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Quectel EC200A Series Hardware Design

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EC200A Series
Hardware Design
LTE Standard Module Series
Version: 1.0.0
Date: 2021-11-12
Status: Preliminary

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Summary of Contents for Quectel EC200A Series

  • Page 1 EC200A Series Hardware Design LTE Standard Module Series Version: 1.0.0 Date: 2021-11-12 Status: Preliminary...
  • Page 2 LTE Standard Module Series At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters: Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai...
  • Page 3 Privacy Policy To implement module functionality, certain device data are uploaded to Quectel’s or third-party’s servers, including carriers, chipset suppliers or customer-designated servers. Quectel, strictly abiding by the relevant laws and regulations, shall retain, use, disclose or otherwise process relevant data for the purpose of performing the service only or as permitted by applicable laws.

  • Page 4: Safety Information

    Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers’ failure to comply with these precautions.

  • Page 5: About The Document

    LTE Standard Module Series About the Document Revision History Version Date Author Description Anthony LIU/ 2021-11-12 Creation of the document Kexiang ZHANG Anthony LIU/ 1.0.0 2021-11-12 Preliminary Kexiang ZHANG...

  • Page 6: Table Of Contents

    LTE Standard Module Series Contents Safety Information ............................ 3 About the Document ..........................4 Contents ..............................5 Table Index ............................... 7 Figure Index .............................. 9 Introduction ............................. 11 1.1. Special Marks ........................11 Product Overview ..........................12 2.1. Frequency Bands and Functions ..................13 2.2.
  • Page 7 LTE Standard Module Series 4.7. ADC Interface ........................48 4.8. Indication Signal ........................49 4.8.1. Network Status Indication .................... 50 4.8.2. STATUS ........................50 4.9. Behaviors of the MAIN_RI ....................51 RF Specifications ..........................53 5.1. Cellular Network ........................53 5.1.1.
  • Page 8 LTE Standard Module Series Table Index Table 1: Special Marks ..........................11 Table 2: Brief Introduction of the Module ....................12 Table 3: Wireless Network Type ......................13 Table 4: Key Features ..........................14 Table 5: I/O Parameters Definition ......................18 Table 6: Pin Description ...........................
  • Page 9 LTE Standard Module Series Table 42: Recommended Thermal Profile Parameters ................87 Table 43: Carrier Tape Dimension Table (Unit: mm) ................89 Table 44: Plastic Reel Dimension Table (Unit: mm) ................90 Table 45: Related Documents ......................... 91 Table 46: Terms and Abbreviations ......................91...
  • Page 10 LTE Standard Module Series Figure Index Figure 2: Pin Assignment (Top View) ....................... 17 Figure 3: Sleep Mode Application via UART .................... 25 Figure 4: Sleep Mode Application with USB Remote Wakeup ..............26 Figure 5: Sleep Mode Application with MAIN_RI ..................27 Figure 6: Sleep Mode Application without Suspend Function ..............
  • Page 11 LTE Standard Module Series Figure 43: Plastic Reel Dimension Drawing ..................89 Figure 44: Packaging Process......................... 90...

  • Page 12: Introduction

    LTE Standard Module Series Introduction This document defines the EC200A series module and describes its air interfaces and hardware interfaces which are connected with customers’ applications. It can help customers quickly understand interface specifications, electrical and mechanical details, as well as other related information of the module. Associated with application notes and user guides, customers can use this module to design and to set up mobile applications easily.

  • Page 13: Product Overview

    EDGE and GPRS network data connection. It also provides voice functionality for your specific applications. EC200A series contains 3 variants: EC200A-CN, EC200A-AU, and EC200A-EU. You can choose a dedicated type based on the region or operator. The following table shows the frequency bands of EC200A series module.

  • Page 14: Frequency Bands And Functions

    LTE Standard Module Series 2.1. Frequency Bands and Functions Table 3: Wireless Network Type Wireless Network EC200A-CN EC200A-AU EC200A-EU Type B1/B2/B3/B4/B5/B7/B8/ LTE-FDD B1/B3/B5/B8 B1/B3/B5/B7/B8/B20/B28 B28/B66 LTE-TDD B34/B38/B39/B40/B41 B40 B38/B40/B41 WCDMA B1/B5/B8 B1/B2/B4/B5/B8 B1/B5/B8 900/1800 MHz 850/900/1800/1900 MHz 900/1800 MHz...

