Achieving Equipotential Bonding / Grounding Concept; Figure 18: Possibilities Of Grounding (Schematic Representation) - Binder VDL Series Operating Manual

6.8

Achieving equipotential bonding / Grounding concept

For systems in potentially explosive areas, equipotential bonding acc. to IEC 60079-14 is required. All
electrically conductive parts must be connected to the equipotential bonding system. Connections to the
equipotential bonding system must be secured against automatic loosening.
Grounding, i.e. achieving equipotential bonding is required as solvent vapors may be present during load-
ing and / or unloading. Also when removing the filled condensate catchpot from the pump solvents may
accidentally be spilled. Therefore, the accessible surface of the installation and loading area must be
conductive, there must be technical ventilation, and all equipment (VDL / pump module
pumpmust be connected to the conductive surface or to each other according to the grounding concept.
The personal protective equipment (PPE) of the operating personnel must be implemented ESD protect-
ed.
VDL
S
Installation without pump module

Figure 18: Possibilities of grounding (schematic representation)

VDL Vacuum drying oven
M Pump module
S Walkable installation and operating surface with conductive surface
P Vacuum pump
A Equipotential bonding between the VDL and the conductive surface of the installation and loading
area via grounding cable
B Equipotential bonding between the VDL and the pump module via connecting plate
C Equipotential bonding between the vacuum pump and the pump module via grounding cable
D Equipotential bonding between the pump module and the conductive surface of the installation and
loading area via grounding cable
E Equipotential bonding between the condensate collecting tray and the pump module via screws
VDL (E3.1) 06/2020
VDL
M
P
S
Installation with pump module
/ vacuum
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