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Quectel EC21 Series Hardware Design

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EC21 Series
Hardware Design
LTE Standard Module Series
Version: 1.9
Date: 2021-08-17
Status: Released

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Summary of Contents for Quectel EC21 Series

  • Page 1 EC21 Series Hardware Design LTE Standard Module Series Version: 1.9 Date: 2021-08-17 Status: Released...
  • Page 2 Furthermore, the Receiving Party shall not disclose any of the Quectel's documentation and information to any third party without the prior written consent by Quectel. For any noncompliance to the above requirements, unauthorized use, or other illegal or malicious use of the documentation and information, Quectel will reserve the right to take legal action.
  • Page 3 LTE Standard Module Series Copyright The information contained here is proprietary technical information of Quectel Wireless Solutions Co., Ltd. Transmitting, reproducing, disseminating and editing this document as well as using the content without permission are forbidden. Offenders will be held liable for payment of damages. All rights are reserved in the event of a patent grant or registration of a utility model or design.

  • Page 4: Safety Information

    Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers’ failure to comply with these precautions.
  • Page 5 LTE Standard Module Series metal powders. EC21_Series_Hardware_Design 4 / 118...

  • Page 6: About The Document

    LTE Standard Module Series About the Document Revision History Version Date Author Description 2016-04-15 Yeoman CHEN Initial 1. Updated frequency bands in Table 1. 2. Updated transmitting power, supported maximum baud rate of main UART, supported internet protocols, supported USB drivers of USB interface, and temperature range in Table 2.
  • Page 7 2018-03-05 Lyndon LIU/ 11. Updated module operating frequencies in Table 26. Frank WANG 12. Updated EC21 series modules current consumption in Chapter 6.5. 13. Updated EC21 series modules conducted RF receiving sensitivity in Chapter 6.6. 14. Added thermal consideration description in Chapter 6.8.
  • Page 8 LTE Standard Module Series 20. Updated storage information in Chapter 8.1 1. Added new variants EC21-EU and related information. 2. Updated star structure of the power supply in Figure 3. Updated power-on scenario of module in Figure 12. 4. Updated reference circuit with translator chip in Figure 20.
  • Page 9 5. Updated the AT command be used to disable the receive diversity in Chapter 5.1.3. Added the related information of EC21-EUX. Added the Wi-Fi&Bluetooth module FC21 for use with EC21 series module. Deleted the related information of EC21-EC and EC21-AUV. Updated the USB serial drivers (Chapter 2.2).

  • Page 10: Table Of Contents

    LTE Standard Module Series Contents Safety Information..............................3 About the Document..............................5 Contents..................................9 Table Index.................................12 Figure Index................................14 Introduction............................... 16 1.1. Special Marks............................18 Product Overview.............................19 2.1. Frequency Bands and Functions....................... 19 2.2. Features............................20 2.3. Functional Diagram..........................23 2.4. EVB................................. 24 Application Interfaces.............................25 3.1.
  • Page 11 LTE Standard Module Series 3.14. Interfaces for WLAN & Bluetooth Applications................58 3.14.1. WLAN Application Interface......................61 3.14.2. Bluetooth Application Interface....................61 3.15. Interfaces............................61 3.16. SGMII Interface............................. 62 3.17. Network Status Indication........................64 3.18. STATUS..............................66 3.19. RI................................67 3.20. USB_BOOT Interface...........................67 Specifications.............................
  • Page 12 LTE Standard Module Series Appendix References............................116 EC21_Series_Hardware_Design 11 / 118...
  • Page 13 LTE Standard Module Series Table Index Table 1: Special Marks..............................18 Table 2: Supported Frequency Bands and GNSS Function of EC21 Series Module........19 Table 3: Key Features of EC21 Series Module....................20 Table 4: I/O Parameters Definition..........................27 Table 5: Pin Description............................27...
  • Page 14 Consumption......................98 Table 53: EC21-AUX Current Consumption......................98 Table 54: EC21-EUX Current Consumption....................... 102 Table 55: GNSS Current Consumption of EC21 Series Module..............104 Table 56: Electrostatics Discharge Characteristics (Temperature: 25 ºC, Humidity: 45 %)....... 104 Table 57: Recommended Thermal Profile Parameters..................
  • Page 15 LTE Standard Module Series Figure Index Figure 1: Functional Diagram..........................23 Figure 2: Pin Assignment (Top View)........................26 Figure 3: Sleep Mode Application via UART......................38 Figure 4: Sleep Mode Application with USB Remote Wakeup................38 Figure 5: Sleep Mode Application with RI......................39 Figure 6: Sleep Mode Application Without Suspend Function................40...
  • Page 16 LTE Standard Module Series Figure 42: Referenced Heatsink Design (Heatsink at the Top of the Module)..........105 Figure 43: Referenced Heatsink Design (Heatsink at the Backside of Customers’ PCB)......105 Figure 44: Module Top and Side Dimensions.....................107 Figure 45: Module Bottom Dimensions (Bottom View)..................108 Figure 46: Recommended Footprint (Top View)....................

  • Page 17: Introduction

    EC21 series module. To facilitate its application in different fields, relevant reference design is also provided for customers’ reference. Associated with application note and user guide, customers can use EC21 series module to design and set up mobile applications easily.
  • Page 18 LTE Standard Module Series permanently affixed label, the module must be labeled with an FCC ID - Section 2.926 (see 2.2 Certification (labeling requirements) above). The OEM manual must provide clear instructions explaining to the OEM the labeling requirements, options and OEM user manual instructions that are required (see next paragraph).

