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Thermal Solutions
5.2
Assembly
Figure 5-2.
1U Reference Heatsink Assembly
The assembly process for the 1U reference heatsink begins with application of
Honeywell PCM45F thermal interface material to improve conduction from the IHS.
Tape and roll format is recommended. Pad size is 35 x 35 mm, thickness is 0.25 mm.
Next, position the heatsink such that the heatsink fins are parallel to system airflow.
While lowering the heatsink onto the IHS, align the four captive screws of the heatsink
to the four threaded nuts of the back plate.
Using a #2 Phillips driver, torque the four captive screws to 8 inch-pounds. Fastener
sequencing, in other words starting the threads on all four screws before torquing, may
mitigate against cross threading.
This assembly process is designed to produce a static load of 39 - 51 lbf, for 0.062" -
0.100" board thickness respectively. Honeywell PCM45F is expected to meet the
performance targets in
Heatsink Static Compressive Load of 0 - 60 lbf allows for designs that vary from the 1U
reference heatsink. Example: A customer's unique heatsink with very little static load
(as little as 0 lbf) is acceptable from a socket loading perspective as long as the
thermal specifications are met.
Compliance to Board Keepout Zones in
assembly process.
Intel® Xeon® Processor E5-2400 Product Family
Thermal/Mechanical Design Guide
Table 5-1
and
Table 5-2
Appendix A
from 30 - 60 lbf. From
is assumed for this
Table
4-3, the
35
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