characteristics

    LTE Standard Module Series EC25 Hardware Design Electrical, Reliability and Radio Characteristics 6.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table. Table 31: Absolute Maximum Ratings Parameter Min.

  • Page 82: Power Supply Ratings

    LTE Standard Module Series EC25 Hardware Design 6.2. Power Supply Ratings Table 32: Power Supply Ratings Parameter Description Conditions Min. Typ. Max. Unit The actual input voltages VBAT_BB and must be kept between the VBAT_RF minimum and maximum VBAT values. Voltage drop during Maximum power control burst transmission...

  • Page 83: Current Consumption

    LTE Standard Module Series EC25 Hardware Design and no harm to radio network. Only one or more parameters like P might reduce in their value and exceed the specified tolerances. When the temperature returns to the normal operation temperature levels, the module will meet 3GPP specifications again. “*”...
  • Page 84 LTE Standard Module Series EC25 Hardware Design LTE-TDD PF=64 (USB disconnected) 20.8 LTE-TDD PF=64 (USB connected) 32.0 EGSM900 4DL/1UL @33.22dBm 271.0 EGSM900 3DL/2UL @33.0dBm 464.0 EGSM900 2DL/3UL @30.86dBm 524.0 GPRS data EGSM900 1DL/4UL @29.58dBm 600.0 transfer DCS1800 4DL/1UL @29.92dBm 192.0 (GNSS OFF) DCS1800 3DL/2UL @29.84dBm 311.0...
  • Page 85 LTE Standard Module Series EC25 Hardware Design transfer LTE-FDD B3 @23.54dBm 774.0 (GNSS OFF) LTE-FDD B5 @22.83dBm 762.0 LTE-FDD B7 @23.37dBm 842.0 LTE-FDD B8 @23.48dBm 720.0 LTE-FDD B20 @22.75dBm 714.0 LTE-TDD B38 @23.05dBm 481.0 LTE-TDD B40 @23.17dBm 431.8 LTE-TDD B41 @23.02dBm 480.0 EGSM900 PCL=5 @33.08dBm 264.0...
  • Page 86 LTE Standard Module Series EC25 Hardware Design LTE-FDD PF=64 (USB connected) 31.0 WCDMA B2 HSDPA @21.9dBm 591.0 WCDMA B2 HSUPA @21.62dBm 606.0 WCDMA data WCDMA B4 HSDPA @22.02dBm 524.0 transfer WCDMA B4 HSUPA @21.67dBm 540.0 (GNSS OFF) WCDMA B5 HSDPA @22.71dBm 490.0 WCDMA B5 HSUPA @22.58dBm 520.0...
  • Page 87 LTE Standard Module Series EC25 Hardware Design Table 37: EC25-J Current Consumption Parameter Description Conditions Typ. Unit AT+CFUN=0 (USB disconnected) WCDMA PF=64 (USB disconnected) WCDMA PF=128 (USB disconnected) Sleep state LTE-FDD PF=64 (USB disconnected) LTE-FDD PF=128 (USB disconnected) LTE-TDD PF=64 (USB disconnected) LTE-TDD PF=128 (USB disconnected) WCDMA PF=64 (USB disconnected) 29.6...
  • Page 88 LTE Standard Module Series EC25 Hardware Design LTE-FDD B8 @23.32dBm 882.3 LTE-FDD B18 @23.61dBm 867.0 LTE-FDD B19 @23.67dBm 911.4 LTE-FDD B26 @22.86dBm 909.6 LTE-TDD B41 @22.40dBm 563.4 WCDMA B1 @23.23dBm 964.8 WCDMA B6 @23.02dBm 667.9 WCDMA voice call WCDMA B8 @23.12dBm 735.4 WCDMA B19 @22.99dBm 664.8...