  • Page 19: Special Marks

    LTE Standard Module Series L'autre utilisé pour l'émetteur doit être installé pour fournir une distance de séparation d'au moins 20 cm de toutes les personnes et ne doit pas être colocalisé ou fonctionner conjointement avec une autre antenne ou un autre émetteur. The host product shall be properly labeled to identify the modules within the host product.

  • Page 20: Product Overview

    B28A GNSS function is optional. EC21 series module contains Data + Voice version and Data-only version. Data + Voice version supports voice and data functions, while Data-only version only supports data function. B2 of EC21-AU and EC21-AUX module does not support Rx-diversity.

  • Page 21: Key Features

    √ B28A With a compact profile of 29.0 mm × 32.0 mm × 2.4 mm, EC21 series module can meet almost all requirements for M2M applications such as metering, tracking system, security, router, wireless POS, mobile computing device, PDA phone, tablet PC, etc.
  • Page 22 LTE Standard Module Series  Class E2 (27 dBm ±3 dB) for EGSM900 8-PSK Class E2 (26 dBm ±3 dB) for DCS1800 8-PSK   Class E2 (26 dBm ±3 dB) for PCS1900 8-PSK  Class 3 (24 dBm +1/-3 dB) for WCDMA bands Class 3 (23 dBm ±2 dB) for LTE-FDD bands ...
  • Page 23 GNSS Features  Data update rate: 1 Hz by default  Compliant with 3GPP TS 27.007, 3GPP TS 27.005 AT Commands Quectel enhanced AT commands  Network Status Two pins including NET_MODE and NET_STATUS to indicate network Indication connectivity status ...

  • Page 24: Functional Diagram

    USB 2.0 interface or DFOTA RoHS All hardware components are fully compliant with EU RoHS directive 2.3. Functional Diagram The following figure shows a block diagram of EC21 series and illustrates the major functional parts. Power management   Baseband ...

  • Page 25: Evb

    LTE Standard Module Series 2.4. EVB To help customers develop applications with EC21 series, Quectel supplies an evaluation board (UMTS&LTE EVB), USB to RS-232 converter cable, earphone, antenna and other peripherals to control or test the module. For more details, see document [1].

  • Page 26: Application Interfaces

    LTE Standard Module Series Application Interfaces 3.1. General Description EC21 series module is equipped with 80 LCC pins plus 64 LGA pins that can be connected to cellular application platform. The subsequent chapters will provide detailed descriptions of the following interfaces/functions.

  • Page 27: Pin Assignment

    LTE Standard Module Series 3.2. Pin Assignment The following figure shows the pin assignment of EC21 series module. WAKEUP_IN AP_READY RESERVED W_DISABLE# NET_MODE NET_ST ATUS ANT_MAIN VDD_EXT RESERVED RESERVED RESERVED RESERVED ANT_GNSS USIM_GND ADC0 DBG_RXD ADC1 DBG_TXD RESERVED I2C_SDA USIM_PRESENCE...

  • Page 28: Pin Description

    Bluetooth function is under development. Pins 119–126 and pin 128 are used for SGMII interface. Pins 24–27 for PCM function are used for audio design on EC21 series module and Bluetooth function on FC20 series/FC21 modules. Keep all RESERVED pins and unused pins unconnected.
  • Page 29 LTE Standard Module Series It must be provided Vmax = 4.3 V Power supply for with sufficient current VBAT_RF 57, 58 Vmin = 3.3 V module’s RF part up to 1.8 A in a burst Vnom = 3.8 V transmission. Power supply for external GPIO’s pull- up circuits.
  • Page 30 LTE Standard Module Series Indicate the 1.8 V power domain. min = 1.35 V NET_STATUS module’s network If unused, keep it max = 0.45 V activity status open. USB Interface Pin Name Pin No. Description Comment Characteristics Vmax = 5.25 V USB connection USB_VBUS Vmin = 3.0 V...
  • Page 31 LTE Standard Module Series min = 2.55 V 1.8 V (U)SIM： max = 0.45 V min = 1.35 V USIM_CLK (U)SIM card clock 3.0 V (U)SIM： max = 0.45 V min = 2.55 V 1.8 V (U)SIM： max = 0.45 V min = 1.35 V USIM_RST (U)SIM card reset...
  • Page 32 If unused, keep them I2C serial data (for I2C_SDA open. external codec) SD Card Interface The pins of PCM interface are used for audio design on EC21 series module and Bluetooth function on FC20 series/FC21 modules. EC21_Series_Hardware_Design 31 / 118...
  • Page 33 LTE Standard Module Series Pin Name Pin No. Description Comment Characteristics SD card SDIO data 1.8 V signaling: SDC2_DATA3 bit 3 max = 0.45 V min = 1.4 V SD card SDIO data SDC2_DATA2 min = -0.3 V bit 2 SDIO signal level can max = 0.58 V SD card SDIO data...
  • Page 34 LTE Standard Module Series Configurable power supply. 1.8/2.85 V power SD card SDIO pull- domain. VDD_SDIO max = 50 mA up power Cannot be used for SD card power supply. If unused, keep it open. SGMII Interface Pin Name Pin No. Description Comment Characteristics...
  • Page 35 LTE Standard Module Series 0.1 μF capacitor, and close to the PHY side. SGMII_TX_P SGMII transmit (+) If unused, keep them open. Connect it with a SGMII_RX_P SGMII receive (+) 0.1 μF capacitor, and close to the module. SGMII_RX_M SGMII receive (-) If unused, keep them open.
  • Page 36 LTE Standard Module Series before startup. If unused, keep it open. 1.8 V power domain. LTE/WLAN & min = -0.3 V Cannot be pulled up COEX_UART_ Bluetooth max = 0.6 V before startup. coexistence min = 1.2 V If unused, keep it receive max = 2.0 V open.
  • Page 37 LTE Standard Module Series open. Other Interface Pins Pin Name Pin No. Description DC Characteristics Comment 1.8 V power domain. Cannot be pulled up min = -0.3 V before startup. Sleep mode max = 0.6 V WAKEUP_IN Low level can wake control min = 1.2 V up the module.