  • Page 15: Key Features

    LTE Standard Module Series 2.2. Key Features Table 4: Key Features Features Details ⚫ Supply voltage: 3.4–4.5 V Power Supply ⚫ Typical supply voltage: 3.8 V ⚫ Text and PDU mode. ⚫ Point-to-point MO and MT. ⚫ SMS cell broadcast. ⚫...
  • Page 16 NET_MODE and NET_STATUS to indicate network Network Indication connectivity status. ⚫ Compliant with 3GPP TS 27.007, 3GPP TS 27.005 and AT Commands Quectel enhanced AT commands. ⚫ Rx-diversity Supports LTE Rx-diversity ⚫ Main antenna interface (ANT_MAIN) and Rx-diversity Antenna Interface antenna interface (ANT_DRX) 50 Ω...
  • Page 17 LTE Standard Module Series ⚫ Uplink coding schemes: MCS 1-9 ⚫ Max 236.8 kbps (DL)/236.8 kbps (UL) ⚫ Supports TCP/UDP/PPP/NTP/NITZ/FTP/HTTP/PING/CM UX/HTTPS/FTPS/SSL/FILE/MQTT/MMS/SMTP/SMTPS Internet Protocol Features protocols. ⚫ Supports PAP and CHAP for PPP connections ⚫ Operating temperature range : -35 to +75 °C ⚫...

  • Page 18: Pin Assignment

    LTE Standard Module Series 2.3. Pin Assignment The following figure illustrates the pin assignment of the module. WA KEUP_IN AP_REA DY RES ERVED RES ERVED RES ERVED W_DIS ABL E# RES ERVED RES ERVED NET_MODE RES ERVED RES ERVED NET_ST ATUS A N T _ M A I N VDD_EXT RES ERVED...

  • Page 19: Pin Description

    LTE Standard Module Series 2.4. Pin Description The following table shows the DC characteristics and pin descriptions. Table 5: I/O Parameters Definition Type Description Analog Input Analog Output Analog Input/Output Digital Input Digital Output Digital Input/Output Open Drain Power Input Power Output Table 6: Pin Description Power Supply...
  • Page 20 LTE Standard Module Series GPIO. If unused, keep it open. 8, 9, 10,19, 22, 36, 46, 48, 50–54, 56, 72, 85–112 Turn On/Off Pin Name Pin No. Description Comment Characteristics VBAT power PWRKEY Turn on/off the module domain. Active low. max = 0.5 V 1.8 V power domain.
  • Page 21 LTE Standard Module Series (U)SIM Interface Pin Name Pin No. Description Comment Characteristics 1.8 V (U)SIM： Either 1.8 V or Vmax = 1.9 V 3.0 V (U)SIM Vmin = 1.7 V card is (U)SIM card power USIM_VDD supported and supply 3.0 V (U)SIM：...
  • Page 22 LTE Standard Module Series SD_SDIO_DATA2 SD card SDIO bit 2 SD_SDIO_DATA3 SD card SDIO bit 3 SD card SDIO power SD_SDIO_VDD supply 1.8 V power domain. If SD_DET* SD card hot-plug detect unused, keep it open. Main UART Interface Pin Name Pin No.
  • Page 23 LTE Standard Module Series external codec. An external 1.8 I2C_SDA I2C serial data V pull-up resistor is needed. PCM Interface Pin Name Pin No. Description Comment Characteristics 1.8 V power PCM_SYNC PCM data frame sync domain. min = -0.3 V In master mode, max = 0.6 V it serves as an...

  • Page 24: Evb

    2.5. EVB In order to help customers to develop applications with the module conveniently, Quectel supplies an evaluation board (EVB), USB data cable, earphone, antenna, and other peripherals to control or to test the module. For more details, please refer to document [1].

  • Page 25: Operating Characteristics

    LTE Standard Module Series Operating Characteristics 3.1. Operating Modes The table below outlines operating modes of the module. Table 7: Overview of Operating Modes Mode Details Software is active. The module is registered on the network Idle and ready to send and receive data. Normal Operation Network connection is ongoing.