  • Page 89 LTE Standard Module Series EC25 Hardware Design EGSM900 DRX=5 (USB disconnected) 22.0 EGSM900 DRX=5 (USB connected) 34.0 WCDMA PF=64 (USB disconnected) 22.0 Idle state WCDMA PF=64 (USB connected) 33.0 LTE-FDD PF=64 (USB disconnected) 24.0 LTE-FDD PF=64 (USB connected) 35.0 GSM850 1UL/4DL @32.53dBm 232.0 GSM850 2UL/3DL @32.34dBm 384.0...
  • Page 90 LTE Standard Module Series EC25 Hardware Design GSM850 4UL/1DL @26.53dBm 416.0 EGSM900 1UL/4DL @26.64dBm 157.0 EGSM900 2UL/3DL @26.95dBm 251.0 EGSM900 3UL/2DL @26.57dBm 340.0 EGSM900 4UL/1DL @26.39dBm 431.0 DCS1800 1UL/4DL @26.03dBm 152.0 DCS1800 2UL/3DL @25.62dBm 240.0 DCS1800 3UL/2DL @25.42dBm 325.0 DCS1800 4UL/1DL @25.21dBm 415.0 PCS1900 1UL/4DL @25.65dBm 148.0...
  • Page 91 LTE Standard Module Series EC25 Hardware Design LTE-FDD B5 @23.45dBm 687.0 LTE-FDD B7 @22.84dBm 843.0 LTE-FDD B8 @22.92dBm 689.0 LTE-FDD B28 @23.23dBm 804.0 LTE-TDD B40 @23.3dBm 429.0 GSM850 PCL5 @32.66dBm 228.0 EGSM900 PCL5 @32.59dBm 235.0 GSM voice call DCS1800 PCL0 @29.72dBm 178.0 PCS1900 PCL0 @29.82dBm 170.0...
  • Page 92 LTE Standard Module Series EC25 Hardware Design WCDMA B1 HSDPA @22.24dBm 500.0 WCDMA data WCDMA B1 HSUPA @22.05dBm 499.0 transfer WCDMA B5 HSDPA @22.39dBm 418.0 (GNSS OFF) WCDMA B5 HSUPA @22dBm 486.0 LTE-FDD B1 @23.28dBm 707.0 LTE-FDD B3 @23.36dBm 782.0 LTE data LTE-FDD B5 @23.32dBm 588.0...
  • Page 93 LTE Standard Module Series EC25 Hardware Design WCDMA B2 HSDPA @22.63dBm 560.0 WCDMA B2 HSUPA @22.49dBm 564.0 WCDMA data WCDMA B4 HSDPA @22.45dBm 601.0 transfer WCDMA B4 HSUPA @22.57dBm 610.0 (GNSS OFF) WCDMA B5 HSDPA @22.49dBm 603.0 WCDMA B5 HSUPA @22.43dBm 617.0 LTE-FDD B2 @22.92dBm 698.0...
  • Page 94 LTE Standard Module Series EC25 Hardware Design WCDMA PF=512 (USB disconnected) 1.00 LTE-FDD PF=32 (USB disconnected) 2.97 LTE-FDD PF=64 (USB disconnected) 1.93 LTE-FDD PF=128 (USB disconnected) 1.43 LTE-FDD PF=256 (USB disconnected) 1.17 WCDMA PF=64 (USB disconnected) 14.9 WCDMA PF=64 (USB connected) 34.2 Idle state LTE-FDD PF=64 (USB disconnected)
  • Page 95 LTE Standard Module Series EC25 Hardware Design WCDMA B5 @22.6dBm 561.0 Table 42: EC25-EU Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down AT+CFUN=0 (USB disconnected) 1.16 GSM DRX=2 (USB disconnected) 2.74 GSM DRX=9 (USB disconnected) WCDMA PF=64 (USB disconnected) 2.15 Sleep state WCDMA PF=128 (USB disconnected)
  • Page 96 LTE Standard Module Series EC25 Hardware Design EGSM900 1DL/4UL @28.5dBm DCS1800 4DL/1UL @30.49dBm 172.0 DCS1800 3DL/2UL @29.24dBm 274.0 DCS1800 2DL/3UL @27.15dBm 337.0 DCS1800 1DL/4UL @25.88dBm 406.0 EGSM900 4DL/1UL PCL=8 @26.60dBm 142.0 EGSM900 3DL/2UL PCL=8 @25.43dBm 229.0 EGSM900 2DL/3UL PCL=8 @23.4dBm 286.0 EDGE data EGSM900 1DL/4UL PCL=8 @22.36dBm...