  • Page 38: Operating Modes

    For details of the command, see document [2]. 3.5. Power Saving 3.5.1. Sleep Mode EC21 series can reduce its current consumption to a minimum value during the sleep mode. The following section describes power saving procedures of the module. 3.5.1.1. UART Application Scenario If the host communicates with module via UART interface, the following preconditions can let the module enter sleep mode.

  • Page 39: Usb Application With Usb Remote Wakeup Function

    LTE Standard Module Series The following figure shows the connection between the module and the host. Figure 3: Sleep Mode Application via UART  Driving the module’s DTR to low level will wake up the module.  When module has a URC to report, RI signal will wake up the host. See Chapter 3.19 for details about RI behaviors.

  • Page 40: Usb Application With Usb Suspend/Resume And Ri Function

    LTE Standard Module Series  Sending data to module via USB will wake up the module. When module has a URC to report, the module will send remote wake-up signals via USB bus to  wake up the host. 3.5.1.3. USB Application with USB Suspend/Resume and RI Function If the host supports USB suspend and resume, but does not support remote wake-up function, the RI signal is needed to wake up the host.

  • Page 41: Airplane Mode

    NOTE Pay attention to the voltage-level matching of the circuit in dotted line between the module and the host. For more details about EC21 series power management application, see document [4]. 3.5.2. Airplane Mode When the module enters airplane mode, the RF function will be disabled, and all AT commands related to it will be inaccessible.

  • Page 42: Power Supply

    The execution of AT+CFUN will not affect GNSS function. 3.6. Power Supply 3.6.1. Power Supply Pins EC21 series provides four VBAT pins for connection with the external power supply. There are two separate voltage domains for VBAT.  Two VBAT_RF pins for module’s RF part.

  • Page 43: Reference Design For Power Supply

    LTE Standard Module Series Figure 7: Power Supply Limits during Burst Transmission To decrease voltage-drop, use bypass capacitors of at least 100 µF with low ESR, and reserve a multi- layer ceramic chip capacitor (MLCC) array due to their low ESR. It is recommended to use at least three ceramic capacitors (100 nF, 33 pF, 10 pF) for composing the MLCC array, and place these capacitors close to VBAT_BB and VBAT_RF pins.

  • Page 44: Monitor The Power Supply

    LTE Standard Module Series to provide sufficient current up to 2.0 A at least. If the voltage drop between the input and output is not too high, it is suggested that an LDO should be used to supply power for the module. If there is a big voltage difference between the input source and the desired output (VBAT), a buck converter is preferred to be used as the power supply.
  • Page 45 LTE Standard Module Series Table 8: Pin Definition of PWRKEY Pin Name Pin No. Description Comment The output voltage is 0.8 V because of the PWRKEY Turn on/off the module diode drop in the baseband chipset. When the module is in power down mode, it can be turned on by driving the PWRKEY pin low for at least 500 ms.

  • Page 46: Turn Off Module

    LTE Standard Module Series The power-up scenario is illustrated in the following figure. Figure 12: Power-up Timing NOTE 1. Make sure that VBAT is stable before pulling down PWRKEY pin. It is recommended that the time between powering up VBAT and pulling down PWRKEY pin is no less than 30 ms. 2.

  • Page 47: Turn Off With Pwrkey

    LTE Standard Module Series  Turn off the module using AT+QPOWD. For details of the command, see document [2]. 3.7.2.1. Turn off with PWRKEY Driving the PWRKEY pin low for at least 650 ms, the module will execute power-off procedure after the PWRKEY is released.
  • Page 48 LTE Standard Module Series for 150–460 ms. Table 9: Pin Definition of RESET_N Pin Name Pin No. Description Comment RESET_N Reset the module 1.8 V power domain The recommended circuit is similar to the PWRKEY control circuit. An open drain/collector driver or button can be used to control the RESET_N.

  • Page 49: U)Sim Interface

    LTE Standard Module Series Figure 16: Reset Timing NOTE Use RESET_N only when failed to turn off the module by AT+QPOWD and PWRKEY pin. Ensure that there is no large capacitance on PWRKEY and RESET_N pins. 3.9. (U)SIM Interface The (U)SIM interface circuitry meets ETSI and IMT-2000 requirements. Both 1.8 V and 3.0 V (U)SIM cards are supported.
  • Page 50 USIM_GND Specified ground for (U)SIM card EC21 series supports (U)SIM card hot-plug via the USIM_PRESENCE pin. The function supports low level and high level detections. By default, it is disabled, and can be configured via AT+QSIMDET. See document [2] for more details about the command.
  • Page 51 LTE Standard Module Series USIM_VDD 100 nF USIM_GND (U)SIM Card Connector USIM_VDD USIM_RST Module USIM_CLK USIM_DATA 33 pF 33 pF 33 pF Figure 18: Reference Circuit of (U)SIM Interface with a 6-pin (U)SIM Card Connector To enhance the reliability and availability of the (U)SIM card in customers’ applications, please follow the criteria below in (U)SIM circuit design: ...

  • Page 52: Usb Interface

    LTE Standard Module Series 3.10. USB Interface EC21 series contains one integrated Universal Serial Bus (USB) interface which complies with the USB 2.0 specification and supports high-speed (480 Mbps) and full-speed (12 Mbps) modes. The USB interface can only serve as a slave device.

