Cooling Solution - Congatec conga-IA5 User Manual

Thin mini-itx sbc

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Cooling Solution

The conga-IA5 SBC offers Ultra Low Power boards with high computing performance and outstanding graphics. Due to its low power

consumption, the SBC generates less heat and therefore requires less active cooling, allowing the use of quieter, lower profile coolers that are

better suited to small form factor systems.

Nonetheless, all electronics contain semiconductor devices which have operating temperature ranges that should be adhered to. This means

that for reliable operation, the thermal design of the conga-IA5 must be carefully considered. For this reason, it is imperative to provide

sufficient air flow to each of the components, to ensure the specified operating temperature of the conga-IA5 is maintained.

congatec AG offers two cooling options for the conga-IA5:

• A congatec passive cooling solution for open die Celeron

(PN: 052831 — conga-IA5/i-CSP) variants in combination with the conga-IA5 retention frame (PN: 052254 — conga-IC87/Retention Frame).

The CSP complies with the Thin Mini-ITX height specification and features a Hi-Flow 225UT pressure sensitive, phase change thermal

interface. Refer to section 4.2 "CSP Dimensions" for the dimensions of the congatec heatspreaders.

• The use of a custom cooling solution in combination with the conga-IA5 retention frame (PN: 052254 — conga-IC87/Retention Frame).

Passive Cooling Solution

Note

When a passive cooling is used, the end user must ensure that adequate air flow is maintained.

See section 1.2.2 "Optional Accessories" for the part numbers of the cooling accessories.

and Pentium

(PN: 052830 — conga-IA5/CSP) or lidded die Atom™

Retention Frame

IA50m01

19/59

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