  • Page 26: Sleep Mode

    3.2. Sleep Mode In sleep mode, the module can reduce power consumption to a very low level, the following section describes power saving procedures of EC200A series module. 3.2.1. UART Application If the host communicates with module via UART interface, the following preconditions should be met to enable the module enter sleep mode.
  • Page 27 LTE Standard Module Series The host’s USB bus, which is connected with the module’s USB interface, enters Suspend state. ⚫ The following figure shows the connection between the module and the host. Host Module USB_VBUS USB_DP USB_DP USB_DM USB_DM GPIO AP_READY Figure 3: Sleep Mode Application with USB Remote Wakeup ⚫...

  • Page 28: Usb Application With Usb Suspend/Resume And Ri Function

    Sending data to EC200A series through USB will wake up the module. ⚫ When EC200A series has a URC to report, the URC will trigger the behavior of MAIN_RI pin. Please refer to Chapter 4.9 for details about MAIN_RI behavior.

  • Page 29: Airplane Mode

    LTE Standard Module Series The following figure shows the connection between the module and the host. Module Host GPIO Power USB_VBUS Switch USB_DP USB_DP USB_DM USB_DM MAIN_RI EINT AP_READY GPIO Figure 5: Sleep Mode Application without Suspend Function Turn on the power switch and supply power to USB_VBUS will wake up the module. NOTE Please pay attention to the level match shown in dotted line between the module and the host.

  • Page 30: Power Supply

    LTE Standard Module Series 3.4. Power Supply 3.4.1. Power Supply Pins The module provides four VBAT pins dedicated to the connection with the external power supply. There are two separate voltage domains for VBAT. Two VBAT_RF pins for module’s RF part ⚫...

  • Page 31: Requirements For Voltage Stability

    LTE Standard Module Series MIC29302WU DC_IN VBAT 100K 330R 4.7K 470 µF 100 nF 470 µF 100 nF VBAT_EN Figure 6: Reference Design of Power Supply ⚫ NOTE If you use the module that does not support the GSM band, a power supply capable of providing at least 2 A can be used in the design.
  • Page 32 LTE Standard Module Series structure. The width of VBAT_BB trace should be no less than 1 mm; and the width of VBAT_RF trace should be no less than 2 mm. In principle, the longer the VBAT trace is, the wider it will be. In addition, in order to ensure the stability of power source, it is suggested that a TVS diode of which reverse stand-off voltage is 4.7 V and peak pulse power is up to 2550 W should be used.

  • Page 33: Turn On

    LTE Standard Module Series 3.5. Turn On 3.5.1. Turn on the Module with PWRKEY Table 9: Pin Definition of PWRKEY Pin Name Pin No. Description Comment VBAT power domain. PWRKEY Turn on/off the module Active low. When the module is in power down mode, it can be turned on to normal mode by driving the PWRKEY pin to a low level for at least 500 ms.

  • Page 34: Turn Off

    LTE Standard Module Series The power-up scenario is illustrated in the following figure. NOTE 1 ≥ 500 ms VBAT ≤ 0.5 V PWRKEY About 5 ms VDD_EXT ≥ 100 ms. After this time, the pin can be set high level by an external circuit. USB_BOOT About 22 ms RESET_N...

  • Page 35: Turn Off The Module With Pwrkey

    LTE Standard Module Series 3.6.1. Turn off the Module with PWRKEY Driving the PWRKEY to a low-level voltage for at least 650 ms, then the module will execute power-down procedure after the PWRKEY is released. The timing of turning off the module is illustrated in the following figure.
  • Page 36 LTE Standard Module Series RESET_N signal is sensitive to interference, so it is recommended to route the trace as short as possible and surround it with ground. Table 10: Pin Definition of RESET Pin Name Pin No. Description Comment 1.8 V power domain. RESET_N Reset the module Active low after turn-on.
  • Page 37 LTE Standard Module Series VBAT ≥ 300 ms RESET_N ≤ 0.5 V Module Running Baseband restart Baseband resetting Status Figure 15: Timing of Resetting Module ⚫ NOTE Please ensure that there is no large capacitance with the max value exceeding 10 nF on PWRKEY and RESET_N pins.

  • Page 38: Application Interfaces

    Application Interfaces 4.1. USB Interface EC200A series provides one integrated Universal Serial Bus (USB) interface which complies with the USB 2.0 specification and supports full-speed (12 Mbps) and high-speed (480 Mbps) modes. The USB interface can only serve as a slave device and is used for AT command communication, data transmission, software debugging and firmware upgrade.
  • Page 39 LTE Standard Module Series It is recommended to reserve test points for debugging and firmware upgrade in your designs. The following figure shows a reference circuit of USB interface. Test Points Minimize these stubs Module NM_0 R NM_0 R ESD Array USB_VBUS USB_DM USB_DM...