  • Page 53: Uart Interfaces

    LTE Standard Module Series A common mode choke L1 is recommended to be added in series between the module and customer’s MCU in order to suppress EMI spurious transmission. Meanwhile, the 0 Ω resistors (R3 and R4) should be added in series between the module and the test points to facilitate debugging, and the resistors are not mounted by default.
  • Page 54 LTE Standard Module Series DTE clear to send signal from DCE DTE request to send signal from 1.8 V power domain. Data terminal ready, Pulled up by default. Driving it sleep mode control low can wake up the module. If unused, keep it open. Transmit 1.8 V power domain.

  • Page 55: Pcm And I2C Interfaces

    RTS. 3.12. PCM and I2C Interfaces EC21 series provides one Pulse Code Modulation (PCM) digital interface for audio design, which supports the following modes and one I2C interface: Primary mode (short frame synchronization, works as both master and slave) ...
  • Page 56 LTE Standard Module Series EC21 series supports 16-bit linear data format. The following figures show the primary mode’s timing relationship with 8 kHz PCM_SYNC and 2048 kHz PCM_CLK, as well as the auxiliary mode’s timing relationship with 8 kHz PCM_SYNC and 256 kHz PCM_CLK.
  • Page 57 NOTE It is recommended to reserve an RC (R = 22 Ω, C = 22 pF) circuits on the PCM lines, especially for PCM_CLK. EC21 series only works as a master device pertaining to I2C interface. EC21_Series_Hardware_Design 56 / 118...

  • Page 58: Sd Card Interface

    LTE Standard Module Series 3.13. SD Card Interface EC21 series module supports SDIO 3.0 interface for SD card. The following table shows the pin definition of SD card interface. Table 15: Pin Definition of SD Card Interface Pin Name Pin No.

  • Page 59: Interfaces For Wlan & Bluetooth Applications

    27 mm, so the exterior total trace length should be less than 23 mm. 3.14. Interfaces for WLAN & Bluetooth Applications EC21 series supports a low-power SDIO 3.0 interface for WLAN and UART/PCM interfaces for Bluetooth function.
  • Page 60 1.8 V power domain. If unused, keep them open. PCM_OUT PCM data output The PCM function of pins 24–27 can be used for audio design on EC21 series module and Bluetooth function on FC20 series/FC21 modules. EC21_Series_Hardware_Design 59 / 118...
  • Page 61 Serve as input signal in slave mode. If unused, keep them open. The following figure shows a reference design of interfaces for WLAN and Bluetooth application with Quectel FC20 series/FC21 modules. Figure 26: Reference Design of WLAN & Bluetooth Applications Interfaces with FC20 Series/FC21 NOTE...

  • Page 62: Wlan Application Interface

    For more information about interfaces for WLAN and Bluetooth applications, see document [6]. 3.14.1. WLAN Application Interface EC21 series provides a low power SDIO 3.0 interface and a control interface for WLAN design. SDIO interface supports the SDR mode, and the maximum frequency is up to 50 MHz.

  • Page 63: Sgmii Interface

    It is recommended to use a resistor divider circuit for ADC application. 3.16. SGMII Interface EC21 series module includes an integrated Ethernet MAC with an SGMII interface and two management interfaces. The key features of the SGMII interface are shown below: IEEE802.3 compliant...
  • Page 64 LTE Standard Module Series Table 19: Pin Definition of SGMII Interface Pin Name Description Comment Control Signal Interface EPHY_RST_N Ethernet PHY reset EPHY_INT_N Ethernet PHY interrupt 1.8/2.85 V power domain. If unused, keep them open. SGMII_MDATA SGMII MDIO data SGMII_MCLK SGMII MDIO clock Configurable power supply.

  • Page 65: Network Status Indication

    LTE Standard Module Series Figure 28: Reference Design of SGMII Interface with PHY AR8033 Application To enhance the reliability and availability in customers’ applications, please follow the criteria below in the Ethernet PHY circuit design:  Keep SGMII data and control signals away from other sensitive circuits/signals such as RF circuits, analog signals, etc., as well as noisy signals such as clock signals, DC-DC signals, etc.
  • Page 66 LTE Standard Module Series Table 20: Pin Definition of Network Connection Status/Activity Indicator Pin Name Description Comment 1.8 V power domain. Indicate the module’s network NET_MODE Cannot be pulled up before startup. registration mode If unused, keep it open. Indicate the module’s network 1.8 V power domain NET_STATUS activity status...

  • Page 67: Status

    LTE Standard Module Series 3.18. STATUS The STATUS pin is an open drain output for indicating the module’s operation status. It can be connected to a GPIO of DTE with a pull-up resistor, or as LED indication circuit as below. When the module is turned on normally, the STATUS will present the low state.

  • Page 68: Usb_Boot Interface

    The RI behavior can be changed by AT+QCFG="urc/ri/ring". See document [2] for details. 3.20. USB_BOOT Interface EC21 series provides a USB_BOOT pin. Customers can pull up USB_BOOT to 1.8 V before VDD_EXT is powered up, and the module will enter emergency download mode when it is powered on. In this mode, the module supports firmware upgrade over USB interface.
  • Page 69 LTE Standard Module Series The following figure shows a reference circuit of USB_BOOT interface. Module VDD_EXT Test points 4.7K USB_BOOT Close to test points Figure 31: Reference Circuit of USB_BOOT Interface Figure 32: Timing Sequence for Entering Emergency Download Mode NOTE Make sure that VBAT is stable before pulling down PWRKEY pin.

