Board Internal Thermal Monitoring; Processor Thermal Monitoring; Digital Thermal Sensor (Dts); Adaptive Thermal Monitor - Kontron CP3002 User Manual

CP3002
6. Thermal Considerations
The following chapters provide system integrators with the necessary information to satisfy
thermal and airflow requirements when implementing CP3002 applications.
6.1

Board Internal Thermal Monitoring

To ensure optimal operation and long-term reliability of the CP3002, all onboard components
must remain within the maximum temperature specifications. The most critical component on
the CP3002 is the processor. Operating the CP3002 above the maximum operating limits will
result in permanent damage to the board.
The board includes three integrated temperature sensors to measure the processor and the
chipset temperature:
• Two thermal sensors integrated in the processor
• One thermal sensor integrated in the chipset
6.2

Processor Thermal Monitoring

To allow optimal operation and long-term reliability of the CP3002, the Intel® processor must
remain within the maximum die temperature specifications. The maximum die temperature for
the Intel® multi-chip package processors is as follows:
• Processor die:
• Graphics and memory controller die:
The Intel® processor uses the Adaptive Thermal Monitor feature to protect the processor from
overheating and includes the following on-die temperature sensors:
• Two Digital Thermal Sensors (DTS) for the processor cores
• One Digital Thermal Sensor (DTS) for the graphics controller and the memory controller
• Catastrophic Cooling Failure Sensor (THERMTRIP#)
These sensors are integrated in the processor and work without any interoperability of the uEFI
BIOS or the software application. Enabling the Thermal Control Circuit in the uEFI BIOS allows
the processor to maintain a safe operating temperature without the need for special software
drivers or interrupt handling routines.
6.2.1

Digital Thermal Sensor (DTS)

The Intel® processor includes three on-die Digital Thermal Sensors (DTS), two for the proces-
sor cores and one for the graphics controller and the memory controller. They can be read via
an internal register of the processor. The temperature returned by the Digital Thermal Sensor
will always be at or below the maximum operating temperature. Via the Digital Thermal Sen-
sors, the uEFI BIOS or the application software can measure the processor die temperature.
6.2.2

Adaptive Thermal Monitor

The Adaptive Thermal Monitor feature reduces the processor power consumption and the tem-
perature when the processor silicon exceeds the Thermal Control Circuit (TCC) activation tem-
perature until the processor operates at or below its maximum operating temperature. The
temperature at which the Adaptive Thermal Monitor activates the Thermal Control Circuit is not
user-configurable.
ID 1042-9252, Rev. 2.0
Thermal Considerations
105°C
100°C
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