  • Page 40: Usb_Boot Interface

    LTE Standard Module Series 4.2. USB_BOOT Interface The module provides a USB_BOOT pin. You can pull up USB_BOOT to VDD_EXT before powering on the module, thus the module will enter emergency download mode when powered on. In this mode, the module supports firmware upgrade over USB interface.

  • Page 41: U)Sim Interface

    LTE Standard Module Series NOTE 1 VBAT 500 ms PWRKEY 0.5V About 5 ms VDD_EXT USB_BOOT can be pulled up to 1.8 V before VDD_EXT is powered up, and the module will enter emergency download mode when it is powered on. USB_BOOT About 22 ms RESET_N...
  • Page 42 LTE Standard Module Series (U)SIM card is USIM_DATA (U)SIM card data supported and can be USIM_CLK (U)SIM card clock identified automatically by the module. USIM_RST (U)SIM card reset 1.8 V power domain. USIM_DET (U)SIM card hot-plug detect If unused, keep it open. The module supports (U)SIM card hot-plug via the USIM_DET pin, The function supports low level and high level detections.

  • Page 43: Pcm And I2C Interface

    LTE Standard Module Series USIM_VDD 100 nF USIM_GND (U)SIM Card Connector USIM_VDD USIM_RST Module USIM_CLK USIM_DATA 33 pF 33 pF 33 pF Figure 20: Reference Circuit of (U)SIM Interface with a 6-pin (U)SIM Card Connector In order to enhance the reliability and availability of the (U)SIM card in applications, please follow the criteria below in (U)SIM circuit design.
  • Page 44 LTE Standard Module Series In short frame mode, the data is sampled on the falling edge of the PCM_CLK and transmitted on the rising edge. The PCM_SYNC falling edge represents the MSB. In this mode, the PCM interface supports 256 kHz, 512 kHz, 1024, 2048 kHz PCM_CLK at 8 kHz PCM_SYNC, and also supports 4069 kHz PCM_CLK at 16 kHz PCM_SYNC.
  • Page 45 LTE Standard Module Series Used for external codec. I2C_SCL I2C serial clock An external 1.8 V pull-up I2C_SDA I2C serial data resistor is needed. Clock and mode can be configured by AT command, and the default configuration is short frame synchronization format with 2048 kHz PCM_CLK and 8 kHz PCM_SYNC.

  • Page 46: Uart Interface

    LTE Standard Module Series 4.5. UART Interface The module provides two UART interfaces: the main UART interface and the debug UART interface. The following shows their features. ⚫ The main UART interface supports 4800 bps, 9600 bps, 19200 bps, 38400 bps, 57600 bps, 115200 bps, 230400 bps, 460800 bps, 921600 bps baud rates, and the baud rate is 115200 bps by default.
  • Page 47 LTE Standard Module Series is recommended. The following figure shows a reference design. VDD_EXT VCCA VCCB VDD_MCU 0.1 μ F 0.1 μ F 120K MAIN_RI RI_MCU MAIN_DCD DCD_MCU Translator MAIN_CTS CTS_MCU MAIN_RTS RTS_MCU MAIN_DTR DTR_MCU MAIN_TXD RXD_MCU MAIN_RXD TXD_MCU Figure 23: Reference Circuit with Translator Chip Please visit http://www.ti.com for more information.

  • Page 48: Sdio Interface

    LTE Standard Module Series to the host RTS. 4.6. SDIO Interface The module provides one SD card interface which supports SD 3.0 protocol. Table 19: Pin Definition of SD Card Interface Pin Name Pin No. Description Comment SD_SDIO_CLK SD card SDIO clock SD card SDIO SD_SDIO_CMD command...

  • Page 49: Adc Interface

    LTE Standard Module Series In SD card interface design, in order to ensure good communication performance with SD card, the following design principles should be complied with: ⚫ The voltage range of SD card power supply VDD_3V is 2.7–3.6 V and a sufficient current up to 0.8 A should be provided.

  • Page 50: Indication Signal

    LTE Standard Module Series For more details about the AT command, please refer to document [2]. The resolution of the ADC is up to 12 bits. The following table describes the characteristic of the ADC interface. Table 21: Characteristics of ADC Interface Name Min.