  • Page 70: Rf Specifications

    LTE Standard Module Series RF Specifications EC21 series antenna interfaces include a main antenna interface, an Rx-diversity antenna interface which is used to resist the fall of signals caused by high-speed movement and multipath effect, and a GNSS antenna interface. The impedance of antenna ports is 50 Ω.
  • Page 71 LTE Standard Module Series WCDMA B2 1850–1910 1930–1990 WCDMA B4 1710–1755 2110–2155 WCDMA B5 824–849 869–894 WCDMA B8 880–915 925–960 LTE-FDD B1 1920–1980 2110–2170 LTE-FDD B2 1850–1910 1930–1990 LTE-FDD B3 1710–1785 1805–1880 LTE-FDD B4 1710–1755 2110–2155 LTE-FDD B5 824–849 869–894 LTE-FDD B7 2500–2570 2620–2690...

  • Page 72: Tx Power

    In GPRS 4 slots TX mode, the maximum output power is reduced by 3.0 dB. The design conforms to the GSM specification as described in Chapter 13.16 of 3GPP TS 51.010-1. 4.1.4. Rx Sensitivity The following tables show the conducted RF receiving sensitivity of EC21 series module. Table 28: EC21-E Conducted RF Receiving Sensitivity Receiving Sensitivity (Typ.)
  • Page 73 LTE Standard Module Series DCS1800 -109.0 dBm -102.0 dBm WCDMA B1 -110.5 dBm -106.7 dBm WCDMA B5 -110.5 dBm -104.7 dBm WCDMA B8 -110.5 dBm -103.7 dBm LTE-FDD B1 (10 MHz) -98.0 dBm -98.0 dBm -101.5 dBm -96.3 dBm LTE-FDD B3 (10 MHz) -96.5 dBm -98.5 dBm -101.5 dBm...
  • Page 74 LTE Standard Module Series LTE-FDD B13 (10 MHz) -97.7 dBm -97.0 dBm -100.0 dBm -93.3 dBm Table 31: EC21-AU Conducted RF Receiving Sensitivity Receiving Sensitivity (Typ.) Frequency Bands 3GPP (SIMO) Primary Diversity SIMO GSM850 -109.0 dBm -102.0 dBm EGSM900 -109.0 dBm -102.0 dBm DCS1800 -109.0 dBm...
  • Page 75 LTE Standard Module Series Table 32: EC21-EU Conducted RF Receiving Sensitivity Receiving Sensitivity (Typ.) Frequency Bands 3GPP (SIMO) Primary Diversity SIMO EGSM900 -109.0 dBm -102.0 dBm DCS1800 -109.0 dBm -102.0 dBm WCDMA B1 -110.5 dBm -106.7 dBm WCDMA B8 -110.5 dBm -103.7 dBm LTE-FDD B1 (10 MHz) -98.2 dBm...
  • Page 76 LTE Standard Module Series Table 34: EC21-J Conducted RF Receiving Sensitivity Receiving Sensitivity (Typ.) Frequency Bands 3GPP (SIMO) Primary Diversity SIMO LTE-FDD B1 (10 MHz) -97.5 dBm -98.7 dBm -100.2 dBm -96.3 dBm LTE-FDD B3 (10 MHz) -96.5 dBm -97.1 dBm -100.5 dBm -93.3 dBm LTE-FDD B8 (10 MHz)
  • Page 77 LTE Standard Module Series PCS1900 -109.0 dBm -102.0 dBm WCDMA B1 -110.0 dBm -109.5 dBm -112 dBm -106.7 dBm WCDMA B2 -110.5 dBm -104.7 dBm WCDMA B4 -110.0 dBm -110 dBm -112 dBm -104.7 dBm WCDMA B5 -111.0 dBm -112 dBm -113 dBm -104.7 dBm WCDMA B8...

  • Page 78: Reference Design

    LTE Standard Module Series LTE-FDD B7 (10 MHz) -97.0 dBm -96.0 dBm -99.5 dBm -94.3 dBm LTE-FDD B8 (10 MHz) -98.5 dBm -97.0 dBm -101.0 dBm -93.3 dBm LTE-FDD B20 (10 MHz) -97.5 dBm -99.0 dBm -100.5 dBm -93.3 dBm LTE-FDD B28 (10 MHz) -98.0 dBm -98.7 dBm...

  • Page 79: Gnss

    EC21 series supports standard NMEA-0183 protocol, and outputs NMEA sentences at 1 Hz data update rate via USB interface by default. By default, EC21 series GNSS engine is switched off. It has to be switched on via AT command. For more details about GNSS engine technology and configurations, see document [5].

  • Page 80: Gnss Performance

    LTE Standard Module Series 4.2.2. GNSS Performance The following table shows the GNSS performance of EC21 series. Table 40: GNSS Performance Parameter Description Conditions Typ. Unit Cold start Autonomous -146 Sensitivity Reacquisition Autonomous -157 (GNSS) Tracking Autonomous -157 Autonomous Cold start...

  • Page 81: Reference Design

    LTE Standard Module Series 4.2.3. Reference Design A reference design of GNSS antenna is shown as below. Figure 34: Reference Circuit of GNSS Antenna NOTE An external LDO can be selected to supply power according to the active antenna requirement. If the module is designed with a passive antenna, then the VDD circuit is not needed.
  • Page 82 LTE Standard Module Series traces and grounds (S). Microstrip or coplanar waveguide is typically used in RF layout to control characteristic impedance. The following are reference designs of microstrip or coplanar waveguide with different PCB structures. Figure 35: Microstrip Design on a 2-layer PCB Figure 36: Coplanar Waveguide Design on a 2-layer PCB Figure 37: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) EC21_Series_Hardware_Design...
  • Page 83 LTE Standard Module Series Figure 38: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) To ensure RF performance and reliability, follow the principles below in RF layout design: Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to ...

