Mounting; Achieving Equipotential Bonding Acc. To The Grounding Plan - Binder VDL Series Operating Manual

Vacuum drying oven with microprocessor program controller mb2
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The following steps 6.4.1 to 6.4.3 are described in detail in the mounting instructions Art. no. 7001-0137.
Please proceed accordingly.

6.4.1 Mounting

• Placing the vacuum drying oven on the vacuum module
• Mounting the connecting plate
• Installing the suction line: Hose connection at the VDL vacuum connection (11) and fixing the hose at
the housing rear
• Installing the condensate collecting tray
Inappropriate execution of the connections can lead to the risk of explosion.
Danger of ignition and explosion by inappropriate installation.
Serious injury or death from burns and / or explosion pressure.
 It is obligatory to follow the instructions of the mounting instructions Art. no. 7001-0137
regarding correct installation.
 Observe the safety advice as in chap. 1.7.2.

6.4.2 Achieving equipotential bonding acc. to the grounding plan

• The conductive connection between the VDL and the pump module is established by mounting the
connecting plate.
• To establish a conductive connection between the vacuum pump and the pump module a grounding
cable is supplied, which is already fixed at the pump module. It will be connected to the pump.
• To establish a conductive connection between the condensate collecting tray and the pump module
the front edge of the tray is screwed on the front of the vacuum module
• To establish a conductive connection between the pump module and the conductive surface of the
installation site a grounding cable is supplied with the pump module. It is screwed on the fixation
screw fitting for grounding of the pump module and connected to the conductive surface of the installa-
tion site.
Explosion hazard due to electric sparking due to missing or improperly implement-
ed equipotential bonding.
Serious injury or death from burns and / or explosion pressure.
 Connect all elements in the installation and loading area (VDL / pump module / pump)
with the conductive surface and/or with each other. Proceed according to the grounding
plan in chap. 6.8.
 For installation of the pump module proceed acc. to the mounting instructions of the
pump module (Art. no. 7001-0137).
 Before commissioning, measure the equipotential bonding after first setting up the VDL
and implementing all described measures for establishing the equipotential bonding
 Provide cyclic measurements of the equipotential bonding.
VDL (E3.1) 06/2020
DANGER
DANGER
Page 61/206

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