  • Page 51: Network Status Indication

    LTE Standard Module Series 4.8.1. Network Status Indication The network indication pins can be used to drive network status indication LEDs. The module provides two network indication pins: NET_MODE and NET_STATUS. The following tables describe pin definition and logic level changes in different network status. Table 23: Working State of the Network Connection Status/Activity Indication Pin Name Status...

  • Page 52: Behaviors Of The Main_Ri

    LTE Standard Module Series turned on normally, the STATUS will present the low state. Except for this, the STATUS will present high-impedance state. The following figure shows different circuit designs of STATUS, and you can choose either one according to the application demands. VBAT VDD_MCU 33 K...
  • Page 53 LTE Standard Module Series Table 24: Behaviors of the MAIN_RI State Response Idle MAIN_RI keeps at high level MAIN_RI outputs 120 ms low pulse when a new URC returns The MAIN_RI behavior can be changed via AT+QCFG. Please refer to document [2] for details.

  • Page 54: Rf Specifications

    LTE Standard Module Series RF Specifications 5.1. Cellular Network 5.1.1. Antenna Interface & Frequency Bands The pin definition of main antenna and Rx-diversity antenna interfaces is shown below. Table 25: Pin Definition of Cellular Network Interface Pin Name Pin No. Description Comment ANT_DRX...
  • Page 55 LTE Standard Module Series – – 1920 1980 2110 2170 LTE-FDD B1 – – 1710 1785 1805 1880 LTE-FDD B3 – – LTE-FDD B5 – – LTE-FDD B8 – – 2010 2025 2010 2025 LTE-TDD B34 – – 2570 2620 2570 2620 LTE-TDD B38...
  • Page 56 LTE Standard Module Series – – 1850 1910 1930 1990 LTE FDD B2 – – 1710 1785 1805 1880 LTE-FDD B3 – – 1710 1755 2110 2155 LTE FDD B4 – – LTE-FDD B5 – – 2500 2570 2620 2690 LTE-FDD B7 –...
  • Page 57 LTE Standard Module Series – – 2300 2400 2300 2400 LTE-TDD B40 – – 2535 2675 2535 2675 LTE-TDD B41...

  • Page 58: Tx Power

    LTE Standard Module Series 5.1.2. Tx Power The following table shows the RF output power of the module. Table 29: Tx Power Frequency Max. Tx Power Comments GSM850 33 dBm ±2 dB 5 dBm ±5 dB EGSM900 33 dBm ±2 dB 5 dBm ±5 dB DCS1800 30 dBm ±2 dB...
  • Page 59 LTE Standard Module Series Table 30: Conducted RF Receiving Sensitivity of EC200A-CN 3GPP Receiving Sensitivity (Typ.) Frequency Requirement Primary Diversity SIMO (SIMO) EGSM900 -109 -102 dBm DCS1800 -107 -102 dBm WCDMA B1 -109.4 -106.7 dBm WCDMA B5 -109.7 -104.7 dBm WCDMA B8 -110.2 -103.7 dBm...
  • Page 60 LTE Standard Module Series WCDMA B2 -107.7 -104.7 dBm WCDMA B4 -109.2 -106.7 dBm WCDMA B5 -110.7 -104.7 dBm WCDMA B8 -110.2 -103.7 dBm LTE-FDD B1 -97.8 -97.8 -101 -96.3 dBm LTE FDD B2 -96.1 -97.8 -100.2 -94.3 dBm LTE-FDD B3 -96.7 -97.5 -100.9...

  • Page 61: Reference Design

    LTE Standard Module Series LTE-FDD B7 -94.4 -95.8 -94.3 dBm LTE-FDD B8 -96.7 -98.9 -100.1 -93.3 dBm LTE-FDD B20 -98.1 -99.3 -101.4 -93.3 dBm LTE-FDD B28 -98.9 -99.5 -102.6 -94.8 dBm LTE-TDD B38 -96.5 -95.2 -99.3 -96.3 dBm LTE-TDD B40 -97.3 -97.3 -100.5...

  • Page 62: Reference Design Of Rf Routing

    LTE Standard Module Series 5.2. Reference Design of RF Routing For user’s PCB, the characteristic impedance of all RF traces should be controlled to 50 Ω. The impedance of the RF traces is usually determined by the trace width (W), the materials’ dielectric constant, the height from the reference ground to the signal layer (H), and the spacing between RF traces and grounds (S).
  • Page 63 LTE Standard Module Series Figure 31: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) Figure 32: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) In order to ensure RF performance and reliability, the following principles should be complied with in RF layout design: ⚫...