  • Page 84: Antenna Design Requirements

    LTE Standard Module Series 4.4. Antenna Design Requirements The following table shows the requirements on main antenna, Rx-diversity antenna and GNSS antenna. Table 41: Antenna Requirements Type Requirements Frequency range: 1559–1609 MHz Polarization: RHCP or linear VSWR: < 2 (Typ.) GNSS Passive antenna gain: >...
  • Page 85 LTE Standard Module Series Figure 39: Dimensions of the U.FL-R-SMT Connector (Unit: mm) U.FL-LP serial connectors listed in the following figure can be used to match the U.FL-R-SMT. Figure 40: Mechanicals of U.FL-LP Connectors The following figure describes the space factor of mated connector. EC21_Series_Hardware_Design 84 / 118...
  • Page 86 LTE Standard Module Series Figure 41: Space Factor of Mated Connector (Unit: mm) For more details, please visit http://www.hirose.com. EC21_Series_Hardware_Design 85 / 118...

  • Page 87: Electrical Characteristic And Reliability

    LTE Standard Module Series Electrical Characteristic and Reliability 5.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table. Table 42: Absolute Maximum Ratings Parameter Min.

  • Page 88: Power Supply Ratings

    LTE Standard Module Series 5.2. Power Supply Ratings Table 43: Power Supply Ratings Parameter Description Conditions Min. Typ. Max. Unit The actual input voltages must be kept between the VBAT_BB and VBAT_RF minimum and maximum VBAT values. Voltage drop during burst Maximum power control transmission level on EGSM900...