  • Page 97 LTE Standard Module Series EC25 Hardware Design LTE-TDD B41 @23.46dBm 451.0 EGSM900 PCL=5 @33.25dBm 258.0 voice call DCS1800 PCL=0 @30.23dBm 178.0 WCDMA B1 @23.88dBm 548.0 WCDMA voice call WCDMA B8 @23.8dBm 615.0 Table 43: EC25-EC Current Consumption Parameter Description Conditions Typ.
  • Page 98 LTE Standard Module Series EC25 Hardware Design EGSM900 1DL/4UL @28.84dBm 586.0 DCS1800 4DL/1UL @29.46dBm 156.0 DCS1800 3DL/2UL @29.41dBm 250.0 DCS1800 2DL/3UL @29.37dBm 344.0 DCS1800 1DL/4UL @29.28dBm 443.0 EGSM900 4DL/1UL PCL=8 @25.21dBm 175.0 EGSM900 3DL/2UL PCL=8 @24.80dBm 295.0 EGSM900 2DL/3UL PCL=8 @24.74dBm 397.0 EDGE data EGSM900 1DL/4UL PCL=8 @24.38dBm...
  • Page 99 LTE Standard Module Series EC25 Hardware Design call WCDMA B8 @23.33dBm 517.0 Table 44: EC25-EUX Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down AT+CFUN=0 (USB disconnected) GSM DRX=2 (USB disconnected) GSM DRX=9 (USB disconnected) WCDMA PF=64 (USB disconnected) Sleep state WCDMA PF=128 (USB disconnected) LTE-FDD PF=64 (USB disconnected)
  • Page 100 LTE Standard Module Series EC25 Hardware Design EGSM900 1DL/4UL @29.50dBm 629.3 DCS1800 4DL/1UL @29.63dBm 157.4 DCS1800 3DL/2UL @28.96dBm 246.3 DCS1800 2DL/3UL @27.49dBm 310.6 DCS1800 1DL/4UL @26.44dBm 377.7 EGSM900 4DL/1UL PCL=8 @27.27dBm 175.4 EGSM900 3DL/2UL PCL=8 @26.13dBm 292.1 EGSM900 2DL/3UL PCL=8 @24.03dBm 386.8 EDGE data EGSM900 1DL/4UL PCL=8 @23.35dBm...
  • Page 101 LTE Standard Module Series EC25 Hardware Design LTE-TDD B41 @23.17dBm 483.2 EGSM900 PCL=5 @32.81dBm 262.2 voice call DCS1800 PCL=0 @29.62dBm 151.2 WCDMA B1 @23.09dBm 594.2 WCDMA voice call WCDMA B8 @23.18dBm 504.3 Table 45: EC25-MX Current Consumption Parameter Description Conditions Typ.
  • Page 102 LTE-FDD B66 @22.68dBm 781.0 WCDMA B2 @23.47dBm 643.0 WCDMA voice WCDMA B4 @23.5dBm 633.0 call WCDMA B5 @23.5dBm 551.0 Table 46: EC25-AUX Current Consumption Parameter Description Conditions Typ. Unit OFF state Power down AT+CFUN=0 (USB disconnected) GSM DRX=2 (USB disconnected) Sleep state...
  • Page 103 LTE Standard Module Series EC25 Hardware Design transfer GSM850 3DL/2UL @31.59dBm 384.8 (GNSS OFF) GSM850 2DL/3UL @29.51dBm 452.1 GSM850 1DL/4UL @28.41dBm 542.1 EGSM900 4DL/1UL @33.27dBm 272.7 EGSM900 3DL/2UL @31.99dBm 406.9 EGSM900 2DL/3UL @29.67dBm 470.2 EGSM900 1DL/4UL @28.44dBm 547.1 DCS1800 4DL/1UL @29.44dBm 164.5 DCS1800 3DL/2UL @28.47dBm 235.7...
  • Page 104 LTE Standard Module Series EC25 Hardware Design DCS1800 2DL/3UL @23.04dBm 316.3 DCS1800 1DL/4UL @22.11dBm 411.0 PCS1900 4DL/1UL @26.24dBm 143.3 PCS1900 3DL/2UL @25.46dBm 231.4 PCS1900 2DL/3UL @23.45dBm 316.1 PCS1900 1DL/4UL @22.38dBm 411.0 WCDMA B1 HSDPA @22.60dBm 534.6 WCDMA B1 HSUPA @22.48dBm 541.3 WCDMA B2 HSDPA @21.60dBm 572.9...