  • Page 64: Requirements For Antenna Design

    LTE Standard Module Series traces on adjacent layers. For more details about RF layout, please refer to document [3]. 5.3. Requirements for Antenna Design Table 33: Requirements for Antenna Design Antenna Type Requirements VSWR: ≤ 2 Efficiency: > 30 % Gain: 1dBi Max.

  • Page 65: Rf Connector Recommendation

    LTE Standard Module Series 5.4. RF Connector Recommendation If RF connector is used for antenna connection, it is recommended to use U.FL-R-SMT connector provided by Hirose. Figure 33: Dimensions of U.FL-R-SMT Connector (Unit: mm) U.FL-LP serial connectors listed in the following figure can be used to match the U.FL-R-SMT. Figure 34: Mechanicals of U.FL-LP Connectors...
  • Page 66 LTE Standard Module Series The following figure describes the space factor of mated connector. Figure 35: Space Factor of Mated Connector (Unit: mm) For more details, please visit http://hirose.com.

  • Page 67: Electrical Characteristics And Reliability

    LTE Standard Module Series Electrical Characteristics and Reliability 6.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table. Table 34: Absolute Maximum Ratings Parameter Min.

  • Page 68: Power Supply Ratings

    LTE Standard Module Series 6.2. Power Supply Ratings Table 35: The Module’s Power Supply Ratings Parameter Description Conditions Min. Typ. Max. Unit VBAT_BB The actual input voltages must stay between the minimum and VBAT_RF maximum values. VBAT Voltage drop during Maximum power control level transmitting at EGSM 900...