  • Page 89: Power Consumption

    LTE Standard Module Series 5.4. Power Consumption The values of current consumption are shown below. Table 45: EC21-E Current Consumption Description Conditions Typ. Unit OFF state Power down μA AT+CFUN=0 (USB disconnected) EGSM900 @ DRX = 9 (USB disconnected) DCS1800 @ DRX = 9 (USB disconnected) Sleep state WCDMA PF = 64 (USB disconnected) WCDMA PF = 128 (USB disconnected)
  • Page 90 LTE Standard Module Series DCS1800 2DL/3UL @ 28.8 dBm DCS1800 1DL/4UL @ 29.1 dBm EGSM900 4DL/1UL @ 26 dBm EGSM900 3DL/2UL @ 26 dBm EGSM900 2DL/3UL @ 25 dBm EGSM900 1DL/4UL @ 25 dBm EDGE data transfer (GNSS OFF) DCS1800 4DL/1UL @ 26 dBm DCS1800 3DL/2UL @ 25 dBm DCS1800 2DL/3UL @ 25 dBm DCS1800 1DL/4UL @ 25 dBm...
  • Page 91 LTE Standard Module Series WCDMA B5 @ 23.61 dBm WCDMA B8 @ 23.35 dBm Table 46: EC21-A Current Consumption Description Conditions Typ. Unit OFF state Power down μA AT+CFUN=0 (USB disconnected) 1.25 WCDMA PF = 64 (USB disconnected) 2.03 Sleep state WCDMA PF = 128 (USB disconnected) 1.65 LTE-FDD PF = 64 (USB disconnected)
  • Page 92 LTE Standard Module Series WCDMA B4 @ 22.91 dBm 590.0 WCDMA B5 @ 23.06 dBm 493.0 Table 47: EC21-V Current Consumption Description Conditions Typ. Unit OFF state Power down μA AT+CFUN = 0 (USB disconnected) 1.07 Sleep state LTE-FDD PF = 64 (USB disconnected) 2.85 LTE-FDD PF = 128 (USB disconnected) 2.26...
  • Page 93 LTE Standard Module Series WCDMA PF = 128 (USB disconnected) 1.34 LTE-FDD PF = 64 (USB disconnected) 2.01 LTE-FDD PF = 128 (USB disconnected) 1.41 LTE-TDD PF = 64 (USB disconnected) 2.31 LTE-TDD PF = 128 (USB disconnected) 1.68 EGSM900 @ DRX = 5 (USB disconnected) 19.8 EGSM900 @ DRX = 5 (USB connected) 29.6...
  • Page 94 LTE Standard Module Series PCS1900 4DL/1UL @ 29.73 dBm PCS1900 3DL/2UL @ 29.67 dBm 280.1 PCS1900 2DL/3UL @ 29.53 dBm PCS1900 1DL/4UL @ 29.36 dBm 490.9 EGSM900 4DL/1UL @ 26.99 dBm 146.5 EGSM900 3DL/2UL @ 26.91 dBm 245.0 EGSM900 2DL/3UL @ 26.77 dBm 341.2 EGSM900 1DL/4UL @ 26.69 dBm 439.3...
  • Page 95 LTE Standard Module Series WCDMA B5 HSUPA @ 21.2 dBm 496.2 WCDMA B8 HSDPA @ 22.14 dBm 553.2 WCDMA B8 HSUPA @ 21.78 dBm 559.7 LTE-FDD B1 @ 22.85 dBm 742.2 LTE-FDD B2 @ 22.5 dBm 770.6 LTE-FDD B3 @ 23.00 dBm 770.1 LTE-FDD B4 @ 22.7 dBm 684.3...
  • Page 96 LTE Standard Module Series GSM DRX = 9 (USB disconnected) WCDMA PF = 64 (USB disconnected) WCDMA PF = 128 (USB disconnected) LTE-FDD PF = 64 (USB disconnected) LTE-FDD PF = 128 (USB disconnected) EGSM900 @ DRX = 5 (USB disconnected) 17.6 EGSM900 @ DRX = 5 (USB connected) 27.7...
  • Page 97 LTE Standard Module Series DCS1800 2DL/3UL @ 23.46 dBm 302.8 DCS1800 1DL/4UL @ 22.19 dBm 381.7 WCDMA B1 HSDPA @ 23.26 dBm 605.0 WCDMA B1 HSUPA @ 23.09 dBm 615.3 WCDMA data transfer (GNSS OFF) WCDMA B8 HSDPA @ 23.27 dBm 544.0 WCDMA B8 HSUPA @ 22.67 dBm 536.1...
  • Page 98 LTE Standard Module Series WCDMA PF = 64 (USB disconnected) 22.0 WCDMA PF = 64 (USB connected) 32.0 Idle state (GNSS OFF) LTE-FDD PF = 64 (USB disconnected) 23.6 LTE-FDD PF = 64 (USB connected) 33.6 WCDMA B1 HSDPA @ 22.59 dBm 589.0 WCDMA data WCDMA B1 HSUPA @ 22.29 dBm...
  • Page 99 LTE Standard Module Series LTE-FDD B3 @ 22.95 dBm 778.0 LTE-FDD B8 @ 22.81 dBm 722.0 LTE-FDD B18 @ 23.15 dBm 677.0 LTE-FDD B19 @ 23.17 dBm 688.0 LTE-FDD B26 @ 23.37 dBm 723.0 Table 52: EC21-KL Current Consumption Description Conditions Typ.
  • Page 100 LTE Standard Module Series GSM DRX = 9 (USB disconnected) 1.31 WCDMA PF = 64 (USB disconnected) 2.19 WCDMA PF = 128 (USB disconnected) 1.91 LTE-FDD PF = 64 (USB disconnected) 2.74 LTE-FDD PF = 128 (USB disconnected) 2.12 LTE-TDD PF = 64 (USB disconnected) 2.68 LTE-TDD PF = 128 (USB disconnected) 2.16...
  • Page 101 LTE Standard Module Series DCS1800 2DL/3UL @ 26.05 dBm 283.0 DCS1800 1DL/4UL @ 25.14 dBm 357.0 PCS1900 4DL/1UL @ 29.39 dBm 159.7 PCS1900 3DL/2UL @ 28.06 dBm 234.6 PCS1900 2DL/3UL @ 26.01 dBm 289.0 PCS1900 1DL/4UL @ 25.20 dBm 363.9 GSM850 4DL/1UL PCL = 8 @ 26.86 dBm 169.9 GSM850 3DL/2UL PCL = 8 @ 25.76 dBm...
  • Page 102 LTE Standard Module Series WCDMA B2 HSUPA @ 22.17 dBm 542.4 WCDMA B4 HSDPA @ 23.27 dBm 491.0 WCDMA B4 HSUPA @ 23.19 dBm 504.0 WCDMA B5 HSDPA @ 23.18 dBm 480.4 WCDMA B5 HSUPA @ 22.90 dBm 490.0 WCDMA B8 HSDPA @ 22.32 dBm 504.0 WCDMA B8 HSUPA @ 22.26 dBm 528.0...
  • Page 103 LTE Standard Module Series WCDMA B8 @ 23.05 dBm 553.0 Table 54: EC21-EUX Current Consumption Description Conditions Typ. Unit OFF state Power down μA AT+CFUN=0 (USB disconnected) 1.03 AT+CFUN=0 (USB suspend) 1.27 EGSM DRX = 2 (USB disconnected) 1.89 EGSM DRX = 9 (USB disconnected) 1.30 DCS 698 DRX = 2 (USB disconnected) 1.89...
  • Page 104 LTE Standard Module Series DCS1800 2DL/3UL @ 27.56 dBm 307.0 DCS1800 1DL/4UL @ 26.39 dBm 375.5 GSM900 4DL/1UL @ 24.75 dBm 150.9 GSM900 3DL/2UL @ 24.37 dBm 269.4 GSM900 2DL/3UL @ 22.68 dBm 380.0 EDGE data GSM900 1DL/4UL @ 21.85 dBm 489.7 transfer DCS1800 4DL/1UL @ 26.02 dBm...

  • Page 105: Esd

    LTE Standard Module Series Table 55: GNSS Current Consumption of EC21 Series Module Description Conditions Typ. Unit Cold start @ Passive Antenna Searching (AT+CFUN=0) Lost state @ Passive Antenna Instrument Environment Tracking Open Sky @ Passive Antenna (AT+CFUN=0) Open Sky @ Active Antenna 5.5.
  • Page 106 Meanwhile, a thermal pad with high thermal conductivity should be used between the heatsink and module/PCB. The following shows two kinds of heatsink designs for reference and customers can choose one or both of them according to their application structure. EC21 Series Module Heatsink Heatsink Thermal Pad...
  • Page 107 LTE Standard Module Series NOTE The module offers the best performance when the internal baseband chip stays below 105 °C. When the maximum temperature of the BB chip reaches or exceeds 105 °C, the module works normal but provides reduced performance (such as RF output power, data rate, etc.). When the maximum BB chip temperature reaches or exceeds 115 °C, the module will disconnect from the network, and it will recover to network connected state after the maximum temperature falls below 115 °C.