  • Page 105: Rf Output Power

    LTE Standard Module Series EC25 Hardware Design GSM850 PCL5 @32.36dBm 240.3 EGSM900 PCL5 @33.15dBm 260.9 voice call DCS1800 PCL0 @29.38dBm 153.0 PCS1900 PCL0 @29.47dBm 160.3 WCDMA B1 @23.13dBm 568.9 WCDMA B2 @22.99dBm 628.4 WCDMA voice WCDMA B4 @22.90dBm 506.3 call WCDMA B5 @23.10dBm 507.5 WCDMA B8 @22.90dBm...

  • Page 106: Rf Receiving Sensitivity

    LTE Standard Module Series EC25 Hardware Design DCS1800/PCS1900 30dBm±2dB 0dBm±5dB GSM850/EGSM900 (8-PSK) 27dBm±3dB 5dBm±5dB DCS1800/PCS1900 (8-PSK) 26dBm±3dB 0dBm±5dB WCDMA bands 24dBm+1/-3dB < -49dBm LTE-FDD bands 23dBm±2dB < -39dBm LTE-TDD bands 23dBm±2dB < -39dBm NOTE In GPRS 4 slots TX mode, the maximum output power is reduced by 3.0dB. The design conforms to the GSM specification as described in Chapter 13.16 of 3GPP TS 51.010-1.
  • Page 107 LTE Standard Module Series EC25 Hardware Design LTE-FDD B8 (10MHz) -97.0dBm -97.0dBm -101.0dBm -93.3dBm LTE-FDD B20 (10MHz) -97.5dBm -99.0dBm -102.5dBm -93.3dBm LTE-TDD B38 (10MHz) -95dBm -97.0dBm -98.9dBm -96.3dBm LTE-TDD B40 (10MHz) -96.3dBm -98.0dBm -101.0dBm -96.3dBm LTE-TDD B41 (10MHz) -94.5dBm -97.0dBm -98.5dBm -94.3dBm Table 50: EC25-A Conducted RF Receiving Sensitivity...
  • Page 108 LTE Standard Module Series EC25 Hardware Design WCDMA B19 -110.5dBm -106.7dBm LTE-FDD B1 (10MHz) -97.5dBm -98.7dBm -100.2dBm -96.3dBm LTE-FDD B3 (10MHz) -96.5dBm -97.1dBm -100.5dBm -93.3dBm LTE-FDD B8 (10MHz) -98.4dBm -99.0dBm -101.2dBm -93.3dBm LTE-FDD B18 (10MHz) -99.5dBm -99.0dBm -101.7dBm -96.3dBm LTE-FDD B19 (10MHz) -99.2dBm -99.0dBm -101.4dBm...
  • Page 109 LTE Standard Module Series EC25 Hardware Design LTE-FDD B8 (10MHz) -99.2dBm -98.2dBm -102.2dBm -93.3dBm LTE-FDD B28 (10MHz) -98.6dBm -98.7dBm -102.0dBm -94.8dBm LTE-TDD B40 (10MHz) -97.2dBm -98.4dBm -101.2dBm -96.3dBm Table 54: EC25-AUT Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO 3GPP (SIMO) WCDMA B1 -110.0dBm -106.7dBm...
  • Page 110 LTE Standard Module Series EC25 Hardware Design LTE-FDD B2 (10MHz) -98.0dBm -98.5dBm -100.5dBm -94.3dBm LTE-FDD B4 (10MHz) -97.5dBm -98.2dBm -99.5dBm -96.3dBm LTE-FDD B5 (10MHz) -98.0dBm -98.5dBm -100.5dBm -94.3dBm LTE-FDD B12 (10MHz) -99.0dBm -99.5dBm -100.5dBm -93.3dBm LTE-FDD B13 (10MHz) -98.5dBm -99.5dBm -100.7dBm -93.3dBm LTE-FDD B14 (10MHz)
  • Page 111 LTE Standard Module Series EC25 Hardware Design Table 58: EC25-EU Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO 3GPP (SIMO) EGSM900 -108.5dBm -102.0dBm DCS1800 -108.5dBm -102.0dbm WCDMA B1 -109.5dBm -109.5dBm -106.7dBm WCDMA B8 -110.0dBm -111.5 dBm -103.7dBm LTE-FDD B1 (10MHz) -98.5dBm -99.0dBm -101.7dBm...
  • Page 112 LTE Standard Module Series EC25 Hardware Design LTE-FDD B8 (10MHz) -97.0dBm -97.0dBm -101.0dBm -93.3dBm LTE-FDD B20 (10MHz) -97.5dBm -99.0dBm -101.0dBm -93.3dBm LTE-FDD B28 (10MHz) -98.6dBm -98.7dBm -101.5dBm -94.8dBm Table 60: EC25-EUX Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO 3GPP (SIMO) EGSM900 -109.0dBm -102.0dBm...
  • Page 113 LTE-FDD B7 (10MHz) -97dBm -98.5dBm -101.5dBm -94.3dBm LTE-FDD B28(10MHz) -98dBm -99.3dBm -102dBm -94.8dBm LTE-FDD B66 (10MHz) -98dBm -98.4dBm -101.5dBm -95.8dBm Table 62: EC25-AUX Conducted RF Receiving Sensitivity Frequency Primary Diversity SIMO 3GPP (SIMO) GSM850 -109.0dBm -102.0dBm EGSM900 -109.0dBm -102.0dBm DCS1800 -109.0dBm -102.0dBm PCS1900 -109.0dBm...