  • Page 69: Power Consumption

    LTE Standard Module Series 6.3. Power Consumption Table 36: The Module Power Consumption EC200A-CN Description Conditions Typ. Unit OFF state Power down AT+CFUN=0 (USB disconnected) 0.86 EGSM900 @ DRX = 2 (USB disconnected) 1.71 EGSM900 @ DRX = 5 (USB disconnected) 1.27 EGSM900 @ DRX = 5 (USB suspend) 1.43...
  • Page 70 LTE Standard Module Series LTE-FDD @ PF = 256 (USB disconnected) 1.06 LTE-TDD @ PF = 32 (USB disconnected) 2.09 LTE-TDD @ PF = 64 (USB disconnected) 1.48 LTE-TDD @ PF = 64 (USB suspend) 1.64 LTE-TDD @ PF = 128 (USB disconnected) 1.20 LTE-TDD @ PF = 256 (USB disconnected) 1.06...
  • Page 71 LTE Standard Module Series EGSM900 1DL/4UL @ 22.87 dBm 359.2 DCS1800 4DL/1UL @ 25.66 dBm 119.4 DCS1800 3DL/2UL @ 25.50 dBm 214.1 DCS1800 2DL/3UL @ 23.95 dBm 289.1 DCS1800 1DL/4UL @ 21.93 dBm 344.8 WCDMA B1 HSDPA @ 22.06 dBm 511.97 WCDMA B5 HSDPA @ 21.68 dBm 443.02...
  • Page 72 LTE Standard Module Series DCS1800 PCL = 15 @ -0.43 dBm 46.8 WCDMA B1 @ 22.77 dBm 557.69 WCDMA voice call WCDMA B5 @ 22.42 dBm 483.34 WCDMA B8 @ 22.43 dBm 529.50 EC200A-AU Description Conditions Typ. Unit OFF state Power down AT+CFUN=0 (USB disconnected) 0.95...
  • Page 73 LTE Standard Module Series LTE-FDD @ PF = 256 (USB disconnected) LTE-TDD @ PF = 32 (USB disconnected) LTE-TDD @ PF = 64 (USB disconnected) LTE-TDD @ PF = 64 (USB suspend) LTE-TDD @ PF = 128 (USB disconnected) LTE-TDD @ PF = 256 (USB disconnected) EGSM900 @ DRX = 5 (USB disconnected) 62.62 EGSM900 @ DRX = 5 (USB connected)
  • Page 74 LTE Standard Module Series DCS1800 1DL/4UL @ 25.85 dBm PCS1900 4DL/1UL @ 27.61 dBm PCS1900 3DL/2UL @ 27.33 dBm PCS1900 2DL/3UL @ 27.17 dBm PCS1900 1DL/4UL @ 26.20 dBm GSM850 4DL/1UL @ 26.38 dBm GSM850 3DL/2UL @ 24.64 dBm GSM850 2DL/3UL @ 22.53 dBm GSM850 1DL/4UL @ 20.50 dBm EGSM900 4DL/1UL @ 26.74 dBm EGSM900 3DL/2UL @ 24.71 dBm...
  • Page 75 LTE Standard Module Series WCDMA B8 HSDPA @ 21.64 dBm WCDMA B1 HSUPA @ 21.99 dBm WCDMA B2 HSUPA @ 21.61 dBm WCDMA B4 HSUPA @ 20.68 dBm WCDMA B5 HSUPA @ 21.42 dBm WCDMA B8 HSUPA @ 21.45 dBm LTE-FDD B1 @ 22.88 dBm LTE-FDD B3 @ 23.63 dBm LTE-FDD B5 @ 22.82 dBm...
  • Page 76 LTE Standard Module Series WCDMA B8 @ 22.61 dBm EC200A-EU Description Conditions Typ. Unit OFF state Power down AT+CFUN=0 (USB disconnected) 0.78 EGSM900 @ DRX = 2 (USB disconnected) 1.50 EGSM900 @ DRX = 5 (USB disconnected) 1.12 EGSM900 @ DRX = 5 (USB suspend) 1.28 EGSM900 @ DRX = 9 (USB disconnected) 1.01...
  • Page 77 LTE Standard Module Series LTE-TDD @ PF = 64 (USB suspend) 1.45 LTE-TDD @ PF = 128 (USB disconnected) 1.02 LTE-TDD @ PF = 256 (USB disconnected) 0.90 EGSM900 @ DRX = 5 (USB disconnected) 18.06 EGSM900 @ DRX = 5 (USB connected) 32.65 WCDMA @ PF = 64 (USB disconnected) 18.57...
  • Page 78 LTE Standard Module Series DCS1800 2DL/3UL @ 24.24 dBm DCS1800 1DL/4UL @ 22.10 dBm WCDMA B1 HSDPA @ 21.99 dBm WCDMA B5 HSDPA @ 21.76 dBm WCDMA B8 HSDPA @ 21.81 dBm WCDMA data transfer WCDMA B1 HSUPA @ 21.21 dBm WCDMA B5 HSUPA @ 21.13 dBm WCDMA B8 HSUPA @ 21.49 dBm LTE-FDD B1 @ 23.61 dBm...

  • Page 79: Digital I/O Characteristic

    LTE Standard Module Series WCDMA voice call WCDMA B5 @ 22.26 dBm WCDMA B8 @ 22.25 dBm 6.4. Digital I/O Characteristic Table 37: 1.8 V I/O Requirements Parameter Description Min. Max. Unit Input high voltage Input low voltage -0.3 Output high voltage 1.35 Output low voltage -0.3...

  • Page 80: Esd

    LTE Standard Module Series Input low voltage -0.3 Output high voltage 2.55 Output low voltage -0.3 0.45 6.5. ESD If the static electricity generated by various ways discharges to the module, the module maybe damaged to a certain extent. Thus, please take proper ESD countermeasures and handling methods. For example, wearing anti-static gloves during the development, production, assembly and testing of the module;...

  • Page 81: Operating And Storage Temperatures

    LTE Standard Module Series 6.6. Operating and Storage Temperatures Table 41: Operating and Storage Temperatures Parameter Min. Typ. Max. Unit Operating Temperature Range °C Extended Operating Temperature °C Range Storage temperature range °C Within operating temperature range, the module is 3GPP compliant. Within the extended temperature range, the module remains the ability to establish and maintain functions such as voice, SMS, data transmission, etc., without any unrecoverable malfunction.

  • Page 82: Mechanical Information

    LTE Standard Module Series Mechanical Information This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter (mm), and the dimensional tolerances are ±0.2 mm unless otherwise specified. 7.1. Mechanical Dimensions Figure 36: Module Top and Side Dimensions (Unit: mm)
  • Page 83 LTE Standard Module Series Figure 37: Module Bottom Dimensions View (Unit: mm) ⚫ NOTE The flatness of EC200A series module of Remote Communication meets the requirements of JEITA ED-7306 standard.