  • Page 108: Mechanical Information

    LTE Standard Module Series Mechanical Information This chapter describes the mechanical dimensions of the module. All dimensions are measured in mm, and the dimensional tolerances are ±0.2 mm unless otherwise specified. 6.1. Mechanical Dimensions 2.4±0.2 32.0±0.15 Pin 1 Pin 1 Figure 44: Module Top and Side Dimensions EC21_Series_Hardware_Design 107 / 118...
  • Page 109 LTE Standard Module Series 32.0 ＋ /-0.15 1.90 1.30 3.85 Pin 1 1.30 5.96 0.87 1.15 2.15 4.82 1.05 4.37 2.49 3.45 Figure 45: Module Bottom Dimensions (Bottom View) NOTE The package warpage level of the module conforms to the JEITA ED-7306 standard. EC21_Series_Hardware_Design 108 / 118...

  • Page 110: Recommended Footprint

    LTE Standard Module Series 6.2. Recommended Footprint Figure 46: Recommended Footprint (Top View) NOTE The keepout area (pin 73–84) should not be designed. For easy maintenance of the module, keep about 3 mm between the module and other components on the motherboard. EC21_Series_Hardware_Design 109 / 118...

  • Page 111: Top And Bottom Views

    Figure 47: Top and Bottom Views of the Module NOTE Images above are for illustration purpose only and may differ from the actual module. For authentic appearance and label, please refer to the module received from Quectel. EC21_Series_Hardware_Design 110 / 118...

  • Page 112: Storage, Manufacturing And Packaging

    LTE Standard Module Series Storage, Manufacturing and Packaging 7.1. Storage Conditions The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below. 1. Recommended Storage Condition: The temperature should be 23 ±5 °C and the relative humidity should be 35–60 %.

  • Page 113: Manufacturing And Soldering

    LTE Standard Module Series NOTE 1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to the air is forbidden. 2. Take out the module from the package and put it on high-temperature-resistant fixtures before baking.

  • Page 114: Packaging Specifications

    2. Avoid using ultrasonic technology for module cleaning and soldering since it can damage crystals inside the module. 3. Due to the complexity of the SMT process, please contact Quectel Technical Supports in advance for any situation that you are not sure about, or any process (e.g. selective soldering) that is not mentioned in document [9].

  • Page 115: Plastic Reel

    LTE Standard Module Series Figure 49: Carrier Tape Dimension Drawing Table 58: Carrier Tape Dimension Table (Unit: mm) 0.35 32.5 29.5 20.2 1.75 7.3.2. Plastic Reel Figure 50: Plastic Reel Dimension Drawing EC21_Series_Hardware_Design 114 / 118...

  • Page 116: Packaging Process

    LTE Standard Module Series Table 59: Plastic Reel Dimension Table (Unit: mm) øD1 øD2 44.5 7.3.3. Packaging Process Place the module into the carrier tape and use the cover tape to cover it; then wind the heat-sealed carrier tape to the plastic reel and use the protective tape for protection.
  • Page 117 LTE Standard Module Series Appendix References Table 60: Related Documents Document Name [1] Quectel_UMTS&LTE_EVB_User_Guide [2] Quectel_EC2x&EG9x&EG2x-G&EM05_Series_AT_Commands_Manual [3] Quectel_EC2x&EG9x&EG2x-G&EM05_Series_QCFG_AT_Commands_Manual [4] Quectel_EC2x&EG9x_Power_Management_Application_Note [5] Quectel_EC2x&EG9x&EG2x-G&EM05_Series_GNSS_Application_Note [6] Quectel_EC21_Reference_Design [7] Quectel_RF_Layout_Application_Note [8] Quectel_LTE_Module_Thermal_Design_Guide [9] Quectel_Module_Secondary_SMT_Application_Guide Table 61: Terms and Abbreviations Abbreviation Description 3GPP 3rd Generation Partnership Project Analog-to-Digital Converter Adaptive Multi-rate Average Power Tracking...
  • Page 118 LTE Standard Module Series Coding Scheme Circuit Switched Data Clear To Send Data Communications Equipment DC-HSPA+ Dual-carrier High Speed Packet Access Digital Communication System DFOTA Delta Firmware Upgrade Over The Air Downlink Data Terminal Equipment Data Terminal Ready Discontinuous Transmission EDGE Enhanced Data Rates for GSM Evolution Enhanced Full Rate...
  • Page 119 LTE Standard Module Series Global System for Mobile Communications Half Rate HSPA High Speed Packet Access HSDPA High Speed Downlink Packet Access HSUPA High Speed Uplink Packet Access HTTP Hypertext Transfer Protocol HTTPS Hypertext Transfer Protocol Secure Input/Output Inom Nominal Current Leadless Chip Carrier (package) Low-dropout Regulator Light Emitting Diode...
  • Page 120 LTE Standard Module Series Most Significant Bit Mobile Terminated NITZ Network Identity and Time Zone / Network Informed Time Zone NMEA NMEA (National Marine Electronics Association) 0183 Interface Standard Network Time Protocol Power Amplifier Power Amplifier Module Password Authentication Protocol Printed Circuit Board Pulse Code Modulation Personal Communication System...
  • Page 121 LTE Standard Module Series Surface Acoustic Wave Software-Defined Radio SGMII Serial Gigabit Media Independent Interface Subscriber Identification Module SIMO Single Input Multiple Output Short Message Service SMTP Simple Mail Transfer Protocol SMTPS Simple Mail Transfer Protocol Secure Secure Sockets Layer Transmission Control Protocol Time Division Duplexing TDMA...
  • Page 122 LTE Standard Module Series Minimum High-level Input Voltage Maximum Low-level Input Voltage Minimum Low-level Input Voltage Absolute Maximum Input Voltage Absolute Minimum Input Voltage Maximum High-level Output Voltage Minimum High-level Output Voltage Maximum Low-level Output Voltage Minimum Low-level Output Voltage VLAN Virtual Local Area Network VSWR...

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