  • Page 114: Electrostatic Discharge

    LTE Standard Module Series EC25 Hardware Design LTE-FDD B28 (10MHz) -98.0dBm -98.7dBm -101.5dBm -94.8dBm LTE-TDD B40 (10MHz) -97.5dBm -98.2dBm -101.2dBm -96.3dBm NOTE SIMO is a smart antenna technology that uses a single antenna at the transmitter side and two antennas at the receiver side, which can improve RX performance. 6.7.
  • Page 115 LTE Standard Module Series EC25 Hardware Design  Do not apply solder mask on the opposite side of the PCB area where the module is mounted, so as to ensure better heat dissipation performance.  The reference ground of the area where the module is mounted should be complete, and add ground vias as many as possible for better heat dissipation.
  • Page 116 LTE Standard Module Series EC25 Hardware Design NOTES The module offers the best performance when the internal BB chip stays below 105°C. When the maximum temperature of the BB chip reaches or exceeds 105°C, the module works normal but provides reduced performance (such as RF output power, data rate, etc.). When the maximum BB chip temperature reaches or exceeds 115°C, the module will disconnect from the network, and it will recover to network connected state after the maximum temperature falls below 115°C.

  • Page 117: Mechanical Dimensions

    LTE Standard Module Series EC25 Hardware Design Mechanical Dimensions This chapter describes the mechanical dimensions of the module. All dimensions are measured in mm, and the dimensional tolerances are ±0.05mm unless otherwise specified. 7.1. Mechanical Dimensions of the Module 2.4±0.2 32.0±0.15 Figure 44: Module Top and Side Dimensions EC25_Hardware_Design...
  • Page 118 LTE Standard Module Series EC25 Hardware Design 32.0 ＋ /-0.15 1.90 1.30 3.85 Pin 1 1.30 5.96 0.87 1.15 2.15 4.82 1.05 4.37 2.49 3.45 Figure 45: Module Bottom Dimensions (Bottom View) EC25_Hardware_Design 117 / 130...

  • Page 119: Recommended Footprint

    LTE Standard Module Series EC25 Hardware Design 7.2. Recommended Footprint Figure 46: Recommended Footprint (Top View) NOTES The keepout area should not be designed. For easy maintenance of the module, please keep about 3mm between the module and other components in the host PCB.

  • Page 120: Design Effect Drawings Of The Module

    7.3. Design Effect Drawings of the Module Figure 47: Top View of the Module Figure 48: Bottom View of the Module NOTE These are renderings of EC25 module. For authentic appearance, please refer to the module that you receive from Quectel. EC25_Hardware_Design 119 / 130...

  • Page 121: Storage, Manufacturing And Packaging

    LTE Standard Module Series EC25 Hardware Design Storage, Manufacturing and Packaging 8.1. Storage EC25 is stored in a vacuum-sealed bag. It is rated at MSL 3, and its storage restrictions are listed below. 1. Shelf life in vacuum-sealed bag: 12 months at <40ºC/90%RH. 2.

  • Page 122: Manufacturing And Soldering

    LTE Standard Module Series EC25 Hardware Design 8.2. Manufacturing and Soldering Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. The force on the squeegee should be adjusted properly so as to produce a clean stencil surface on a single pass.