  • Page 84: Recommended Footprint

    LTE Standard Module Series 7.2. Recommended Footprint Figure 38: Recommended Footprint (Bottom View) NOTE For convenient maintenance of the module, please keep about 3 mm between the module and other components on the host PCB.

  • Page 85: Top And Bottom Views

    LTE Standard Module Series 7.3. Top and Bottom Views Figure 39: Top and Bottom View of the Module NOTE These are renderings of the module. For authentic appearance, please refer to the module that you receive from Quectel.

  • Page 86: Storage, Manufacturing And Packaging

    LTE Standard Module Series Storage, Manufacturing and Packaging 8.1. Storage Conditions The module is provided with vacuum-sealed package. MSL of the module is rated as 3, and its storage restrictions are shown as below. 1. Recommended Storage Condition: The temperature should be 23 ±5 °C and the relative humidity should be 35–60 %.
  • Page 87 LTE Standard Module Series put in a dry environment such as in a drying oven. NOTE 1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to the air is forbidden. 2. Take out the module from the package and put it on high-temperature-resistant fixtures before baking.

  • Page 88: Manufacturing And Soldering

    LTE Standard Module Series 8.2. Manufacturing and Soldering Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. The force on the squeegee should be adjusted properly to produce a clean stencil surface on a single pass.

  • Page 89: Packaging Specifications

    Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the module. Due to the complexity of the SMT process, please contact Quectel Technical Supports in advance for any situation that you are not sure about, or any process (e.g. selective soldering, ultrasonic soldering) that is not mentioned in document [4].

  • Page 90: Plastic Reel

    LTE Standard Module Series Figure 41: Carrier Tape Dimension Drawing Table 43: Carrier Tape Dimension Table (Unit: mm) 0.35 32.5 29.5 20.2 1.75 8.3.2. Plastic Reel Figure 42: Plastic Reel Dimension Drawing...

  • Page 91: Packaging Process

    LTE Standard Module Series Table 44: Plastic Reel Dimension Table (Unit: mm) øD1 øD2 44.5 8.3.3. Packaging Process Place the module into the carrier tape and use the cover tape to cover them; then wind the heat-sealed carrier tape to the plastic reel and use the protective tape for protection.

  • Page 92: Appendix References

    LTE Standard Module Series Appendix References Table 45: Related Documents Document Name [1] Quectel_UMTS&LTE_EVB_User_Guide [2] Quectel_EC200x&EG912Y_Series_AT_Commands_Manual [3] Quectel_RF_Layout_Application_Note [4] Quectel_Module_Secondary_SMT_Application_Note Table 46: Terms and Abbreviations Abbreviation Description Adaptive Multi-Rate BeiDou BeiDou Navigation Satellite System Bytes per second CDMA Code Division Multiple Access Coding Scheme Clear To Send Discontinuous Reception...
  • Page 93 LTE Standard Module Series Evaluation Board Frequency Division Duplexing Full Rate File Transfer Protocol FTPS FTP over SSL GMSK Gaussian Filtered Minimum Shift Keying Ground GNSS Global Navigation Satellite System Global Positioning System Global System for Mobile Communications Half Rate HSDPA High Speed Downlink Packet Access HTTPS...
  • Page 94 LTE Standard Module Series QPSK Quadrature Phase Shift Keying Radio Frequency RoHS Restriction of Hazardous Substances Request To Send SDIO Secure Digital Input and Output Card Short Message Service SMTP Simple Mail Transfer Protocol SMTPS Simple Mail Transfer Protocol Secure Secure Sockets Layer Transmission Control Protocol Time Division Duplexing...

  • Page 95: Warnings Sentences

    LTE Standard Module Series WCDMA Wideband Code Division Multiple Access Warnings sentences This module is limited to OEM installation ONLY. This module is limited to installation in mobile or fixed applications, according to Part 2.1091(b). The separate approval is required for all other operating configurations, including portable configurations with respect to Part 2.1093 and different antenna configurations For FCC Part 15.31 (h) and (k): The host manufacturer is responsible for...
  • Page 96 LTE Standard Module Series In the event that these conditions cannot be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization.
  • Page 97 LTE Standard Module Series technician for help. Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. To comply with FCC regulations limiting both maximum RF output power and human exposure to RF radiation,maximum antenna gain (including cable loss)must not exceed: SM850/WCDMA Band5/LTE Band 5:≤...

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