  • Page 123: Packaging

    LTE Standard Module Series EC25 Hardware Design Max slope 2~3°C/sec Reflow time (D: over 220°C) 40~60sec Max temperature 238~245°C Cooling down slope 1~4°C/sec Reflow Cycle Max reflow cycle 8.3. Packaging EC25 is packaged in tap and reel carriers. Each reel is 11.88m long and contains 250pcs modules. The figure below shows the package details, measured in mm.
  • Page 124 LTE Standard Module Series EC25 Hardware Design 48.5 C o v e r t a p e D i r e c t i o n o f f e e d +0.20 44.5 -0.00 Figure 50: Tape and Reel Specifications 1083 Carrier tape Carrier tape...
  • Page 125 LTE Standard Module Series EC25 Hardware Design Appendix A References Table 65: Related Documents Document Name Remark Power management application note Quectel_EC2x&EGxx_Power_Management_ for EC25, EC21, EC20 R2.0, EC20 Application_Note R2.1, EG95, EG91 EG25-G modules AT commands manual for EC25, EC21, Quectel_EC2x&EG9x&EM05_AT_Commands_ EC20 R2.0, EC20 R2.1, EG91, EG95 Manual...
  • Page 126 LTE Standard Module Series EC25 Hardware Design Circuit Switched Data Clear To Send DC-HSPA+ Dual-carrier High Speed Packet Access DFOTA Delta Firmware Upgrade Over-The-Air Downlink Data Terminal Ready Discontinuous Transmission Enhanced Full Rate Electrostatic Discharge Frequency Division Duplex Full Rate GLObalnaya NAvigatsionnaya Sputnikovaya Sistema, the Russian Global GLONASS Navigation Satellite System...
  • Page 127 LTE Standard Module Series EC25 Hardware Design MIMO Multiple Input Multiple Output Mobile Originated Mobile Station (GSM engine) Mobile Terminated Password Authentication Protocol Printed Circuit Board Protocol Data Unit Point-to-Point Protocol Quadrature Amplitude Modulation QPSK Quadrature Phase Shift Keying Radio Frequency RHCP Right Hand Circularly Polarized Receive...
  • Page 128 LTE Standard Module Series EC25 Hardware Design Vmax Maximum Voltage Value Vnorm Normal Voltage Value Vmin Minimum Voltage Value Maximum Input High Level Voltage Value Minimum Input High Level Voltage Value Maximum Input Low Level Voltage Value Minimum Input Low Level Voltage Value Absolute Maximum Input Voltage Value Absolute Minimum Input Voltage Value Maximum Output High Level Voltage Value...
  • Page 129 LTE Standard Module Series EC25 Hardware Design Appendix B GPRS Coding Schemes Table 67: Description of Different Coding Schemes CS-1 CS-2 CS-3 CS-4 Scheme Code Rate Pre-coded USF Radio Block excl.USF and BCS Tail Coded Bits Punctured Bits 9.05 13.4 15.6 21.4 Data Rate Kb/s...
  • Page 130 LTE Standard Module Series EC25 Hardware Design Appendix C GPRS Multi-slot Classes Thirty-three classes of GPRS multi-slot modes are defined for MS in GPRS specification. Multi-slot classes are product dependent, and determine the maximum achievable data rates in both the uplink and downlink directions.
  • Page 131 LTE Standard Module Series EC25 Hardware Design EC25_Hardware_Design 130 / 130...
  • Page 132 LTE Standard Module Sires EC25 Hardware Design Appendix D EDGE Modulation and Coding Schemes Table 69: EDGE Modulation and Coding Schemes Coding Scheme Modulation Coding Family 1 Timeslot 2 Timeslot 4 Timeslot CS-1: GMSK 9.05kbps 18.1kbps 36.2kbps CS-2: GMSK 13.4kbps 26.8kbps 53.6kbps CS-3:...
  • Page 133 1.1. FCC Certification Requirements. According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a mobile device. And the following conditions must be met: 1. This Modular Approval is limited to OEM installation for mobile and fixed applications only. The antenna installation and operating configurations of this transmitter, including any applicable source-based time- averaging duty factor, antenna gain and cable loss must satisfy MPE categorical Exclusion Requirements of 2.1091.
  • Page 134 For portable devices, in addition to the conditions 3 through 6 described above, a separate approval is required to satisfy the SAR requirements of FCC Part 2.1093 If the device is used for other equipment that separate approval is required for all other operating configurations, including portable configurations with respect to 2.1093 and different antenna configurations.
  • Page 135 this section may be included in the manual in that alternative form, provided the user can reasonably be expected to have the capability to access information in that form. This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

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